PL3059698T3 - Sposób wytwarzania jednostronnego modułu elektronicznego zawierającego obszary wzajemnego połączenia - Google Patents

Sposób wytwarzania jednostronnego modułu elektronicznego zawierającego obszary wzajemnego połączenia

Info

Publication number
PL3059698T3
PL3059698T3 PL15305271T PL15305271T PL3059698T3 PL 3059698 T3 PL3059698 T3 PL 3059698T3 PL 15305271 T PL15305271 T PL 15305271T PL 15305271 T PL15305271 T PL 15305271T PL 3059698 T3 PL3059698 T3 PL 3059698T3
Authority
PL
Poland
Prior art keywords
interconnection
manufacturing
electronic module
module containing
containing areas
Prior art date
Application number
PL15305271T
Other languages
English (en)
Inventor
Stéphane OTTOBON
Lucile Dossetto
Luc Charles
Thierry Laviron
Original Assignee
Thales Dis France Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales Dis France Sa filed Critical Thales Dis France Sa
Publication of PL3059698T3 publication Critical patent/PL3059698T3/pl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
PL15305271T 2015-02-20 2015-02-20 Sposób wytwarzania jednostronnego modułu elektronicznego zawierającego obszary wzajemnego połączenia PL3059698T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15305271.7A EP3059698B1 (fr) 2015-02-20 2015-02-20 Procédé de fabrication d'un module électronique simple face comprenant des zones d'interconnexion

Publications (1)

Publication Number Publication Date
PL3059698T3 true PL3059698T3 (pl) 2021-10-25

Family

ID=52648959

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15305271T PL3059698T3 (pl) 2015-02-20 2015-02-20 Sposób wytwarzania jednostronnego modułu elektronicznego zawierającego obszary wzajemnego połączenia

Country Status (13)

Country Link
US (1) US10282652B2 (pl)
EP (2) EP3869409A1 (pl)
JP (2) JP6453472B2 (pl)
KR (1) KR102014621B1 (pl)
CN (1) CN107111779B (pl)
AU (1) AU2016221971B2 (pl)
CA (1) CA2968070C (pl)
ES (1) ES2867102T3 (pl)
MX (1) MX378922B (pl)
PL (1) PL3059698T3 (pl)
SG (1) SG11201703935TA (pl)
WO (1) WO2016131682A1 (pl)
ZA (1) ZA201703296B (pl)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3047101B1 (fr) 2016-01-26 2022-04-01 Linxens Holding Procede de fabrication d’un module de carte a puce et d’une carte a puce
US11264314B2 (en) * 2019-09-27 2022-03-01 International Business Machines Corporation Interconnection with side connection to substrate
FR3113324B1 (fr) 2020-08-04 2024-05-24 Smart Packaging Solutions Module electronique pour carte contenant au moins une antenne et son procede de fabrication
KR102886403B1 (ko) 2020-09-07 2025-11-17 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 지문인식용 스마트 카드

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2716281B1 (fr) 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
JPH08107123A (ja) 1994-10-04 1996-04-23 Hitachi Ltd 半導体集積回路装置の製造方法、その製造装置および半導体集積回路装置
FR2784210B1 (fr) * 1998-10-02 2001-09-14 Gemplus Card Int Carte a puce sans contact comportant des moyens d'inhibition
JP2002312746A (ja) * 2001-04-11 2002-10-25 Toshiba Corp Ｉｃモジュール及びその製造方法、並びに該ｉｃモジュールを装着した携帯可能電子装置
JP4422494B2 (ja) * 2003-05-07 2010-02-24 大日本印刷株式会社 Ｉｃカードおよびｓｉｍ
JP4996179B2 (ja) * 2006-08-31 2012-08-08 株式会社東芝 Ｉｃカード、及びｉｃカードの製造方法
JP2010072930A (ja) * 2008-09-18 2010-04-02 Toshiba Corp Ｉｃモジュール、及びこれを用いたｉｃカード
JP2011170525A (ja) 2010-02-17 2011-09-01 Toshiba Corp カード基材及びこのカード基材を有するｉｃカード
EP2420960A1 (fr) 2010-08-17 2012-02-22 Gemalto SA Procédé de fabrication d'un dispositif électronique comportant un module indémontable et dispositif obtenu
JP2012043341A (ja) 2010-08-23 2012-03-01 Toppan Printing Co Ltd Ｉｃモジュールおよびそれを用いたｉｃカード
BR112013019548A2 (pt) * 2011-01-31 2017-07-04 American Bank Note Co cartão inteligente de interface dupla
EP2575086A1 (fr) * 2011-09-27 2013-04-03 Gemalto SA Procédé de connexion d'un microcircuit à des zones conductrices noyées dans un support
JP5990894B2 (ja) * 2011-11-17 2016-09-14 富士通セミコンダクター株式会社 半導体モジュール、半導体モジュールの製造方法及びカード
FR2998395B1 (fr) 2012-11-21 2016-01-01 Smart Packaging Solutions Sps Module electronique simple face pour carte a puce a double interface de communication
EP2736001A1 (fr) * 2012-11-27 2014-05-28 Gemalto SA Module électronique à interface de communication tridimensionnelle

Also Published As

Publication number Publication date
JP6453472B2 (ja) 2019-01-16
AU2016221971B2 (en) 2019-01-31
EP3869409A1 (fr) 2021-08-25
EP3059698A1 (fr) 2016-08-24
US10282652B2 (en) 2019-05-07
AU2016221971A1 (en) 2017-07-20
SG11201703935TA (en) 2017-06-29
JP2019071435A (ja) 2019-05-09
MX378922B (es) 2025-03-11
JP2018505553A (ja) 2018-02-22
KR102014621B1 (ko) 2019-08-26
WO2016131682A1 (fr) 2016-08-25
CA2968070C (fr) 2021-05-11
EP3059698B1 (fr) 2021-03-31
ZA201703296B (en) 2019-06-26
CA2968070A1 (fr) 2016-08-25
CN107111779A (zh) 2017-08-29
CN107111779B (zh) 2020-09-15
ES2867102T3 (es) 2021-10-20
KR20170081693A (ko) 2017-07-12
BR112017015014A2 (pt) 2018-01-23
MX2017006130A (es) 2018-02-09
US20170372186A1 (en) 2017-12-28
JP6756805B2 (ja) 2020-09-16

Similar Documents

Publication Publication Date Title
IL253334B (en) Electronic component
PL3519021T3 (pl) Moduł elektroniczny do monitorowania urządzeń wstrzykujących
EP3322265A4 (en) MANUFACTURING PROCESS FOR PCB
EP2916627A4 (en) METHOD FOR PRODUCING A CERAMIC CONDUCTOR PLATE
PL3567527T3 (pl) Sposób wytwarzania obwodu dla modułu karty chipowej i obwód dla modułu karty chipowej
PL3637746T3 (pl) Urządzenie elektroniczne zawierające konstrukcję wodoodporną
HRP20251584T1 (hr) Građevna ploča i metoda proizvodnje građevne ploče
HUE051760T2 (hu) Eljárás félvezetõ modul elõállítására
DK3325978T3 (da) Automatisk depotsmodul
IL248673A0 (en) Electronic tapered connector
SG11201610771SA (en) Method of manufacturing a substrate
ZA201804163B (en) Method of tagging a substrate
PL3294510T3 (pl) Sposób wytwarzania paneli zawierających wgłębienia
DK2893781T3 (da) Fremgangsmåde til fremstilling af fleksible kredsløb
EP3104429A4 (en) WIRING MODULE
PL3076375T3 (pl) Elektroniczny moduł plomby
TWI563613B (en) Method of manufacturing electronic package module and electronic package module manufactured by the same
DK3220421T3 (da) Fremgangsmåde til fremstilling af trykte fotovoltaiske moduler
DK2983922T3 (da) Fremgangsmåde til fremstilling af digitalt printede substrater
EP3820263A4 (en) ELECTRONIC COMPONENT MODULE
PL3059698T3 (pl) Sposób wytwarzania jednostronnego modułu elektronicznego zawierającego obszary wzajemnego połączenia
EP2973686A4 (en) METHOD FOR PRODUCING A STACKING CHIP CROPPING
DK3055113T3 (da) Fremgangsmåde til fremstilling af en gipskartonplade
SG11201802818VA (en) Method of manufacturing a germanium-on-insulator substrate
DK3319924T3 (da) Fremgangsmåde til fremstilling af en plade