JP3003332B2 - Semiconductor substrate immersion processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus used in a chemical immersion process in a semiconductor manufacturing process.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 4, a semiconductor substrate immersion processing apparatus of this kind includes a plurality of chemical solution tanks 11 and a washing tank 1.
2 and one drying unit 13 are horizontally arranged on a straight line.

A carrier 7 accommodating a plurality of semiconductor substrates (hereinafter, referred to as wafers) is set in a loader section, the carrier 7 is chucked by a transfer robot 10, immersion processing is sequentially performed in each mode, and a drying section 13 is performed. The carrier 7 was transported to the unloader section to process the wafer.

[0004]

In the conventional apparatus, the chemical solution tank, the washing tank, and the drying unit are horizontally arranged in a straight line. Therefore, an apparatus in a process requiring a plurality of chemical solutions is large in size. It was a problem in layout.

An object of the present invention is to provide a semiconductor substrate immersion apparatus having a compact apparatus size.

[0006]

In order to achieve the above object, a semiconductor substrate immersion apparatus according to the present invention has an outermost tank, an intermediate tank, a chemical treatment tank, and a washing section, The outermost tank contains an intermediate tank, a chemical treatment tank, and a water washing unit integrally.
The intermediate tank has a lid for accommodating the chemical processing tank therein and opening and closing the opening of the tank. The chemical processing tank receives the semiconductor substrate with the lid of the intermediate tank opened, and processes the substrate. The rinsing section is for rinsing the semiconductor substrate lifted from the chemical processing tank.

Further, the outermost tank has a drying section for drying the semiconductor substrate washed with water in the washing section.

Further, the semiconductor substrate immersion apparatus is a single unit, a plurality of the units are connected, and a plurality of chemical treatments are performed by one facility.

[0009]

The present invention has a structure in which a mechanism for performing immersion processing and a mechanism for performing water washing are integrally incorporated.

[0010]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.

(Embodiment 1) FIG. 1 is a sectional view showing Embodiment 1 of the present invention.

In FIG. 1, an intermediate layer 2 is installed in an outermost tank 4, and a chemical treatment tank 1 is installed in the intermediate layer 2.

A cover 3 for opening and closing the upper opening of the intermediate layer 2 is attached to the intermediate layer 2.

On the inner side wall of the outermost tank 4, a semiconductor substrate (wafer) in a carrier 7 carried in the information of the intermediate layer 2 is provided.
A plurality of rinsing nozzles 5 for rinsing water 6 are provided.

Next, the operation will be described.

First, the lid 3 is opened, and the carrier 7 containing a plurality of wafers 6 is held by the chuck 8 and moved into the chemical processing tank 1. The immersion treatment is performed for a predetermined time, and the carrier 7 is pulled up.

Next, the lid 3 is closed, pure water is discharged from the washing nozzle 5 to the carrier 7, and washing is performed. After that, the carrier 7 is transported to a drying unit (not shown).

(Embodiment 2) FIG. 2 is a sectional view showing Embodiment 2 of the present invention.

In this embodiment, a plurality of N ₂ nozzles are added to the inner wall of the outermost tank 4, and heated N ₂ is sprayed on the washed wafer 6 to be dried.

In this embodiment, the provision of the drying function has the effect of reducing the size of the apparatus.

In FIG. 3, the unit having the structure shown in the second embodiment is defined as one unit U, and a plurality of units U are connected and arranged.

According to the present embodiment, there is an effect that a plurality of chemical solutions can be processed and the size of the apparatus can be reduced.

[0023]

As described above, the present invention provides an intermediate tank accommodating a chemical treatment tank, a lid for opening and closing the upper surface of the intermediate tank,
The provision of the water washing and drying unit on the upper part of the intermediate tank has the effect of reducing the size of the apparatus.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of the present invention.

FIG. 2 is a sectional view showing a second embodiment of the present invention.

FIG. 3 is a plan view showing an apparatus in which a plurality of units according to a second embodiment of the present invention are connected.

FIG. 4 is a plan view showing a conventional device.

[Explanation of symbols]

1 chemical treatment vessel 2 intermediate tank 3 lid 4 Saisotoso 5 washing nozzles 6 the semiconductor substrate (wafer) 7 carrier 8 chuck 9 N ₂ nozzle 10 carrying robot 11 chemical tank 12 rinsing tank 13 drying section

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/304 642 H01L 21/304 651

Claims (3)

(57) [Claims] 1. An apparatus for immersing a semiconductor substrate, comprising an outer tank, an intermediate tank, a chemical treatment tank, and a washing section, wherein the outer tank is an intermediate tank, a chemical treatment tank, a water washing section. The intermediate tank contains the chemical processing tank inside and has a lid that opens and closes the opening of the tank. The chemical processing tank has the lid of the intermediate tank open. A semiconductor substrate immersion treatment apparatus, wherein the rinsing section is for rinsing the semiconductor substrate lifted from the chemical solution treatment tank. 2. The semiconductor substrate immersion apparatus according to claim 1, wherein the outermost tub has a drying section for drying the semiconductor substrate washed with a water washing section. apparatus. 3. A semiconductor substrate immersion apparatus according to claim 1 or 2, wherein said apparatus is a unit, a plurality of said units are connected, and a plurality of chemical liquid treatments are performed by one facility. Semiconductor substrate immersion processing equipment.