JPS6085529A - Treater for chemical for semiconductor wafer - Google Patents

Abstract

PURPOSE:To obtain a treating apparatus, through which defectives are not generated, by covering an opening section for a chemical treating tank with an automatic open-close cover immediately after a wafer to be treated, to which chemical treatment is completed in the tank, is taken out of the inside of the tank and rapidly removing chemicals remaining on the surface of the wafer taken out by a shower for water washing. CONSTITUTION:Automatic open-close covers 7 and 8 each operated by air cylinders 9 and 10 are mounted to the upper opening section of a chemical treating tank 3 receiving chemicals 4. The covers 7 and 8 are opened, a cassette 1 with robot arms 2 receiving a large number of semiconductor wafers 50 is immersed in the tank 3, and the wafers 50 are treated with chemicals. The treated wafers 50 are pulled up together with the cassette 1, the covers 7 and 8 are closed instantaneously, water from a shower device 11 for water washing is poured over the wafers 50 under the state, and chemicals 4 adhering on the surfaces of the wafers 50 are washed away. Accordingly, yield on the subsequent manufacture of a semiconductor device is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor wafer chemical treatment apparatus that performs water washing treatment after chemical treatment such as etching treatment on a semiconductor wafer.

[Prior art]

FIG. 1 is a perspective view showing the main components of an example of a conventional semiconductor wafer 71 chemical processing apparatus.

In the figure, (1) is a cassette that accommodates semiconductor wafers (hereinafter referred to as "wafers to be processed") to be subjected to chemical processing of etching processing power, and (2) is a cassette that houses cassettes (1). Can be held and transported back and forth, left and right, and up and down 2
The robot arm (3) has a wafer to be processed (
A chemical treatment tank (4) containing a chemical solution such as an etching solution (5) is attached to the chemical treatment tank (3) and is a water tank (6) for washing the wafer to be processed after the chemical treatment.
) It is a fixed water washing treatment tank.

Next, the operation of this conventional example will be explained in the case where the etching process is performed on a wafer to be processed.

In this case, first, an etching solution is put into the chemical treatment tank (3). Then, the cassette (1) containing the wafers to be processed (1) is immersed in the etching solution in the chemical treatment tank (3) for a predetermined period of time by being transported by the robot arm (2), thereby etching the wafers to be processed. Thereafter, the cassette (1) containing the etched wafer (E) is taken out into the air from the chemical treatment tank (3) by the robot arm (2) again and washed with water. Transfer to the tank (5) and place the wafer to be processed (
(to)).

However, in this conventional device, the robot arm (2
) starts transferring the cassette (1) containing the etched wafers (to) into the air from the chemical treatment tank (3) and into the water washing tank (5). It takes several seconds to control the robot arm (2), so
The wafer to be processed which has been subjected to the etching process is further etched for about ten seconds by the etching liquid remaining on the surface of the wafer to be processed. Therefore, the wafer to be processed is likely to be over-etched, resulting in defective products and a lower manufacturing yield.

[Summary of the invention]

This invention was made for the purpose of eliminating the drawback that 75≧. By covering the wafer with an automatic opening/closing lid and quickly removing the chemical remaining on the surface of the wafer by washing it with water sprayed from a washing shower device, the wafer to be processed can be protected from the harmful effects of the chemical remaining on the surface. The purpose of the present invention is to provide a semiconductor wafer chemical processing apparatus that is almost never defective due to a chemical reaction.

[Embodiments of the invention]

@ Figures 2 and 3 are a perspective view and a side view, respectively, showing several main elements in a semiconductor wafer chemical processing tank according to an embodiment of the present invention, and Figure 2 shows the state of a wafer to be processed before chemical processing. FIG. 3 shows the state after chemical treatment.

In the figure, the same reference numerals as those of the conventional example shown in FIG. 1 indicate equivalent parts. (7) and (8) are respectively provided on both sides of the chemical treatment m(3), and one side end surface of each is fixed to the air cylinder (9) and the piston of the air cylinder αO, so that the action of the air cylinder (9) and αO is The automatic opening/closing lid is pushed out above the chemical processing tank (3) at right angles to each other and automatically completely covers the opening of the chemical processing tank (3), and the other side end surface of the automatic opening/closing lid (8) A part of the side is bent at a right angle to the bottom surface to automatically open and close the lid (7)
It overlaps a part of the other side end surface side. (B) is a rinsing shower device that is installed above the robot arm (2) and sprays water to wash away the chemical solution remaining on the surface of the wafer to be processed after the chemical solution treatment.

Next, the operation of this embodiment will be explained by taking as an example a case where a wafer ω to be processed is subjected to an etching process.

In this case, first, an etching solution is put into the chemical treatment tank (3). Then, the cassette (1) containing the wafer to be processed (A) is immersed in the etching solution in the chemical treatment tank (3) for a predetermined period of time by the robot arm (2), and the wafer to be processed (S) is etched. Perform etching process.

Next, the robot arm (2) transports the cassette (1) containing the etched wafer (to) from the chemical treatment tank (3) into the air. Immediately after, air cylinder (9), Q
f), the opening of the chemical treatment tank (3) is covered with the automatic opening/closing lids (7) and (8), and at the same time, the flushing shower device (11) is activated, and the flushing shower device (lυ
The etching solution remaining on the surface of the wafer 1 to be processed is washed away by water sprayed from the wafer 1. At this time,
The opening of the chemical treatment tank (3) automatically opens and closes the lid (7), +
8), so the flushing shower device 0
The water injected from η does not enter the chemical treatment tank (3).

In this way, in the apparatus of this embodiment, immediately after the etched wafer (to) is taken out into the air from the chemical treatment tank (3), there is no residual material left on the surface of the to-be-processed wafer (to). A shower device (1
1) Since the water is quickly removed by the jet of water, there is almost no chance that the wafer to be processed will be etched by the etching solution remaining on the surface, resulting in over-etching and resulting in defective products, and the manufacturing yield can be improved. It is possible to improve the

In this embodiment, two automatic opening/closing lids (7), (s)
Although the case has been described in which the opening of the chemical liquid processing tank (3) is automatically covered using a chemical liquid processing tank (3), the present invention is not limited to this. It can also be applied to automatically cover openings in

〔Effect of the invention〕

As described above, in the semiconductor chemical processing apparatus of the present invention, the opening of the chemical processing tank is automatically opened and closed immediately after the wafer to be processed is removed from the chemical processing tank by $9. Since the wafer to be processed is covered with a lid and the chemical solution remaining on the surface of the wafer to be processed is quickly removed by washing with water sprayed from a washing shower device, there is no chance that the wafer to be processed will be adversely affected by the chemical solution remaining on the surface. There are almost no non-defective products, and the manufacturing yield can be improved.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the main components of an example of a conventional semiconductor chemical processing device, and FIGS. 2 and 3 are perspective views showing the main tank e and elements of a semiconductor chemical processing device according to an embodiment of the present invention FIG. 3 is a diagram and a side view. In the figure, (1) is a cassette, (2) ILT robot arm, (3) is a chemical treatment tank, (4) is a chemical solution, (7) and (8) are automatic opening/closing lids, 0υ is a flushing shower device,
(to) is a semiconductor wafer to which chemical treatment is applied. It should be noted that the same reference numerals in the figures indicate the same -t or corresponding parts, respectively. Agent Masuo Oiwa Figure 1 Figure 2

Claims (1)

[Claims] (1) A robot arm that transports a cassette containing semiconductor wafers to be subjected to chemical processing; a chemical processing tank in which a chemical solution for processing the semiconductor wafers transported by the robot arm is stored; An automatic opening/closing lid that can automatically cover the opening of the chemical treatment tank, and a surface of the semiconductor wafer housed in the cassette lifted from the chemical treatment tank by the robot arm after the chemical treatment are washed with water. A washing shower device that sprays water is provided, and the semiconductor wafer carried by the robot arm is treated with a chemical solution in the chemical solution processing tank and immediately after being taken out from the chemical solution processing tank. The opening is covered with the automatic opening/closing lid, and the chemical solution remaining on the surface of the semiconductor wafer processed in the chemical solution processing tank is quickly removed by washing with water sprayed from the washing shower device. Semiconductor chemical processing equipment.