CN107492504A - 具有填充的接触间隙的集成电路模块 - Google Patents
具有填充的接触间隙的集成电路模块 Download PDFInfo
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Abstract
本发明描述集成电路(IC)模块和用于制造该IC模块的方法。在实施例中,IC模块包括具有接触间隙的基板,IC管芯通过该IC管芯与该基板之间的电连接而附接在该基板上。该IC模块另外包括包封该IC管芯且填充该接触间隙的第一部分的封装,其中该接触间隙的该第一部分位于由该封装限定的该基板的区域内。用填充材料填充该接触间隙的第二部分,该接触间隙的该第二部分位于由该封装限定的基板的该区域外部。
Description
技术领域
本发明的实施例大体上涉及电子电路,并且更具体地说涉及具有多个电接触的集成电路(IC)模块和用于制造此类IC模块的方法。
背景技术
IC卡例如智能卡包括具有可以用于存储信息且实行数据处理的电路的IC管芯。例如,便携式IC卡可以用于金融、运输、安全、医疗,或其它应用,以提供识别和认证。
用于智能卡的IC管芯被封装为IC模块,该IC模块通常包括IC管芯、基板和数个电接触。IC管芯附接到基板的一侧,而电接触附接到基板的另一侧。由于电接触需要彼此电隔离,所以在电接触之间有间隙。电接触经由焊线穿过基板电连接到IC管芯。IC管芯和焊线被封装在适宜的材料中,以提供结构支撑以及保护。
用于智能卡的IC模块的设计中的一个考虑是确保热熔胶(该热熔胶通常用于将IC模块附接到智能卡的主体)不会通过IC模块的电接触间隙泄漏(在智能卡的制造过程期间,该间隙泄漏可能引起问题)。IC模块设计中的其它考虑包括IC模块厚度的减小和较低的成本。
发明内容
描述了集成电路(IC)模块和用于制造IC模块的方法。在实施例中,IC模块包括具有接触间隙的基板,IC管芯通过IC管芯和基板之间的电连接而附接在具有接触间隙的基板上。IC模块另外包括包封IC管芯且填充接触间隙的第一部分的封装,其中该接触间隙的第一部分位于由封装限定的基板的区域内。用填充材料填充位于由封装限定的基板的区域外部的接触间隙的第二部分。
在实施例中,一种用于制造集成电路(IC)模块的方法包括获得具有接触间隙的基板,将IC管芯附接到基板,在IC管芯和基板之间进行电连接,将封装材料分配到IC管芯上且分配到接触间隙的第一部分中以形成封装,该接触间隙的第一部分位于由封装限定的基板的区域内,并且将填充材料分配到接触间隙的第二部分中,该接触间隙的第二部分位于由封装限定的基板的区域外部。
在实施例中,填充材料是与封装材料相同的材料。
在实施例中,填充材料包括环氧模塑化合物。
在实施例中,在单个分配过程中实行分配封装材料和分配填充材料。
在实施例中,实行分配封装材料和分配填充材料,使得用封装材料和填充材料基本上填充全部接触间隙。
在实施例中,基板包括具有接触间隙的金属引线框。
在实施例中,金属引线框由铜、任何铜合金或不锈钢制成。
在实施例中,金属引线框的接触间隙中的至少一些接触间隙包括使封装锚定到金属引线框的结构。
在实施例中,结构与接触间隙邻接,并且包括比接触间隙更宽的间隙。
在实施例中,在分配封装材料和填充材料之前,将带附接到金属引线框的与IC管芯所附接到金属引线框的一侧相反一侧的表面上。
在实施例中,一种集成电路(IC)模块包括具有接触间隙的基板、附接到基板的IC管芯、在IC管芯和基板之间的多个电连接,以及包封IC管芯且填充接触间隙的第一部分的封装,该接触间隙的第一部分位于由封装限定的基板的区域内,其中用填充材料填充接触间隙的第二部分,该接触间隙的第二部分位于由封装限定的基板的区域外部。
在实施例中,填充材料是与封装材料相同的材料。
在实施例中,填充材料包括环氧模塑化合物。
在实施例中,用封装材料和填充材料基本上填充全部接触间隙。
在实施例中,基板包括具有接触间隙的金属引线框。
在实施例中,金属引线框的接触间隙中的至少一些接触间隙包括使封装锚定到金属引线框的结构。
在实施例中,结构与接触间隙邻接,并且包括比接触间隙更宽的间隙。
在实施例中,一种集成电路(IC)模块包括具有接触间隙的金属引线框、附接到金属引线框的IC管芯、连接到IC管芯和金属引线框的多个键合线,以及包封IC管芯且填充接触间隙的第一部分的封装,该接触间隙的第一部分位于由封装限定的金属引线框的区域内,其中用填充材料填充接触间隙的第二部分,该接触间隙的第二部分位于由封装限定的金属引线框的区域外部。
在实施例中,填充材料包括环氧模塑化合物。
在实施例中,金属引线框的接触间隙中的至少一些接触间隙包括使封装锚定到金属引线框的结构,该结构与接触间隙邻接,并且包括比接触间隙更宽的间隙。
将从借助于本发明原理的例子而描绘的结合附图进行的以下详细描述中显而易见本发明的实施例的其它方面和优点。
附图说明
图1是根据本发明的实施例的IC模块的横截面视图。
图2是IC模块的前侧视图。
图3是根据本发明的实施例的IC模块的金属引线框的前侧视图。
图4是根据本发明的实施例的具有以虚框所示的封装的IC模块的前侧视图。
图5示出根据本发明的实施例的附接到智能卡的主体的IC模块。
图6是附接到智能卡的主体的IC模块的横截面视图。
图7A到图7D示出根据本发明的第一实施例制造图1中所描绘的IC模块的过程。
图8A到图8F示出根据本发明的第二实施例制造图1中所描绘的IC模块的过程。
图9是根据本发明的实施例的用于制造IC模块的方法的过程流程图。
在整个描述中,类似的附图标记可用于识别类似的元件。
具体实施方式
将容易理解,如本文中大体描述且在附图中示出的实施例的组件可以用各种各样不同的配置来布置和设计。如此,以下如图中所表示的各种实施例的详细描述不旨在限制本公开的范围,而仅仅是表示各种实施例。虽然在附图中呈现了实施例的各个方面,但是除非具体地指示,否则附图未必按比例绘制。
所描述的实施例应视为在所有方面均仅为说明性而非限制性的。因而,本发明的范围由随附权利要求书而不是由此详细描述来指示。在权利要求书等效物的含义和范围内的所有变化均被涵盖在权利要求书的范围内。
本说明书通篇凡提到特征、优点或相似的语言并不暗示可以通过本发明实现的所有特征和优点应该在或在任何单一实施例中。相反,提到该特征和优点的语言应理解成结合实施例所描述的具体特征、优点或特性被包括在至少一个实施例中。如此,贯穿本说明书对特征和优点的论述以及类似的语言可(但未必)涉及同一实施例。
此外,本发明的所描述的特征、优点和特性可以任何合适方式在一个或多个实施例中组合。相关领域的技术人员应认识到,鉴于本文的描述,可以在没有特定实施例的具体特征或优点中的一个或多个具体特征或优点的情况下实践本发明。在其它情况下,可在某些实施例中辨识可不存在于本发明的所有实施例中的另外特征和优点。
本说明书通篇凡提到“一个实施例”、“实施例”或类似的语言,意味着结合所指示实施例描述的特定特征、结构或特性包括在至少一个实施例中。如此,本说明书通篇的短语“在一个实施例中”、“在实施例中”和类似的语言可以(但未必)全部涉及同一实施例。
图1是根据本发明的实施例的IC模块100的横截面视图。IC模块可以用于金融、运输、安全、医疗或其它应用的智能卡中,以存储信息和实行数据处理。在一些实施例中,IC模块具有安全地管理、存储和访问IC模块中的数据,实行模块上的功能(例如加密、认证和授权),以及智能地与读卡器交互的能力。IC模块可以经由电接触与读卡器通信。如下面更详细描述,与可比较的IC模块相比,IC模块的设计允许制作更薄且具有更低成本的IC模块。
在图1中所描绘的实施例中,IC模块100包括基板102、粘附材料104、IC管芯或芯片106、键合线108-1和键合线108-2以及封装110。虽然在图1中IC模块被示出为包括某些组件,但是在其它实施例中,IC模块可包括常见于常规IC模块中的更少组件或另外的组件。
在所示出的实施例中,基板102是具有第一表面112(IC管芯被安装在该第一表面112上)和第二表面114(该第二表面114充当用于信号传输的电接触区域)的金属引线框。金属引线框被分成不同的电隔离区段(例如,区段116-1和区段116-2),使得金属引线框可以用作用于IC模块的电接触垫。如此,金属引线框的电隔离区段在本文中有时将被称为电接触垫。为了电隔离电接触垫,在电接触之间有空间或间隙118。在图1中,IC模块被示出具有两个接触间隙,这两个接触间隙位于IC模块的封装110下面。然而,IC模块具有图1中未示出的另外的接触间隙。下面将另外参考图2描述IC模块的接触间隙。
图2是根据本发明的实施例的IC模块100的前侧视图。当IC模块被安装到智能卡的主体上时,IC模块的前侧是IC模块的暴露表面,IC模块的暴露表面是图1中所描绘的第二表面114。如图2所示,IC模块包括数个电接触垫216,该数个电接触垫216是金属引线框102的区段或部分。这些电接触垫具有在其间贯穿IC模块的前侧延伸的间隙218。在图2中,接触垫之间的全部线是接触间隙。IC模块的中心区220是IC管芯106被安装在另一个金属引线框上且通过封装110进行包封的位置。如此,靠近中心区的接触间隙将暴露于封装。换句话说,当形成封装时,封装将填充这些接触间隙。在一些实施例中,接触垫的暴露的表面可以被涂覆或镀覆有非腐蚀性导电材料,例如金(Au)、银(Ag)、镍(Ni)、钯(PD)或其它适宜的材料。
转回到图1,在所示的实施例中,金属引线框102被配置或成形,使得接触间隙118中的至少一些接触间隙118包括模压结构120。如图1中所示,模压结构是在金属引线框的第二表面114处的接触间隙中的一些接触间隙中的更宽的间隙。当封装形成或固化在这些接触间隙中时,模压结构帮助将封装110锚定到金属引线框。如此,模压结构可以防止IC模块100的封装从IC模块的其余部分脱落。可以策略性地放置模压结构,使得仅在封装下面或将由封装填充的接触间隙的部分将具有模压结构。在IC模块的不同轮廓和尺寸的情况下,间隙宽度可被设计成在1.00mm到5.62mm的范围内。模压结构厚度可在引线框的总厚度的25%直到50%的范围内。此外,基于设计和模压工艺技术,模压结构宽度可以在0.1mm以上。
金属引线框102可以由任何基于金属或合金的材料制成。作为例子,金属引线框可以由铜(Cu)、铜-锡合金(例如CuSn6)、铜-铁(CuFe)合金、铜铬(CuCr)或其它适宜的铜合金或不锈钢制成。可以使用对卷到卷材料的冲压技术形成金属引线框。图3中示出根据本发明的实施例可以用于IC模块100中的冲压金属引线框302的例子,图3是IC管芯将被安装在引线框上的一侧的视图。如图3所示,金属引线框包括中心区320,IC管芯可附接到该中心区320。金属引线框还包括不同的电隔离区段316,该不同的电隔离区段316将被用作用于所得的IC模块的接触垫。这些电隔离区段通过接触间隙318彼此间隔开。
和包括具有用于接触垫的金属层的厚环氧玻璃结构的智能卡模块的传统基板不同,金属引线框302可以被制作成相对较薄。作为例子,智能卡模块的传统基板可以是150-170微米厚,而金属引线框可以是60-100微米厚。如此,当与传统智能卡模块相比时,所得的IC模块的整体厚度可以显著减小。
转回到图1,IC模块100的IC管芯106使用粘附材料104被安装到金属引线框102上。IC管芯包括安全地管理、存储IC模块上的数据和提供对IC模块上数据的访问和/或实行模块上功能(例如加密、认证和授权)的电路系统。IC管芯被设计成由通过接触垫的电接触与另一个装置((例如,读卡器)通信,由金属引线框的区段116形成该接触垫。如此,在IC管芯和金属引线框的这些区段之间需要电连接。在所示的实施例中,IC管芯经由键合线108电连接到金属引线框的区段。键合线可以由任何合适的金属(例如,铝或铜)制成。在图1中所描绘的实施例中,键合线108-1将IC管芯电连接到金属引线框的区段116-1,而键合线108-2将IC管芯电连接到金属引线框的区段116-2。键合垫可以用于将键合线附接到IC管芯和金属引线框。虽然图1中仅示出两个键合线,但是IC模块可以包括另外的键合线。再者,在图1中所描绘的实施例中,IC模块包括单个IC管芯,可以使用接触垫接近单个IC管芯。然而,在其它实施例中,IC模块可以包括超过一个IC管芯,并且可以包括非接触接口以接近这些IC管芯中的一个或多个IC管芯。
IC模块100的封装110用于保护键合线108和IC管芯106。封装可以由任何合适的材料(例如环氧模塑或模塑化合物(EMC)或用于滴胶或围堰与填充过程的材料)制成。封装包封IC管芯和键合线108。此外,封装使用在IC管芯周围的模压结构120填充接触间隙118中的一些接触间隙118,如图1所示。还用适宜的填充材料填充剩余的接触间隙,当IC模块附接到智能卡的主体时,适宜的填充材料将防止粘附材料(例如,热熔胶)通过这些接触间隙渗漏。填充材料可以是用于封装的相同的材料(例如EMC),或可以是不同的材料。图4中示出用填充材料填充的剩余的接触间隙,图4是具有图3中所描绘的金属引线框302的IC模块100的前侧视图。IC管芯106被安装在IC模块的前侧。在图4中,以虚框示出封装,使得可以看见底层组件。当形成封装时,将用封装材料填充在封装下面或位于由封装限定的金属引线框的区域(即,封装的虚框轮廓)内的接触间隙318。将用填充材料填充在封装外部或位于由封装限定的金属引线框的区域(即,封装的虚框轮廓)外部的接触间隙,该填充材料可以是用于封装的相同的材料。如此,可用封装材料和/或填充材料基本上填充IC模块的全部接触间隙。如本文所使用的“基本上填充”意味着填充超过90%的接触间隙。
如图5中所示,IC模块100可以通过将粘附材料放置在智能卡主体的凹处506中,使用粘附材料504(例如,热熔胶)附接智能卡500的主体502。图6中另外示出用于将IC模块附接到智能卡主体的粘附材料,图6是使用粘附材料附接智能卡主体的IC模块的横截面视图。如果没有填充IC模块的接触间隙118,则粘附材料504将通过接触间隙渗漏,这可能引起问题,例如智能卡被粘合到其它智能卡或粘合到其它装置或表面。
参考图7A到图7D描述根据本发明的第一实施例制造IC模块100的过程。如图7A所示,通过获得金属引线框102开始制造IC模块的过程,该金属引线框102包括具有模压结构120(用于接触间隙中的至少一些接触间隙)的接触间隙118。在一些实施例中,金属引线框可以是卷到卷引线框的一部分。接下来,如图7B中所示,IC管芯106使用粘附材料104附接到金属引线框。接下来,如图7C中所示,键合线108附接到IC管芯和金属引线框的区段,以提供电连接。接下来,如图7D中所示,用于封装100的材料被分配到IC管芯和键合线上,以及被分配到全部接触间隙中,该全部接触间隙包括在由封装限定的区域内和外部的接触间隙。沿着间隙线,通过使用填充在模具型腔内的环氧模塑化合物的模塑过程或使用热塑性材料的分配过程(例如滴胶)填充接触之间的间隙。环氧模塑化合物或可分配的热塑性材料流进间隙中,并且填充整个间隙。在所示的实施例中,材料是环氧模塑化合物(EMC)。然而,其它材料可以用于其它实施例中。在一些可替换的实施例中,可以形成封装,该封装仅填充封装下面(即,在由封装限定的区域内)的接触垫。然后,可以在另一个步骤中使用相对于封装相同或不同的材料填充剩余的接触间隙。
参考图8A到图8F描述根据本发明的第二个实施例制造IC模块100的过程。如图8A所示,通过获得金属引线框开始制造IC模块的过程,该金属引线框包括具有模压结构(用于接触间隙中的至少一些接触间隙)的接触间隙。在一些实施例中,金属引线框可以是卷到卷引线框的一部分。接下来,如图8B中所示,带830被施加到金属引线框的第二表面(或底部)。作为例子,带可以是尼龙(PI)带。接下来,如图8C中所示,IC管芯106使用粘附材料104附接到金属引线框。接下来,如图8D中所示,键合线108附接到IC管芯和金属引线框的区段以提供电连接。接下来,如图8E中所示,用于封装110的材料被分配到IC管芯和键合线上,以及被分配到下至带830的全部接触间隙中,该带830附接到金属引线框的背面。在所示的实施例中,材料是环氧模塑化合物(EMC)。然而,其它材料可以用于其它实施例中。在一些可替换的实施例中,可以形成封装,该封装仅填充封装下面的接触垫。然后,可以在另一个步骤中使用相对于封装相同或不同的材料填充剩余的接触间隙。接下来,如图8F中所示的,从金属引线框去除带830。带的使用使得接触垫中的材料在接触垫上或在金属引线框的前侧表面上具有更少的模溢料。此外,它防止或限制来自将填充材料分配到接触间隙中的污染物在金属引线框的前侧表面上的其它区域上流动。这引起去除不想要的材料的表面前侧的另外的清洁过程的减小。
图9是根据本发明的实施例的用于制造IC模块的方法的过程流程图。在框902,获得具有接触间隙的基板。基板可以是具有接触间隙的金属引线框。接下来,在框904,IC管芯附接到基板。接下来,在框906,在IC管芯和基板之间进行电连接。接下来,在框908,封装材料被分配到IC管芯上,并且被分配到接触间隙的第一部分中以形成封装。接触间隙的第一部分位于由封装限定的引线框的区域内。接下来,在框910,填充材料被分配到接触间隙的第二部分中。接触间隙的第二部分位于由封装限定的引线框的区域外部。
虽然以特定次序示出和描述了本文中的方法的操作,但是可以更改方法的操作次序,使得可以逆序实行某些操作,或使得可以至少部分地与其它操作同时实行某些操作。在另一个实施例中,可以间断的和/或可替换的方式实施不同操作的指令或子操作。
此外,虽然已经描述或描绘的本发明的具体实施例包括本文中描述或描绘的若干组件,但是本发明的其它实施例可以包括更少或更多组件以实施更少或更多特征。
此外,虽然已经描述和描绘了本发明的具体实施例,但是本发明不限于如此描述和描绘的部分的具体形式或布置。本发明的范围将由在此随附的权利要求书及其等效物限定。
Claims (10)
1.一种用于制造集成电路(IC)模块的方法,其特征在于,所述方法包括:
获得具有接触间隙的基板;
将IC管芯附接到所述基板;
在所述IC管芯与所述基板之间进行电连接;
将封装材料分配到所述IC管芯上且分配到所述接触间隙的第一部分中以形成封装,所述接触间隙的所述第一部分位于由所述封装限定的所述基板的区域内;以及
将填充材料分配到所述接触间隙的第二部分中,所述接触间隙的所述第二部分位于由所述封装限定的基板的所述区域外部。
2.根据权利要求1所述的方法,其特征在于,所述基板包括具有所述接触间隙的金属引线框。
3.根据权利要求2所述的方法,其特征在于,所述金属引线框的所述接触间隙中的至少一些接触间隙包括使所述封装锚定到所述金属引线框的结构。
4.根据权利要求3所述的方法,其特征在于,所述结构与所述接触间隙邻接,并且包括比所述接触间隙更宽的间隙。
5.一种集成电路(IC)模块,其特征在于,包括:
具有接触间隙的基板;
附接到所述基板的IC管芯;
在所述IC管芯与所述基板之间的多个电连接;以及
封装,所述封装包封所述IC管芯且填充所述接触间隙的第一部分,所述接触间隙的所述第一部分位于由所述封装限定的所述基板的区域内,
其中用填充材料填充所述接触间隙的第二部分,所述接触间隙的所述第二部分位于由所述封装限定的基板的所述区域外部。
6.根据权利要求5所述的IC模块,其特征在于,所述基板包括具有所述接触间隙的金属引线框。
7.根据权利要求6所述的IC模块,其特征在于,所述金属引线框的所述接触间隙中的至少一些接触间隙包括使所述封装锚定到所述金属引线框的结构。
8.根据权利要求7所述的IC模块,其特征在于,所述结构与所述接触间隙邻接,并且包括比所述接触间隙更宽的间隙。
9.一种集成电路(IC)模块,其特征在于,包括:
具有接触间隙的金属引线框;
附接到所述金属引线框的IC管芯;
多个键合线,所述多个键合线连接到所述IC管芯和所述金属引线框;以及
封装,所述封装包封所述IC管芯且填充所述接触间隙的第一部分,所述接触间隙的所述第一部分位于由所述封装限定的所述金属引线框的区域内,
其中用填充材料填充所述接触间隙的第二部分,所述接触间隙的所述第二部分位于由所述封装限定的金属引线框的所述区域外部。
10.根据权利要求9所述的IC模块,其特征在于,所述金属引线框的所述接触间隙中的至少一些接触间隙包括使所述封装锚定到所述金属引线框的结构,所述结构与所述接触间隙邻接,并且包括比所述接触间隙更宽的间隙。
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