JP7273209B2 - チップカード用電子モジュールの製造方法 - Google Patents
チップカード用電子モジュールの製造方法 Download PDFInfo
- Publication number
- JP7273209B2 JP7273209B2 JP2022025254A JP2022025254A JP7273209B2 JP 7273209 B2 JP7273209 B2 JP 7273209B2 JP 2022025254 A JP2022025254 A JP 2022025254A JP 2022025254 A JP2022025254 A JP 2022025254A JP 7273209 B2 JP7273209 B2 JP 7273209B2
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- JP
- Japan
- Prior art keywords
- module
- substrate
- chip
- manufacturing
- chip card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 238000000034 method Methods 0.000 title description 16
- 239000002184 metal Substances 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 21
- 238000004377 microelectronic Methods 0.000 claims description 6
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 238000004891 communication Methods 0.000 description 8
- 230000009977 dual effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Description
-超小型電子チップと、接触式チップカードリーダーに対応する端子との接触用の接触式接続用端子板と、アンテナへの接続を可能にする裏面に位置する2つの接点を有する、電子モジュール、
-アンテナを有する、プラスチック材料製カード、
-電子モジュールとアンテナとの間の接続を可能にする、導電性材料。
5 接続線
6 接続線
7 金属層
8 金属層
11 基板
13 蓋
Claims (1)
- チップカード用電子モジュールの製造方法であって、前記モジュールが、少なくとも1つの面が金属層(7、8)を有する基板(11)を有し、前記基板(11)が凹部を備え、該凹部の中には、チップカードのアンテナへの接続または電気接点の端子板への接続用の出力端子を備えた超小型電子チップ(2)が固定され、前記接続が、基板の1つの面に対して盛り上がったループを形成する金属製の接続線(4、5、6)によって実現されるチップカード用電子モジュールの製造方法であって、該製造方法が、接続線(4、5、6)の配線の後に、盛り上がった線(4、5、6)のループを押さえて高さを減らして前記基板面の方に押しつける蓋(13)を使って、凹部を有するモジュール面をすっかり覆う工程を有することを特徴とする、チップカード用電子モジュールの製造方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1601576 | 2016-11-04 | ||
FR1601576A FR3058545B1 (fr) | 2016-11-04 | 2016-11-04 | Procede de fabrication d'un module electronique pour carte a puce |
JP2019546083A JP7166527B2 (ja) | 2016-11-04 | 2017-11-02 | チップカード用電子モジュールの製造方法 |
PCT/FR2017/000206 WO2018083389A1 (fr) | 2016-11-04 | 2017-11-02 | Procédé de fabrication d'un module électronique pour carte à puce |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019546083A Division JP7166527B2 (ja) | 2016-11-04 | 2017-11-02 | チップカード用電子モジュールの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022078128A JP2022078128A (ja) | 2022-05-24 |
JP7273209B2 true JP7273209B2 (ja) | 2023-05-12 |
Family
ID=57906667
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019546083A Active JP7166527B2 (ja) | 2016-11-04 | 2017-11-02 | チップカード用電子モジュールの製造方法 |
JP2022025254A Active JP7273209B2 (ja) | 2016-11-04 | 2022-02-22 | チップカード用電子モジュールの製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019546083A Active JP7166527B2 (ja) | 2016-11-04 | 2017-11-02 | チップカード用電子モジュールの製造方法 |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP3535695B1 (ja) |
JP (2) | JP7166527B2 (ja) |
CN (1) | CN109983478A (ja) |
FR (1) | FR3058545B1 (ja) |
MY (1) | MY194581A (ja) |
PL (1) | PL3535695T3 (ja) |
WO (1) | WO2018083389A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003243673A (ja) | 2001-07-31 | 2003-08-29 | Kyocera Corp | 光半導体装置 |
JP2003289124A (ja) | 2002-03-28 | 2003-10-10 | Hitachi Ltd | 半導体モジュール |
US6677186B1 (en) | 1999-03-12 | 2004-01-13 | Gemplus | Method for making an electronic device such as a contactless card |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2743649B1 (fr) * | 1996-01-17 | 1998-04-03 | Gemplus Card Int | Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication |
JPH09240178A (ja) * | 1996-03-13 | 1997-09-16 | Citizen Watch Co Ltd | 通信icカードの製造方法 |
FR2775810B1 (fr) * | 1998-03-09 | 2000-04-28 | Gemplus Card Int | Procede de fabrication de cartes sans contact |
JP2000207521A (ja) | 1999-01-18 | 2000-07-28 | Toppan Printing Co Ltd | 複合icカ―ドとその製造方法 |
DE19940564C2 (de) * | 1999-08-26 | 2002-03-21 | Infineon Technologies Ag | Chipkartenmodul und diesen umfassende Chipkarte, sowie Verfahren zur Herstellung des Chipkartenmoduls |
FR2844621A1 (fr) * | 2002-09-13 | 2004-03-19 | A S K | Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee |
JP2006253430A (ja) | 2005-03-11 | 2006-09-21 | Renesas Technology Corp | 半導体装置およびその製造方法 |
DE102005058101B4 (de) * | 2005-12-05 | 2019-04-25 | Smartrac Ip B.V. | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
DE102006060719A1 (de) * | 2006-12-21 | 2008-06-26 | Infineon Technologies Ag | Chipkartenmodul und Verfahren zur Herstellung eines Chipkartenmoduls |
EP2605188A1 (fr) * | 2011-12-14 | 2013-06-19 | Gemalto SA | Procédé de fabrication de cartes à puce |
EP2608114A1 (fr) * | 2011-12-19 | 2013-06-26 | Gemalto SA | Procédé de fabrication d'un module à puce de circuit intégré protégé par pastille |
NL1039642C2 (nl) * | 2012-05-18 | 2013-11-20 | Willemsen | Chipkaart-inrichting en werkwijze voor het vervaardigen daarvan. |
FR2996944B1 (fr) * | 2012-10-15 | 2018-05-04 | Smart Packaging Solutions Sps | Module electronique simplifie pour carte a puce a double interface de communication |
-
2016
- 2016-11-04 FR FR1601576A patent/FR3058545B1/fr active Active
-
2017
- 2017-11-02 MY MYPI2019002436A patent/MY194581A/en unknown
- 2017-11-02 EP EP17808531.2A patent/EP3535695B1/fr active Active
- 2017-11-02 WO PCT/FR2017/000206 patent/WO2018083389A1/fr unknown
- 2017-11-02 JP JP2019546083A patent/JP7166527B2/ja active Active
- 2017-11-02 CN CN201780067843.5A patent/CN109983478A/zh active Pending
- 2017-11-02 PL PL17808531T patent/PL3535695T3/pl unknown
-
2022
- 2022-02-22 JP JP2022025254A patent/JP7273209B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6677186B1 (en) | 1999-03-12 | 2004-01-13 | Gemplus | Method for making an electronic device such as a contactless card |
JP2003243673A (ja) | 2001-07-31 | 2003-08-29 | Kyocera Corp | 光半導体装置 |
JP2003289124A (ja) | 2002-03-28 | 2003-10-10 | Hitachi Ltd | 半導体モジュール |
Also Published As
Publication number | Publication date |
---|---|
MY194581A (en) | 2022-12-02 |
PL3535695T3 (pl) | 2020-11-30 |
CN109983478A (zh) | 2019-07-05 |
EP3535695B1 (fr) | 2020-05-27 |
FR3058545B1 (fr) | 2018-10-26 |
JP2022078128A (ja) | 2022-05-24 |
JP2019536186A (ja) | 2019-12-12 |
JP7166527B2 (ja) | 2022-11-08 |
EP3535695A1 (fr) | 2019-09-11 |
WO2018083389A1 (fr) | 2018-05-11 |
FR3058545A1 (fr) | 2018-05-11 |
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