HUE051760T2 - Eljárás félvezetõ modul elõállítására - Google Patents

Eljárás félvezetõ modul elõállítására

Info

Publication number
HUE051760T2
HUE051760T2 HUE14172876A HUE14172876A HUE051760T2 HU E051760 T2 HUE051760 T2 HU E051760T2 HU E14172876 A HUE14172876 A HU E14172876A HU E14172876 A HUE14172876 A HU E14172876A HU E051760 T2 HUE051760 T2 HU E051760T2
Authority
HU
Hungary
Prior art keywords
manufacturing
semiconductor module
semiconductor
module
Prior art date
Application number
HUE14172876A
Other languages
English (en)
Inventor
Ronald Eisele
Anton-Zoran Miric
Frank Krueger
Wolfgang Schmitt
Original Assignee
Heraeus Deutschland Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Deutschland Gmbh & Co Kg filed Critical Heraeus Deutschland Gmbh & Co Kg
Publication of HUE051760T2 publication Critical patent/HUE051760T2/hu

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
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    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
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    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H01L2224/732—Location after the connecting process
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00012—Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
HUE14172876A 2014-06-18 2014-06-18 Eljárás félvezetõ modul elõállítására HUE051760T2 (hu)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP14172876.6A EP2958139B1 (de) 2014-06-18 2014-06-18 Verfahren zur Herstellung eines Halbleitermoduls

Publications (1)

Publication Number Publication Date
HUE051760T2 true HUE051760T2 (hu) 2021-03-29

Family

ID=50942602

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE14172876A HUE051760T2 (hu) 2014-06-18 2014-06-18 Eljárás félvezetõ modul elõállítására

Country Status (7)

Country Link
US (2) US20170133291A1 (hu)
EP (1) EP2958139B1 (hu)
JP (1) JP6545193B2 (hu)
KR (1) KR101899740B1 (hu)
CN (1) CN106415820B (hu)
HU (1) HUE051760T2 (hu)
WO (1) WO2015193035A1 (hu)

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DE102017207424A1 (de) * 2017-05-03 2018-11-08 Robert Bosch Gmbh Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse
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US11091394B2 (en) 2017-07-31 2021-08-17 Heraeus Deutschland GmbH & Co. KG Composition for producing an aqueous coating mass
WO2019025034A1 (de) 2017-07-31 2019-02-07 Heraeus Deutschland GmbH & Co. KG Zusammensetzung zur herstellung einer wässrigen umhüllungsmasse
CN109727925A (zh) * 2017-10-31 2019-05-07 华润微电子（重庆）有限公司 一种提高塑封模块可靠性的封装结构及方法
WO2019091604A1 (de) 2017-11-08 2019-05-16 Heraeus Deutschland GmbH & Co. KG Zusammensetzung zur herstellung einer wässrigen umhüllungsmasse
US20190357386A1 (en) * 2018-05-16 2019-11-21 GM Global Technology Operations LLC Vascular polymeric assembly
DE102018214641B4 (de) * 2018-08-29 2022-09-22 Robert Bosch Gmbh Vergussmasse, Verfahren zum elektrischen Isolieren eines elektrischen oder elektronischen Bauteils unter Verwendung der Vergussmasse, elektrisch isoliertes Bauteil, hergestellt über ein solches Verfahren und Verwendung der Vergussmasse
DE102018215694A1 (de) * 2018-09-14 2020-03-19 Robert Bosch Gmbh Vergussmasse, elektrisch isoliertes elektrisches oder elektronisches Bauteil und Verfahren zu dessen elektrischer Isolierung
US11682606B2 (en) * 2019-02-07 2023-06-20 Ford Global Technologies, Llc Semiconductor with integrated electrically conductive cooling channels
CN109824367A (zh) * 2019-02-21 2019-05-31 国网河南省电力公司社旗县供电公司 一种碳化硅基复合电路板及其制备方法
CN116472601A (zh) * 2020-12-23 2023-07-21 贺利氏德国有限两合公司 用于制造包封半导体管芯和/或包封半导体封装的方法
EP4095894A1 (de) 2021-05-26 2022-11-30 Heraeus Deutschland GmbH & Co. KG Mit einer umhüllung aus einer hydraulisch gehärteten anorganischen zementzusammensetzung versehenes elektronikobjekt
EP4245737A1 (de) 2022-03-18 2023-09-20 Heraeus Deutschland GmbH & Co. KG Hydraulisch härtbare anorganische zementzusammensetzung
EP4273110A1 (de) 2022-05-02 2023-11-08 Heraeus Deutschland GmbH & Co. KG Hydraulisch härtbare anorganische zementzusammensetzung

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JP2017520111A (ja) 2017-07-20
US20180261518A1 (en) 2018-09-13
WO2015193035A1 (de) 2015-12-23
CN106415820A (zh) 2017-02-15
EP2958139B1 (de) 2020-08-05
EP2958139A1 (de) 2015-12-23
CN106415820B (zh) 2019-12-03
KR101899740B1 (ko) 2018-09-17
JP6545193B2 (ja) 2019-07-17
US10593608B2 (en) 2020-03-17
US20170133291A1 (en) 2017-05-11

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