MY194581A - Method for manufacturing an electronic module for a smart card - Google Patents

Method for manufacturing an electronic module for a smart card

Info

Publication number
MY194581A
MY194581A MYPI2019002436A MYPI2019002436A MY194581A MY 194581 A MY194581 A MY 194581A MY PI2019002436 A MYPI2019002436 A MY PI2019002436A MY PI2019002436 A MYPI2019002436 A MY PI2019002436A MY 194581 A MY194581 A MY 194581A
Authority
MY
Malaysia
Prior art keywords
smart card
manufacturing
face
electronic module
contacts
Prior art date
Application number
MYPI2019002436A
Inventor
Bernard Calvas
Didier Livrati
Katia Leiva
Original Assignee
Smart Packaging Solutions S P S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smart Packaging Solutions S P S filed Critical Smart Packaging Solutions S P S
Publication of MY194581A publication Critical patent/MY194581A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention relates to a method for manufacturing an electronic module for a smart card, said module comprising, on the one hand, a substrate (11) having on a first face (8) a terminal block of electric contacts enabling operation by contact with the corresponding contacts of a smart card reader, and comprising an antenna (3) provided with at least one coil, a microelectronic chip (2), and metal connection wires (4, 5, 6) constituting protruding loops relative to a second face (7) and connecting the pads of the microelectronic chip (2) to corresponding pads of the antenna (3) and/or the terminal block of contacts, characterised in that it comprises a step, after wiring the connection wires (4, 5, 6), of covering the face of the module located on the side of the chip (2), with a cover (13) which flattens the wire loops (4, 5, 6) in order to reduce the height thereof.
MYPI2019002436A 2016-11-04 2017-11-02 Method for manufacturing an electronic module for a smart card MY194581A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1601576A FR3058545B1 (en) 2016-11-04 2016-11-04 METHOD FOR MANUFACTURING AN ELECTRONIC MODULE FOR A CHIP CARD
PCT/FR2017/000206 WO2018083389A1 (en) 2016-11-04 2017-11-02 Method for manufacturing an electronic module for a smart card

Publications (1)

Publication Number Publication Date
MY194581A true MY194581A (en) 2022-12-02

Family

ID=57906667

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019002436A MY194581A (en) 2016-11-04 2017-11-02 Method for manufacturing an electronic module for a smart card

Country Status (7)

Country Link
EP (1) EP3535695B1 (en)
JP (2) JP7166527B2 (en)
CN (1) CN109983478A (en)
FR (1) FR3058545B1 (en)
MY (1) MY194581A (en)
PL (1) PL3535695T3 (en)
WO (1) WO2018083389A1 (en)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2743649B1 (en) * 1996-01-17 1998-04-03 Gemplus Card Int CONTACTLESS ELECTRONIC MODULE, ELECTRONIC LABEL CARD INCORPORATING THE SAME, AND METHODS OF MAKING SAME
JPH09240178A (en) * 1996-03-13 1997-09-16 Citizen Watch Co Ltd Manufacture of communication ic card
FR2775810B1 (en) * 1998-03-09 2000-04-28 Gemplus Card Int NON-CONTACT CARD MANUFACTURING PROCESS
JP2000207521A (en) 1999-01-18 2000-07-28 Toppan Printing Co Ltd Composite ic card and its manufacture
FR2790849B1 (en) * 1999-03-12 2001-04-27 Gemplus Card Int MANUFACTURING METHOD FOR CONTACTLESS CARD TYPE ELECTRONIC DEVICE
DE19940564C2 (en) * 1999-08-26 2002-03-21 Infineon Technologies Ag Chip card module and this comprehensive chip card, as well as methods for producing the chip card module
JP2003243673A (en) * 2001-07-31 2003-08-29 Kyocera Corp Optical semiconductor device
JP3726767B2 (en) 2002-03-28 2005-12-14 株式会社日立製作所 Semiconductor module
FR2844621A1 (en) * 2002-09-13 2004-03-19 A S K Method for manufacturing without contact or hybrid integrated circuit card, comprises application of two thermoplastic layers under temperature and pressure followed by two hot pressed plastic layers
JP2006253430A (en) 2005-03-11 2006-09-21 Renesas Technology Corp Semiconductor device and its manufacturing method
DE102005058101B4 (en) * 2005-12-05 2019-04-25 Smartrac Ip B.V. Chip card and method for producing a chip card
DE102006060719A1 (en) * 2006-12-21 2008-06-26 Infineon Technologies Ag Chip card module comprises substrate and two sides, where conducting structures are placed on sides of substrate in adhesion free manner, and chip is arranged on sides of substrate
EP2605188A1 (en) * 2011-12-14 2013-06-19 Gemalto SA Method for manufacturing chip cards
EP2608114A1 (en) * 2011-12-19 2013-06-26 Gemalto SA Method for producing a mould with an integrated circuit chip protected by a pad
NL1039642C2 (en) * 2012-05-18 2013-11-20 Willemsen CHIP CARD DEVICE AND METHOD FOR MANUFACTURING THEM.
FR2996944B1 (en) * 2012-10-15 2018-05-04 Smart Packaging Solutions Sps SIMPLIFIED ELECTRONIC MODULE FOR A CHIP CARD WITH A DOUBLE COMMUNICATION INTERFACE

Also Published As

Publication number Publication date
JP7273209B2 (en) 2023-05-12
JP2019536186A (en) 2019-12-12
FR3058545B1 (en) 2018-10-26
PL3535695T3 (en) 2020-11-30
JP7166527B2 (en) 2022-11-08
JP2022078128A (en) 2022-05-24
CN109983478A (en) 2019-07-05
WO2018083389A1 (en) 2018-05-11
EP3535695A1 (en) 2019-09-11
EP3535695B1 (en) 2020-05-27
FR3058545A1 (en) 2018-05-11

Similar Documents

Publication Publication Date Title
US9997855B2 (en) Pressure contact type connector and manufacturing method of the same
PH12015500827A1 (en) Simplified electronic module for a smart card with a dual communication interface
US10170900B2 (en) Electrical connection box
MY151796A (en) Double interface communication electronic module, in particular for a chip card
PH12018500683B1 (en) Method for embedding integrated circuit flip chip
WO2008129547A3 (en) Method and system for manufacture of an electronic interface card
MY151844A (en) Chip card with a dual communication interface
MY141371A (en) Smart card body, smart card and manufacturing process for same
US9792543B2 (en) Transponder layer and method for the production thereof
WO2008042932A3 (en) Interdigitated leadfingers
US20110074005A1 (en) Semiconductor device, method for fabricating a semiconductor device and lead frame, comprising a bent contact section
CN106981471B (en) Lead frame assembly
MX2018009123A (en) Method for manufacturing a smart card module and a smart card.
MY194581A (en) Method for manufacturing an electronic module for a smart card
US8497579B1 (en) Semiconductor packaging method and structure thereof
CN105470223B (en) Power semiconductor modular device
SG138501A1 (en) Lead frames, microelectronic devices with lead frames, and methods for manufacturing lead frames and microelectronic devices with lead frames
EP4050516A3 (en) Card body for a smart card, smart card and method of embedding a wire
CN105609441A (en) Method for manufacturing semiconductor device
US8927343B2 (en) Package process
TH1801003214A (en) Methods for embedding an integrated circuit flipchip
CN108701921A (en) Sim card holder and sim card
CN114830440A (en) Contact element for contacting an electrical component and electrical component
SG191464A1 (en) Semiconductor packaging method and structure thereof
KR20110054109A (en) Epitaxy coil on chip and the manufacture method