KR102223162B1 - 가요성 디바이스용 패브릭 신호 경로 구조체들 - Google Patents

가요성 디바이스용 패브릭 신호 경로 구조체들 Download PDF

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Publication number
KR102223162B1
KR102223162B1 KR1020187006150A KR20187006150A KR102223162B1 KR 102223162 B1 KR102223162 B1 KR 102223162B1 KR 1020187006150 A KR1020187006150 A KR 1020187006150A KR 20187006150 A KR20187006150 A KR 20187006150A KR 102223162 B1 KR102223162 B1 KR 102223162B1
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South Korea
Prior art keywords
fabric
cover
metal
signal path
printed circuit
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KR1020187006150A
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English (en)
Korean (ko)
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KR20180037997A (ko
Inventor
벤자민 에이. 커슨스
커트 알. 스티엘
사무엘 지. 스미스
커크 엠. 메이어
싯다르타 헤그데
멜로디 쿠나
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애플 인크.
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Priority to KR1020217005940A priority Critical patent/KR102318729B1/ko
Publication of KR20180037997A publication Critical patent/KR20180037997A/ko
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Publication of KR102223162B1 publication Critical patent/KR102223162B1/ko
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C11/00—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00
    • A45C11/003—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 for storing portable computing devices, e.g. laptops, tablets or calculators
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C13/00—Details; Accessories
    • A45C13/005—Hinges
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1662—Details related to the integrated keyboard
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1675—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts
    • G06F1/1683—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts for the transmission of signal or power between the different housings, e.g. details of wired or wireless communication, passage of cabling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • A45C2011/003—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H04M1/185—Improving the shock resistance of the housing, e.g. by increasing the rigidity
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • Textile Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Woven Fabrics (AREA)
KR1020187006150A 2015-09-02 2016-07-06 가요성 디바이스용 패브릭 신호 경로 구조체들 Active KR102223162B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020217005940A KR102318729B1 (ko) 2015-09-02 2016-07-06 가요성 디바이스용 패브릭 신호 경로 구조체들

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/843,617 US9883583B2 (en) 2015-09-02 2015-09-02 Fabric signal path structures for flexible devices
US14/843,617 2015-09-02
PCT/US2016/041180 WO2017039830A1 (en) 2015-09-02 2016-07-06 Fabric signal path structures for flexible devices

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020217005940A Division KR102318729B1 (ko) 2015-09-02 2016-07-06 가요성 디바이스용 패브릭 신호 경로 구조체들

Publications (2)

Publication Number Publication Date
KR20180037997A KR20180037997A (ko) 2018-04-13
KR102223162B1 true KR102223162B1 (ko) 2021-03-05

Family

ID=56684228

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020187006150A Active KR102223162B1 (ko) 2015-09-02 2016-07-06 가요성 디바이스용 패브릭 신호 경로 구조체들
KR1020217005940A Active KR102318729B1 (ko) 2015-09-02 2016-07-06 가요성 디바이스용 패브릭 신호 경로 구조체들

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020217005940A Active KR102318729B1 (ko) 2015-09-02 2016-07-06 가요성 디바이스용 패브릭 신호 경로 구조체들

Country Status (5)

Country Link
US (2) US9883583B2 (enExample)
JP (2) JP6802261B2 (enExample)
KR (2) KR102223162B1 (enExample)
CN (3) CN107920643A (enExample)
WO (1) WO2017039830A1 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9588551B1 (en) * 2015-09-02 2017-03-07 Apple Inc. Fabric electronic device housings
US10993635B1 (en) 2016-03-22 2021-05-04 Flextronics Ap, Llc Integrating biosensor to compression shirt textile and interconnect method
US10400364B1 (en) * 2016-09-20 2019-09-03 Apple Inc. Fabrics with conductive paths
US10466804B2 (en) * 2017-01-12 2019-11-05 Microsoft Technology Licensing, Llc Composite unibody keyboard
US11323794B2 (en) 2017-03-20 2022-05-03 Buderflys Technologies, Inc. Personal hearing device
TW201836447A (zh) * 2017-03-24 2018-10-01 致伸科技股份有限公司 具擴充功能之薄膜線路結構
KR102495240B1 (ko) * 2018-07-30 2023-02-03 삼성전자주식회사 Led 백라이트 케이스
US10985484B1 (en) * 2018-10-01 2021-04-20 Flex Ltd. Electronic conductive interconnection for bridging across irregular areas in a textile product
WO2020096579A1 (en) * 2018-11-06 2020-05-14 Hewlett-Packard Development Company, L.P. Covers for electronic devices
KR102645286B1 (ko) * 2019-04-30 2024-03-11 삼성전자주식회사 복수의 층을 포함하는 안테나 방사체 및 그것을 포함하는 전자 장치
US11675440B2 (en) 2019-09-30 2023-06-13 Microsoft Technology Licensing, Llc Solvent free textile coating
US11239710B2 (en) 2019-09-30 2022-02-01 Microsoft Technology Licensing, Llc Charging system including orientation control
KR102833777B1 (ko) * 2019-10-22 2025-07-15 삼성전자주식회사 폴더블 전자 장치를 위한 보호 커버
US11672096B2 (en) * 2020-04-24 2023-06-06 Microsoft Technology Licensing, Llc Seamless textile covered enclosure
DE102020213995A1 (de) * 2020-11-06 2022-05-12 Volkswagen Aktiengesellschaft Antennenvorrichtung
JP6997407B1 (ja) 2021-06-16 2022-01-17 富士通クライアントコンピューティング株式会社 スタンド付きキーボード及び電子機器
JP7563322B2 (ja) 2021-07-27 2024-10-08 株式会社オートネットワーク技術研究所 コネクタ
KR20230020071A (ko) * 2021-08-02 2023-02-10 삼성디스플레이 주식회사 표시장치 및 이를 포함하는 전자장치
US12079045B2 (en) 2021-09-21 2024-09-03 Microsoft Technology Licensing, Llc Fabric hinged device
EP4430335A2 (en) 2021-11-12 2024-09-18 reMarkable AS Device mount for supporting a computing device
US11721934B2 (en) * 2021-12-23 2023-08-08 Bayerische Motoren Werke Aktiengesellschaft Hidden power and data connectors for accessories
CN114740952B (zh) * 2022-04-02 2023-12-19 西安中诺通讯有限公司 一种具有折叠屏的智能终端及其控制方法、装置
CN114870256A (zh) * 2022-04-08 2022-08-09 苏州维伟思医疗科技有限公司 植入式发生器及其应用的植入式心脏医疗设备
JP7144707B1 (ja) * 2022-04-22 2022-09-30 富士通クライアントコンピューティング株式会社 電子機器および電子機器システム
US12299218B2 (en) 2023-06-11 2025-05-13 Remarkable As Active pen-stylus precise eraser
USD1092467S1 (en) 2023-11-13 2025-09-09 Remarkable As Tablet computer
USD1107023S1 (en) 2024-02-08 2025-12-23 Remarkable As Marker
USD1106208S1 (en) 2024-02-08 2025-12-16 Remarkable As Marker
WO2025254309A1 (ko) * 2024-06-07 2025-12-11 삼성전자주식회사 도전성 연결 부재를 포함하는 전자 장치
US12411561B1 (en) 2024-07-08 2025-09-09 Remarkable As Marker protection system
US12474792B1 (en) 2024-07-08 2025-11-18 Remarkable As Marker writing system
US12416999B1 (en) 2024-07-08 2025-09-16 Remarkable As Replaceable conductive marker tip

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013084246A (ja) * 2011-09-30 2013-05-09 Sony Corp 保護カバー及び情報処理装置
JP2015018469A (ja) 2013-07-12 2015-01-29 日本電信電話株式会社 接続部品

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3116348A1 (de) 1980-04-28 1982-09-09 Deutsche Itt Industries Gmbh, 7800 Freiburg "elektrische verbindungseinrichtung"
JPS6127089Y2 (enExample) * 1980-09-03 1986-08-13
JPS61107792A (ja) * 1984-10-31 1986-05-26 東芝シリコ−ン株式会社 回路基布の形成方法
JPS61224393A (ja) * 1985-03-28 1986-10-06 ダイソー株式会社 メッキ回路基板の製法
JPS61224392A (ja) * 1985-03-29 1986-10-06 松下電器産業株式会社 導電性スキ−ジ
JPH10161785A (ja) * 1996-11-28 1998-06-19 Nec Yonezawa Ltd メンブレンキーボード
JPH1115924A (ja) * 1997-06-19 1999-01-22 Olympus Optical Co Ltd 情報カード処理装置
US6307751B1 (en) 1998-06-01 2001-10-23 Wearlogic, Inc. Flexible circuit assembly
GB2365132B (en) 2000-03-30 2003-01-08 Electrotextiles Co Ltd Manual input apparatus and processor
DE10161527A1 (de) * 2001-12-14 2003-07-03 Infineon Technologies Ag Aufbau- und Verbindungstechnik in textilen Strukturen
GB0129968D0 (en) 2001-12-14 2002-02-06 Nel Technologies Ltd Flexible heater
JP2005317836A (ja) * 2004-04-30 2005-11-10 Nitto Denko Corp 配線回路基板およびその製造方法
US20080105527A1 (en) 2004-09-16 2008-05-08 Steven Andrew Leftly Switches and Devices for Integrated Soft Component Systems
US20070149001A1 (en) * 2005-12-22 2007-06-28 Uka Harshad K Flexible circuit
KR20070071935A (ko) * 2005-12-30 2007-07-04 브이케이 주식회사 액정클리너가 일체로 구비된 휴대용 키패드
US20100203789A1 (en) * 2006-01-17 2010-08-12 Seiren Co., Ltd. Electrically conductive gasket material
US8022307B2 (en) * 2006-07-10 2011-09-20 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Fabric circuits and method of manufacturing fabric circuits
CN101240475B (zh) 2007-02-08 2012-07-25 深圳市冠旭电子有限公司 电子织物
EP2132832B1 (en) * 2007-03-29 2014-10-08 Koninklijke Philips N.V. Electronic assembly for attachment to a fabric substrate, electronic textile, and method of manufacturing such an electronic textile
JP5136479B2 (ja) * 2009-03-17 2013-02-06 株式会社デンソーウェーブ ロボットの回転関節用配線装置
KR101641229B1 (ko) * 2009-10-23 2016-07-20 엘지전자 주식회사 확장 모듈 및 이를 구비한 휴대 전자기기
US8467179B2 (en) * 2010-01-28 2013-06-18 Cruxcase, Llc Tablet computer case and associated methods
EP2413572B1 (en) 2010-07-30 2015-09-02 BlackBerry Limited Mobile wireless communications device with spatial diversity antenna and related methods
US9335793B2 (en) * 2011-01-31 2016-05-10 Apple Inc. Cover attachment with flexible display
US9827494B2 (en) * 2012-01-06 2017-11-28 Sony Corporation Electronic device and external structure configured to attach to or detach from the electronic device
US9075566B2 (en) 2012-03-02 2015-07-07 Microsoft Technoogy Licensing, LLC Flexible hinge spine
US9684382B2 (en) 2012-06-13 2017-06-20 Microsoft Technology Licensing, Llc Input device configuration having capacitive and pressure sensors
US10173284B2 (en) 2012-09-06 2019-01-08 Saati S.P.A. Method for making flexible circuits
TWM459753U (zh) * 2012-10-11 2013-08-21 Fu-Yi Hsu 保護套
US9048597B2 (en) 2012-10-19 2015-06-02 Apple Inc. Structures for securing printed circuit connectors
US9526285B2 (en) 2012-12-18 2016-12-27 Intel Corporation Flexible computing fabric
US9287336B2 (en) 2013-02-26 2016-03-15 Apple Inc. Displays with shared flexible substrates
CN104252197B (zh) 2013-06-26 2019-02-05 联想(北京)有限公司 一种电子设备及电子设备组件
CN104010446B (zh) 2014-05-30 2017-05-24 西安工程大学 微滴喷射与化学沉积技术制备柔性导电线路的方法及装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013084246A (ja) * 2011-09-30 2013-05-09 Sony Corp 保護カバー及び情報処理装置
JP2015018469A (ja) 2013-07-12 2015-01-29 日本電信電話株式会社 接続部品

Also Published As

Publication number Publication date
WO2017039830A1 (en) 2017-03-09
CN107920643A (zh) 2018-04-17
US10362670B2 (en) 2019-07-23
US20180168027A1 (en) 2018-06-14
CN115061538A (zh) 2022-09-16
JP7116129B2 (ja) 2022-08-09
JP6802261B2 (ja) 2020-12-16
JP2021012701A (ja) 2021-02-04
KR20180037997A (ko) 2018-04-13
CN205847721U (zh) 2016-12-28
KR20210025706A (ko) 2021-03-09
KR102318729B1 (ko) 2021-10-27
US9883583B2 (en) 2018-01-30
JP2018533117A (ja) 2018-11-08
US20170060192A1 (en) 2017-03-02

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