CN107920643A - 用于柔性设备的织物信号路径结构 - Google Patents
用于柔性设备的织物信号路径结构 Download PDFInfo
- Publication number
- CN107920643A CN107920643A CN201680050820.9A CN201680050820A CN107920643A CN 107920643 A CN107920643 A CN 107920643A CN 201680050820 A CN201680050820 A CN 201680050820A CN 107920643 A CN107920643 A CN 107920643A
- Authority
- CN
- China
- Prior art keywords
- signal path
- metal
- cover
- fabric
- path structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
- A45C11/00—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00
- A45C11/003—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 for storing portable computing devices, e.g. laptops, tablets or calculators
-
- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
- A45C13/00—Details; Accessories
- A45C13/005—Hinges
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1662—Details related to the integrated keyboard
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1675—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts
- G06F1/1683—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts for the transmission of signal or power between the different housings, e.g. details of wired or wireless communication, passage of cabling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the shock resistance of the housing, e.g. by increasing the rigidity
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- Textile Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Woven Fabrics (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210710699.5A CN115061538A (zh) | 2015-09-02 | 2016-07-06 | 用于柔性设备的织物信号路径结构 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/843,617 US9883583B2 (en) | 2015-09-02 | 2015-09-02 | Fabric signal path structures for flexible devices |
| US14/843,617 | 2015-09-02 | ||
| PCT/US2016/041180 WO2017039830A1 (en) | 2015-09-02 | 2016-07-06 | Fabric signal path structures for flexible devices |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210710699.5A Division CN115061538A (zh) | 2015-09-02 | 2016-07-06 | 用于柔性设备的织物信号路径结构 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107920643A true CN107920643A (zh) | 2018-04-17 |
Family
ID=56684228
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680050820.9A Pending CN107920643A (zh) | 2015-09-02 | 2016-07-06 | 用于柔性设备的织物信号路径结构 |
| CN202210710699.5A Pending CN115061538A (zh) | 2015-09-02 | 2016-07-06 | 用于柔性设备的织物信号路径结构 |
| CN201620808320.4U Active CN205847721U (zh) | 2015-09-02 | 2016-07-28 | 在电子设备中传送信号的柔性织物信号路径结构及覆盖物 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210710699.5A Pending CN115061538A (zh) | 2015-09-02 | 2016-07-06 | 用于柔性设备的织物信号路径结构 |
| CN201620808320.4U Active CN205847721U (zh) | 2015-09-02 | 2016-07-28 | 在电子设备中传送信号的柔性织物信号路径结构及覆盖物 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US9883583B2 (enExample) |
| JP (2) | JP6802261B2 (enExample) |
| KR (2) | KR102223162B1 (enExample) |
| CN (3) | CN107920643A (enExample) |
| WO (1) | WO2017039830A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114740952A (zh) * | 2022-04-02 | 2022-07-12 | 西安中诺通讯有限公司 | 一种具有折叠屏的智能终端及其控制方法、装置 |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9588551B1 (en) * | 2015-09-02 | 2017-03-07 | Apple Inc. | Fabric electronic device housings |
| US10993635B1 (en) | 2016-03-22 | 2021-05-04 | Flextronics Ap, Llc | Integrating biosensor to compression shirt textile and interconnect method |
| US10400364B1 (en) * | 2016-09-20 | 2019-09-03 | Apple Inc. | Fabrics with conductive paths |
| US10466804B2 (en) * | 2017-01-12 | 2019-11-05 | Microsoft Technology Licensing, Llc | Composite unibody keyboard |
| US11323794B2 (en) | 2017-03-20 | 2022-05-03 | Buderflys Technologies, Inc. | Personal hearing device |
| TW201836447A (zh) * | 2017-03-24 | 2018-10-01 | 致伸科技股份有限公司 | 具擴充功能之薄膜線路結構 |
| KR102495240B1 (ko) * | 2018-07-30 | 2023-02-03 | 삼성전자주식회사 | Led 백라이트 케이스 |
| US10985484B1 (en) * | 2018-10-01 | 2021-04-20 | Flex Ltd. | Electronic conductive interconnection for bridging across irregular areas in a textile product |
| WO2020096579A1 (en) * | 2018-11-06 | 2020-05-14 | Hewlett-Packard Development Company, L.P. | Covers for electronic devices |
| KR102645286B1 (ko) * | 2019-04-30 | 2024-03-11 | 삼성전자주식회사 | 복수의 층을 포함하는 안테나 방사체 및 그것을 포함하는 전자 장치 |
| US11675440B2 (en) | 2019-09-30 | 2023-06-13 | Microsoft Technology Licensing, Llc | Solvent free textile coating |
| US11239710B2 (en) | 2019-09-30 | 2022-02-01 | Microsoft Technology Licensing, Llc | Charging system including orientation control |
| KR102833777B1 (ko) * | 2019-10-22 | 2025-07-15 | 삼성전자주식회사 | 폴더블 전자 장치를 위한 보호 커버 |
| US11672096B2 (en) * | 2020-04-24 | 2023-06-06 | Microsoft Technology Licensing, Llc | Seamless textile covered enclosure |
| DE102020213995A1 (de) * | 2020-11-06 | 2022-05-12 | Volkswagen Aktiengesellschaft | Antennenvorrichtung |
| JP6997407B1 (ja) | 2021-06-16 | 2022-01-17 | 富士通クライアントコンピューティング株式会社 | スタンド付きキーボード及び電子機器 |
| JP7563322B2 (ja) | 2021-07-27 | 2024-10-08 | 株式会社オートネットワーク技術研究所 | コネクタ |
| KR20230020071A (ko) * | 2021-08-02 | 2023-02-10 | 삼성디스플레이 주식회사 | 표시장치 및 이를 포함하는 전자장치 |
| US12079045B2 (en) | 2021-09-21 | 2024-09-03 | Microsoft Technology Licensing, Llc | Fabric hinged device |
| EP4430335A2 (en) | 2021-11-12 | 2024-09-18 | reMarkable AS | Device mount for supporting a computing device |
| US11721934B2 (en) * | 2021-12-23 | 2023-08-08 | Bayerische Motoren Werke Aktiengesellschaft | Hidden power and data connectors for accessories |
| CN114870256A (zh) * | 2022-04-08 | 2022-08-09 | 苏州维伟思医疗科技有限公司 | 植入式发生器及其应用的植入式心脏医疗设备 |
| JP7144707B1 (ja) * | 2022-04-22 | 2022-09-30 | 富士通クライアントコンピューティング株式会社 | 電子機器および電子機器システム |
| US12299218B2 (en) | 2023-06-11 | 2025-05-13 | Remarkable As | Active pen-stylus precise eraser |
| USD1092467S1 (en) | 2023-11-13 | 2025-09-09 | Remarkable As | Tablet computer |
| USD1107023S1 (en) | 2024-02-08 | 2025-12-23 | Remarkable As | Marker |
| USD1106208S1 (en) | 2024-02-08 | 2025-12-16 | Remarkable As | Marker |
| WO2025254309A1 (ko) * | 2024-06-07 | 2025-12-11 | 삼성전자주식회사 | 도전성 연결 부재를 포함하는 전자 장치 |
| US12411561B1 (en) | 2024-07-08 | 2025-09-09 | Remarkable As | Marker protection system |
| US12474792B1 (en) | 2024-07-08 | 2025-11-18 | Remarkable As | Marker writing system |
| US12416999B1 (en) | 2024-07-08 | 2025-09-16 | Remarkable As | Replaceable conductive marker tip |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61224393A (ja) * | 1985-03-28 | 1986-10-06 | ダイソー株式会社 | メッキ回路基板の製法 |
| CN1304633A (zh) * | 1998-06-01 | 2001-07-18 | 维尔洛季克公司 | 柔性电路组件 |
| CN1423769A (zh) * | 2000-03-30 | 2003-06-11 | 艾莱克森有限公司 | 手动输入装置和处理器 |
| US20050244620A1 (en) * | 2004-04-30 | 2005-11-03 | Nitto Denko Corporation | Wired circuit board and production method thereof |
| CN101240475A (zh) * | 2007-02-08 | 2008-08-13 | 深圳市冠旭电子有限公司 | 电子织物 |
| CN101375652A (zh) * | 2006-01-17 | 2009-02-25 | 精炼株式会社 | 导电衬垫材料 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE3116348A1 (de) | 1980-04-28 | 1982-09-09 | Deutsche Itt Industries Gmbh, 7800 Freiburg | "elektrische verbindungseinrichtung" |
| JPS6127089Y2 (enExample) * | 1980-09-03 | 1986-08-13 | ||
| JPS61107792A (ja) * | 1984-10-31 | 1986-05-26 | 東芝シリコ−ン株式会社 | 回路基布の形成方法 |
| JPS61224392A (ja) * | 1985-03-29 | 1986-10-06 | 松下電器産業株式会社 | 導電性スキ−ジ |
| JPH10161785A (ja) * | 1996-11-28 | 1998-06-19 | Nec Yonezawa Ltd | メンブレンキーボード |
| JPH1115924A (ja) * | 1997-06-19 | 1999-01-22 | Olympus Optical Co Ltd | 情報カード処理装置 |
| DE10161527A1 (de) * | 2001-12-14 | 2003-07-03 | Infineon Technologies Ag | Aufbau- und Verbindungstechnik in textilen Strukturen |
| GB0129968D0 (en) | 2001-12-14 | 2002-02-06 | Nel Technologies Ltd | Flexible heater |
| US20080105527A1 (en) | 2004-09-16 | 2008-05-08 | Steven Andrew Leftly | Switches and Devices for Integrated Soft Component Systems |
| US20070149001A1 (en) * | 2005-12-22 | 2007-06-28 | Uka Harshad K | Flexible circuit |
| KR20070071935A (ko) * | 2005-12-30 | 2007-07-04 | 브이케이 주식회사 | 액정클리너가 일체로 구비된 휴대용 키패드 |
| US8022307B2 (en) * | 2006-07-10 | 2011-09-20 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Fabric circuits and method of manufacturing fabric circuits |
| EP2132832B1 (en) * | 2007-03-29 | 2014-10-08 | Koninklijke Philips N.V. | Electronic assembly for attachment to a fabric substrate, electronic textile, and method of manufacturing such an electronic textile |
| JP5136479B2 (ja) * | 2009-03-17 | 2013-02-06 | 株式会社デンソーウェーブ | ロボットの回転関節用配線装置 |
| KR101641229B1 (ko) * | 2009-10-23 | 2016-07-20 | 엘지전자 주식회사 | 확장 모듈 및 이를 구비한 휴대 전자기기 |
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| JP2013084246A (ja) * | 2011-09-30 | 2013-05-09 | Sony Corp | 保護カバー及び情報処理装置 |
| US9827494B2 (en) * | 2012-01-06 | 2017-11-28 | Sony Corporation | Electronic device and external structure configured to attach to or detach from the electronic device |
| US9075566B2 (en) | 2012-03-02 | 2015-07-07 | Microsoft Technoogy Licensing, LLC | Flexible hinge spine |
| US9684382B2 (en) | 2012-06-13 | 2017-06-20 | Microsoft Technology Licensing, Llc | Input device configuration having capacitive and pressure sensors |
| US10173284B2 (en) | 2012-09-06 | 2019-01-08 | Saati S.P.A. | Method for making flexible circuits |
| TWM459753U (zh) * | 2012-10-11 | 2013-08-21 | Fu-Yi Hsu | 保護套 |
| US9048597B2 (en) | 2012-10-19 | 2015-06-02 | Apple Inc. | Structures for securing printed circuit connectors |
| US9526285B2 (en) | 2012-12-18 | 2016-12-27 | Intel Corporation | Flexible computing fabric |
| US9287336B2 (en) | 2013-02-26 | 2016-03-15 | Apple Inc. | Displays with shared flexible substrates |
| CN104252197B (zh) | 2013-06-26 | 2019-02-05 | 联想(北京)有限公司 | 一种电子设备及电子设备组件 |
| JP2015018469A (ja) * | 2013-07-12 | 2015-01-29 | 日本電信電話株式会社 | 接続部品 |
| CN104010446B (zh) | 2014-05-30 | 2017-05-24 | 西安工程大学 | 微滴喷射与化学沉积技术制备柔性导电线路的方法及装置 |
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2015
- 2015-09-02 US US14/843,617 patent/US9883583B2/en active Active
-
2016
- 2016-07-06 JP JP2018511251A patent/JP6802261B2/ja active Active
- 2016-07-06 CN CN201680050820.9A patent/CN107920643A/zh active Pending
- 2016-07-06 CN CN202210710699.5A patent/CN115061538A/zh active Pending
- 2016-07-06 WO PCT/US2016/041180 patent/WO2017039830A1/en not_active Ceased
- 2016-07-06 KR KR1020187006150A patent/KR102223162B1/ko active Active
- 2016-07-06 KR KR1020217005940A patent/KR102318729B1/ko active Active
- 2016-07-28 CN CN201620808320.4U patent/CN205847721U/zh active Active
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2018
- 2018-01-29 US US15/882,836 patent/US10362670B2/en active Active
-
2020
- 2020-09-04 JP JP2020149158A patent/JP7116129B2/ja active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61224393A (ja) * | 1985-03-28 | 1986-10-06 | ダイソー株式会社 | メッキ回路基板の製法 |
| CN1304633A (zh) * | 1998-06-01 | 2001-07-18 | 维尔洛季克公司 | 柔性电路组件 |
| CN1423769A (zh) * | 2000-03-30 | 2003-06-11 | 艾莱克森有限公司 | 手动输入装置和处理器 |
| US20050244620A1 (en) * | 2004-04-30 | 2005-11-03 | Nitto Denko Corporation | Wired circuit board and production method thereof |
| CN101375652A (zh) * | 2006-01-17 | 2009-02-25 | 精炼株式会社 | 导电衬垫材料 |
| CN101240475A (zh) * | 2007-02-08 | 2008-08-13 | 深圳市冠旭电子有限公司 | 电子织物 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114740952A (zh) * | 2022-04-02 | 2022-07-12 | 西安中诺通讯有限公司 | 一种具有折叠屏的智能终端及其控制方法、装置 |
| CN114740952B (zh) * | 2022-04-02 | 2023-12-19 | 西安中诺通讯有限公司 | 一种具有折叠屏的智能终端及其控制方法、装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017039830A1 (en) | 2017-03-09 |
| US10362670B2 (en) | 2019-07-23 |
| US20180168027A1 (en) | 2018-06-14 |
| CN115061538A (zh) | 2022-09-16 |
| JP7116129B2 (ja) | 2022-08-09 |
| JP6802261B2 (ja) | 2020-12-16 |
| KR102223162B1 (ko) | 2021-03-05 |
| JP2021012701A (ja) | 2021-02-04 |
| KR20180037997A (ko) | 2018-04-13 |
| CN205847721U (zh) | 2016-12-28 |
| KR20210025706A (ko) | 2021-03-09 |
| KR102318729B1 (ko) | 2021-10-27 |
| US9883583B2 (en) | 2018-01-30 |
| JP2018533117A (ja) | 2018-11-08 |
| US20170060192A1 (en) | 2017-03-02 |
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