CN107785377B - 制造半导体装置的方法 - Google Patents

制造半导体装置的方法 Download PDF

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CN107785377B
CN107785377B CN201710614700.3A CN201710614700A CN107785377B CN 107785377 B CN107785377 B CN 107785377B CN 201710614700 A CN201710614700 A CN 201710614700A CN 107785377 B CN107785377 B CN 107785377B
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gate electrode
film
insulating film
region
semiconductor substrate
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CN107785377A (zh
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山口直
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Renesas Electronics Corp
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Renesas Electronics Corp
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JP2016164586A JP6713878B2 (ja) 2016-08-25 2016-08-25 半導体装置の製造方法
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KR (1) KR20180023831A (https=)
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TW (1) TW201820590A (https=)

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US10872898B2 (en) * 2017-07-19 2020-12-22 Cypress Semiconductor Corporation Embedded non-volatile memory device and fabrication method of the same
JP2020155485A (ja) * 2019-03-18 2020-09-24 キオクシア株式会社 半導体装置およびその製造方法
TWI690061B (zh) * 2019-04-02 2020-04-01 億而得微電子股份有限公司 單閘極多次寫入非揮發性記憶體及其操作方法
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