PL3535695T3 - Sposób wytwarzania modułu elektronicznego do karty z chipem - Google Patents
Sposób wytwarzania modułu elektronicznego do karty z chipemInfo
- Publication number
- PL3535695T3 PL3535695T3 PL17808531T PL17808531T PL3535695T3 PL 3535695 T3 PL3535695 T3 PL 3535695T3 PL 17808531 T PL17808531 T PL 17808531T PL 17808531 T PL17808531 T PL 17808531T PL 3535695 T3 PL3535695 T3 PL 3535695T3
- Authority
- PL
- Poland
- Prior art keywords
- manufacturing
- smart card
- electronic module
- module
- electronic
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1601576A FR3058545B1 (fr) | 2016-11-04 | 2016-11-04 | Procede de fabrication d'un module electronique pour carte a puce |
PCT/FR2017/000206 WO2018083389A1 (fr) | 2016-11-04 | 2017-11-02 | Procédé de fabrication d'un module électronique pour carte à puce |
EP17808531.2A EP3535695B1 (fr) | 2016-11-04 | 2017-11-02 | Procédé de fabrication d'un module électronique pour carte à puce |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3535695T3 true PL3535695T3 (pl) | 2020-11-30 |
Family
ID=57906667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL17808531T PL3535695T3 (pl) | 2016-11-04 | 2017-11-02 | Sposób wytwarzania modułu elektronicznego do karty z chipem |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP3535695B1 (pl) |
JP (2) | JP7166527B2 (pl) |
CN (1) | CN109983478A (pl) |
FR (1) | FR3058545B1 (pl) |
MY (1) | MY194581A (pl) |
PL (1) | PL3535695T3 (pl) |
WO (1) | WO2018083389A1 (pl) |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2743649B1 (fr) * | 1996-01-17 | 1998-04-03 | Gemplus Card Int | Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication |
JPH09240178A (ja) * | 1996-03-13 | 1997-09-16 | Citizen Watch Co Ltd | 通信icカードの製造方法 |
FR2775810B1 (fr) * | 1998-03-09 | 2000-04-28 | Gemplus Card Int | Procede de fabrication de cartes sans contact |
JP2000207521A (ja) | 1999-01-18 | 2000-07-28 | Toppan Printing Co Ltd | 複合icカ―ドとその製造方法 |
FR2790849B1 (fr) * | 1999-03-12 | 2001-04-27 | Gemplus Card Int | Procede de fabrication pour dispositif electronique du type carte sans contact |
DE19940564C2 (de) * | 1999-08-26 | 2002-03-21 | Infineon Technologies Ag | Chipkartenmodul und diesen umfassende Chipkarte, sowie Verfahren zur Herstellung des Chipkartenmoduls |
JP2003243673A (ja) * | 2001-07-31 | 2003-08-29 | Kyocera Corp | 光半導体装置 |
JP3726767B2 (ja) | 2002-03-28 | 2005-12-14 | 株式会社日立製作所 | 半導体モジュール |
FR2844621A1 (fr) * | 2002-09-13 | 2004-03-19 | A S K | Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee |
JP2006253430A (ja) | 2005-03-11 | 2006-09-21 | Renesas Technology Corp | 半導体装置およびその製造方法 |
DE102005058101B4 (de) * | 2005-12-05 | 2019-04-25 | Smartrac Ip B.V. | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
DE102006060719A1 (de) * | 2006-12-21 | 2008-06-26 | Infineon Technologies Ag | Chipkartenmodul und Verfahren zur Herstellung eines Chipkartenmoduls |
EP2605188A1 (fr) * | 2011-12-14 | 2013-06-19 | Gemalto SA | Procédé de fabrication de cartes à puce |
EP2608114A1 (fr) * | 2011-12-19 | 2013-06-26 | Gemalto SA | Procédé de fabrication d'un module à puce de circuit intégré protégé par pastille |
NL1039642C2 (nl) * | 2012-05-18 | 2013-11-20 | Willemsen | Chipkaart-inrichting en werkwijze voor het vervaardigen daarvan. |
FR2996944B1 (fr) * | 2012-10-15 | 2018-05-04 | Smart Packaging Solutions Sps | Module electronique simplifie pour carte a puce a double interface de communication |
-
2016
- 2016-11-04 FR FR1601576A patent/FR3058545B1/fr active Active
-
2017
- 2017-11-02 WO PCT/FR2017/000206 patent/WO2018083389A1/fr unknown
- 2017-11-02 MY MYPI2019002436A patent/MY194581A/en unknown
- 2017-11-02 CN CN201780067843.5A patent/CN109983478A/zh active Pending
- 2017-11-02 JP JP2019546083A patent/JP7166527B2/ja active Active
- 2017-11-02 PL PL17808531T patent/PL3535695T3/pl unknown
- 2017-11-02 EP EP17808531.2A patent/EP3535695B1/fr active Active
-
2022
- 2022-02-22 JP JP2022025254A patent/JP7273209B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP7273209B2 (ja) | 2023-05-12 |
JP2019536186A (ja) | 2019-12-12 |
FR3058545B1 (fr) | 2018-10-26 |
JP7166527B2 (ja) | 2022-11-08 |
JP2022078128A (ja) | 2022-05-24 |
CN109983478A (zh) | 2019-07-05 |
WO2018083389A1 (fr) | 2018-05-11 |
MY194581A (en) | 2022-12-02 |
EP3535695A1 (fr) | 2019-09-11 |
EP3535695B1 (fr) | 2020-05-27 |
FR3058545A1 (fr) | 2018-05-11 |
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