PL3567527T3 - Sposób wytwarzania obwodu dla modułu karty chipowej i obwód dla modułu karty chipowej - Google Patents

Sposób wytwarzania obwodu dla modułu karty chipowej i obwód dla modułu karty chipowej

Info

Publication number
PL3567527T3
PL3567527T3 PL19183469T PL19183469T PL3567527T3 PL 3567527 T3 PL3567527 T3 PL 3567527T3 PL 19183469 T PL19183469 T PL 19183469T PL 19183469 T PL19183469 T PL 19183469T PL 3567527 T3 PL3567527 T3 PL 3567527T3
Authority
PL
Poland
Prior art keywords
chip
circuit
card module
manufacturing
card
Prior art date
Application number
PL19183469T
Other languages
English (en)
Inventor
Christophe Mathieu
Bertrand Hoveman
Original Assignee
Linxens Holding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linxens Holding filed Critical Linxens Holding
Publication of PL3567527T3 publication Critical patent/PL3567527T3/pl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07733—Physical layout of the record carrier the record carrier containing at least one further contact interface not conform ISO-7816
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
PL19183469T 2014-05-14 2015-05-13 Sposób wytwarzania obwodu dla modułu karty chipowej i obwód dla modułu karty chipowej PL3567527T3 (pl)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
FR1454287A FR3021145B1 (fr) 2014-05-14 2014-05-14 Procede de fabrication d'un circuit pour module de carte a puce et circuit pour module de carte a puce
EP19183469.6A EP3567527B1 (fr) 2014-05-14 2015-05-13 Procédé de fabrication d'un circuit pour module de carte à puce et circuit pour module de carte à puce
PCT/FR2015/051254 WO2015173514A1 (fr) 2014-05-14 2015-05-13 Procédé de fabrication d'un circuit pour module de carte à puce et circuit pour module de carte à puce
EP15750796.3A EP3143557B1 (fr) 2014-05-14 2015-05-13 Procédé de fabrication d'un circuit pour module de carte à puce et circuit pour module de carte à puce

Publications (1)

Publication Number Publication Date
PL3567527T3 true PL3567527T3 (pl) 2022-05-02

Family

ID=51518927

Family Applications (2)

Application Number Title Priority Date Filing Date
PL19183469T PL3567527T3 (pl) 2014-05-14 2015-05-13 Sposób wytwarzania obwodu dla modułu karty chipowej i obwód dla modułu karty chipowej
PL15750796T PL3143557T3 (pl) 2014-05-14 2015-05-13 Sposób wytwarzania obwodu dla modułu karty inteligentnej i obwód dla modułu karty inteligentnej

Family Applications After (1)

Application Number Title Priority Date Filing Date
PL15750796T PL3143557T3 (pl) 2014-05-14 2015-05-13 Sposób wytwarzania obwodu dla modułu karty inteligentnej i obwód dla modułu karty inteligentnej

Country Status (8)

Country Link
US (2) US10417548B2 (pl)
EP (2) EP3143557B1 (pl)
KR (2) KR102296702B1 (pl)
CN (2) CN113469320B (pl)
ES (2) ES2901301T3 (pl)
FR (1) FR3021145B1 (pl)
PL (2) PL3567527T3 (pl)
WO (1) WO2015173514A1 (pl)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3034552B1 (fr) * 2015-04-02 2017-05-05 Oberthur Technologies Module dual pour carte duale a microcircuit
EP3151167B1 (en) * 2015-09-30 2020-05-20 Nxp B.V. Dual-interface ic card module
FR3047101B1 (fr) 2016-01-26 2022-04-01 Linxens Holding Procede de fabrication d’un module de carte a puce et d’une carte a puce
FR3049739B1 (fr) * 2016-03-30 2021-03-12 Linxens Holding Procedes de fabrication de cartes a puce et de supports d’antenne pour carte a puce
FR3051063B1 (fr) 2016-05-06 2021-02-12 Linxens Holding Procede de fabrication de cartes a puce et carte a puce obtenue par ce procede
DE102016110780B4 (de) * 2016-06-13 2024-10-10 Infineon Technologies Austria Ag Chipkartenmodul und Verfahren zum Herstellen eines Chipkartenmoduls
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US9997005B1 (en) 2016-12-09 2018-06-12 Capital One Services, Llc Soft touch resin and transaction card comprising the same
WO2019045638A1 (en) * 2017-08-28 2019-03-07 Smartflex Technology Pte Ltd INTEGRATED CIRCUIT MODULES AND INTELLIGENT CARDS INCORPORATING THEM
MX2021012822A (es) 2017-09-07 2023-03-02 Composecure Llc Tarjeta de transaccion con componentes electronicos incorporados y procedimiento para su fabricacion.
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
MX2020004012A (es) 2017-10-18 2020-09-25 Composecure Llc Tarjeta de transacción de metal, cerámica o recubierta con cerámica con ventana o patrón de ventana y retroiluminación opcional.
CN118171678A (zh) * 2018-02-01 2024-06-11 华为技术有限公司 存储卡和终端
US11088087B2 (en) * 2018-07-25 2021-08-10 Stmicroelectronics, Inc. Micro module with a support structure
FR3086098B1 (fr) * 2018-09-18 2020-12-04 Smart Packaging Solutions Procede de fabrication d'un module electronique pour objet portatif
TWI719866B (zh) * 2020-03-25 2021-02-21 矽品精密工業股份有限公司 電子封裝件及其支撐結構與製法
CN111626395A (zh) * 2020-05-29 2020-09-04 东信和平科技股份有限公司 一种双界面安全芯片卡及制作方法
KR20220032774A (ko) * 2020-09-08 2022-03-15 엘지이노텍 주식회사 스마트 ic 기판, 스마트 ic 모듈 및 이를 포함하는 ic 카드
JP7546475B2 (ja) * 2020-12-22 2024-09-06 富士フイルム株式会社 処理回路モジュール、及び非接触式通信媒体の製造方法
FR3119692B1 (fr) * 2021-02-08 2023-12-22 Linxens Holding Procédé de fabrication de modules de carte à puce et bande de matériau flexible supportant de tels modules

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
EP0676716A1 (fr) 1994-03-07 1995-10-11 Eric Bauer Support portable d'informations numériques
US5898215A (en) * 1996-12-16 1999-04-27 Motorola, Inc. Microelectronic assembly with connection to a buried electrical element, and method for forming same
FR2810768B1 (fr) 2000-06-26 2003-11-28 Gemplus Card Int Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede
AU2003257688A1 (en) * 2002-08-26 2004-03-11 Dai Nippon Printing Co., Ltd. Sim, sim holder, ic module, ic card and ic card holder
KR20040049981A (ko) * 2002-12-06 2004-06-14 (주)제이티 호일 적층을 통한 ｉｃ카드 제조방법
FR2861201B1 (fr) * 2003-10-17 2006-01-27 Oberthur Card Syst Sa Procede de fabrication d'une carte a double interface, et carte a microcircuit ainsi obtenue.
FR2880160B1 (fr) 2004-12-28 2007-03-30 K Sa As Module electronique double face pour carte a puce hybride
EP1816593A1 (fr) * 2006-02-03 2007-08-08 Axalto SA Connecteur de carte a puce
CN101416206A (zh) * 2006-03-30 2009-04-22 王子制纸株式会社 Ic模块、ic引入线以及ic封装体
EP1887494A1 (fr) * 2006-07-31 2008-02-13 Axalto SA Dispositif électronique disposant de plusieurs interfaces de communication court-circuitables
US8366009B2 (en) * 2010-08-12 2013-02-05 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US9112272B2 (en) * 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
US8789762B2 (en) * 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
EP2575086A1 (fr) * 2011-09-27 2013-04-03 Gemalto SA Procédé de connexion d'un microcircuit à des zones conductrices noyées dans un support
FR2980875B1 (fr) * 2011-10-03 2014-06-20 Oberthur Technologies Dispositif a microcircuit equipe de plages de contact et procede de fabrication d'un tel dispositif
US8628018B2 (en) * 2012-04-17 2014-01-14 Nxp, B.V. RFID circuit and method
US20140042230A1 (en) * 2012-08-09 2014-02-13 Infineon Technologies Ag Chip card module with separate antenna and chip card inlay using same
CN103176676B (zh) * 2013-02-28 2015-10-14 合肥京东方光电科技有限公司 一种触摸屏触摸点定位检测电路、触摸屏及显示装置
US9390365B2 (en) * 2014-04-10 2016-07-12 American Banknote Corporation Integrated circuit module for a dual-interface smart card

Also Published As

Publication number Publication date
CN106415613A (zh) 2017-02-15
US20190362213A1 (en) 2019-11-28
FR3021145B1 (fr) 2018-08-31
US10417548B2 (en) 2019-09-17
US20170270398A1 (en) 2017-09-21
EP3143557A1 (fr) 2017-03-22
CN113469320B (zh) 2022-08-23
WO2015173514A1 (fr) 2015-11-19
CN106415613B (zh) 2021-07-09
KR20200009135A (ko) 2020-01-29
KR20170033275A (ko) 2017-03-24
CN113469320A (zh) 2021-10-01
ES2745806T3 (es) 2020-03-03
EP3143557B1 (fr) 2019-07-03
KR102296702B1 (ko) 2021-08-31
FR3021145A1 (fr) 2015-11-20
PL3143557T3 (pl) 2019-11-29
ES2901301T3 (es) 2022-03-22
KR102069334B1 (ko) 2020-02-11
US10810477B2 (en) 2020-10-20
EP3567527A1 (fr) 2019-11-13
EP3567527B1 (fr) 2021-10-13

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