CN109983478A - The manufacturing method of electronic module for chip card - Google Patents

The manufacturing method of electronic module for chip card Download PDF

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Publication number
CN109983478A
CN109983478A CN201780067843.5A CN201780067843A CN109983478A CN 109983478 A CN109983478 A CN 109983478A CN 201780067843 A CN201780067843 A CN 201780067843A CN 109983478 A CN109983478 A CN 109983478A
Authority
CN
China
Prior art keywords
substrate
cap rock
module
metal layer
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780067843.5A
Other languages
Chinese (zh)
Inventor
K.莱瓦
D.利夫拉蒂
B.卡尔瓦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smart Packaging Solutions SAS
Original Assignee
Smart Packaging Solutions SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smart Packaging Solutions SAS filed Critical Smart Packaging Solutions SAS
Publication of CN109983478A publication Critical patent/CN109983478A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The present invention relates to the manufacturing methods of the electronic module for chip card, the module includes substrate (11) on one side, substrate (11) has on the first face (8) to be made it possible to contact the electric contact terminal to operate by the correspondence contact with smart card reader, and including the antenna (3) with an at least circle, microelectronic chip (2) and metal contact wires (4, 5, 6), metal contact wires (4, 5, 6) ring relative to the second face (7) protrusion is constituted, and the contact of microelectronic chip (2) is connected to the correspondence contact and/or contact terminal of antenna (3), it is characterized in that, to connecting line (4, 5, 6) after being routed, method includes the following steps: with the face positioned at chip (2) side of cap rock (13) overlay module, cap rock (13) is by coating line (4 , 5,6) ring, to reduce its height.

Description

The manufacturing method of electronic module for chip card
Technical field
The present invention relates to contact-type electronic module or electronic module with contact and contactless double interface communication Manufacturing method, and the chip card comprising this module.
Background technique
The existing microelectronic modules for being largely used to chip card in the prior art, for contact operation, contactless behaviour Work or contact and contactless hybrid manipulation.
Most of cards with double interface communication include: according to prior art
Electronic module comprising microelectronic chip, for what is contacted with the corresponding terminal of contact chip card reader Contact connection terminal and so as to it is connected to two contacts positioned at the back side of antenna；
To block made of plastic material, including antenna；
Make it possible to realize the conductive material of the connection between electronic module and antenna.
In order to manufacture such module, it is necessary to chip is deposited on substrate, then usually using very thin connecting line To be electrically connected between the corresponding terminal of chip and the communication interface of module.
Then, need to be protected contact and the connecting line of chip with a polymerizable clad resin of drop.Then, this drop of being exposed to the sun is set Rouge is so that it polymerize.Then it needs that about one angel's resin is waited to complete its crosslinking, the heat treatment then lasted for hours.
Finally, by binder deposition on a face of module, and module is glued in the cavity of card.
When this drop clad resin solidification, it still has the shape heaved.Then it must be ground module, so that it is again With required thickness.
It was noticed that all these operations are complex and time-consuming, may be up to 5 days in total.
Summary of the invention
Goal of the invention
Therefore, general purpose of the invention be propose it is a kind of without disadvantages mentioned above for contact chip card or for having The manufacturing method of the electronic module of the chip card of contact and contactless double interface communication.
It is another object of the present invention to propose that a kind of manufacturing method of electronic module, this method make it possible to be greatly decreased system Quantity and relevant cost and the duration of step are made, but the reliability water usually obtained with known method will not be damaged It is flat.
Summary of the invention
The principle of the invention lies in covered with material layer and caused by line after the stage for being connected to electric contact by connecting line The ring with thickness surplus, this material layer enough firmly to force down ring and reduce the thickness of product, but enough It is flexible so that connecting line be embedded in wherein without generate thickness surplus.
Therefore, subject of the present invention is a kind of manufacturing method of electronic module for chip card, and the module includes base Plate, at least one side of the substrate include metal layer, and the substrate has cavity, and microelectronic chip is fixed in the cavity, The microelectronic chip has output terminal, for being connected to electric contact terminal or being connected to the antenna of chip card, the connection It is realized by metal contact wires, the metal contact wires constitute the ring of the face protrusion relative to substrate, which is characterized in that institute Method is stated after the wiring of connecting line the following steps are included: covering the face of the module including cavity with cap rock, the cap rock By the ring of the line of coating protrusion, to reduce its height and they pressed to the face of substrate.
It is equally applicable to the module for two metal layers that manufacture has positioned at substrate two sides according to the method for the present invention, or Module with the single metal layer for being located at substrate unilateral side.
Therefore, when electronic module includes positioned at the upper metal layer and lower metal layer of substrate two sides, connecting line is formed relatively In the ring of upper metal layer protrusion, this method proposes that line will be pressed on the upper metal layer by cap rock.
But when electronic module only includes lower metal layer, connecting line forms the ring relative to substrate bumps, the party Method proposes that cap rock will directly bear against line on the substrate.
According to an aspect of the present invention, the cap rock is made with extendable plastic material, enough firmly to fulfil its lid The effect of layer, and in the sufficiently flexible thickness to allow line to be mounted to cap rock to a certain degree, this helps to maintain them at Its original position.
The electronic module that subject of the present invention is obtained also by the above method, and including this improvement and the electricity simplified The chip card of submodule.
Detailed description of the invention
Other features and advantages of the present invention will be shown after having read the detailed description and the accompanying drawings, in which:
- Fig. 1 is to overlook the electronic module shown for chip card；
- Fig. 2 is the cross-sectional view of the electronic module of Fig. 1, and which show the drop of resin through being ground according to known manufacturing method；
- Fig. 3 is the cross-sectional view of the electronic module of Fig. 1 before coating connecting line；
- Fig. 4 is the cross-sectional view of the electronic module of Fig. 2 after coating connecting line according to the method for the present invention；
- Fig. 5 A, 5B and 5C show three kind mosaic modes of the connecting line in module confining bed with the section view amplified；
- Fig. 6 is to show to be applied to correspond to cuing open for the not module modification of the contact module of antenna according to the method for the present invention View.
Specific embodiment
The top view of the microelectronic modules 1 for contactless chip card is shown in FIG. 1.The module 1 generally includes Cavity, the bottom of the cavity be the receiving plane of microelectronic chip 2, the circle of antenna 3, chip interface communication each contact between Connecting line 4,5,6 and antenna 3 correspondence contact.
The cross-sectional view of Fig. 2 is formed along the connecting line 4,5,6 of Fig. 1.It illustrates in greater detail the structure of module, should Structure is obtained with traditional manufacturing method.Therefore, chip 2 is glued to metal layer 8, and metal layer 8 also includes the circle of antenna 3.
In the example shown in Fig. 2 to 4, which includes two metal layers 7,8 and positioned at 11 two sides of insulating substrate Adhesive 10.The terminal (not shown) of the communication interface of chip 2 is connected to hard contact and/or the company of module by line 4,5,6 It is connected to the terminal of antenna 3.The metal covering of upper metal layer 7 is connected to the joint face of lower metal layer 8 by connecting line 6.For this purpose, it passes through well 14。
Tool is for the chip with contact and contactless double interface communication there are two this structure of metal layer 7,8 The typical structure of the module of card.
As can be seen that connecting line 4,5,6 forms the ring relative to upper 7 protrusion of metal layer.In the prior art, the thickness It spends surplus and is packaged the absorption of resin 12, potting resin 12 is to protective wire 4,5,6.As can be seen in Figure 2 like that, encapsulation Resin has flat surfaces, it is a drop resin, shown in be state after its processing, which is then ready for being transferred Into the appropriate cavity of the finished product of such as chip card etc, or be transferred to for such as E-Passport or other official's certificates it In the insert (insert) of the contactless product of class.
As can be seen that the overall thickness that the thickness scale that the left side of Fig. 2 indicates shows module is 280 microns.In addition to simplification Except manufacturing step, one of target according to the method for the present invention is to enable in the thickness for not reducing chip or other component In the case where reduce the thickness.
Fig. 3 shows the cross-sectional view similar to Fig. 2.It is with the module after 4,5,6 wiring of metal wire, metal wire 4,5,6 The ring of the upper surface protrusion relative to the substrate for carrying upper metal layer 7 is formed before any cladding operation of chip.
In this stage of manufacturing method, instead of a drop clad resin, the invention proposes protecting chip with cap rock 13, Cap rock 13 is applied directly on the upper surface of the module of cavity side, to cover chip, cavity and upper metal plate 7.It applies They are pressed to substrate so that it has the height of the upper surface of metal layer 7 again to coat connecting line 4,5,6 by coat 13 Degree.It actually surprisingly observes, can press these lines without being broken them to the connection of metal covering in this way, will not damage The reliability of evil module.
As can be seen that the thickness of module has 180 microns again, than the thin one third in Fig. 2 by means of the present invention.
Advantageously, for cap rock 13, the thermoplastic material of such as polyurethane etc is selected, enough firmly to fulfil its cap rock Effect, and sufficiently flexible to allow line 4,5,6 to be mounted in the thickness of cap rock 13 to a certain degree, this helps to protect them It holds in its original position.
It still can be in module two sides adhesive disposed, in order to be transferred into the finished product of such as chip card etc.
Fig. 5 A, 5B and 5C show the slight squeeze of line, and the line just mentioned is more or less in cap rock 13 It inlays, large shows the deformation of line.
The section of the module with foregoing cap rock 13 is shown in FIG. 6, but it is so-called contact list Face mould block, and it is compatible with 7816-1 standard.It only includes the single metal opposite with the reception side of cap rock 13 of substrate Layer 8.
In this case, cap rock 13 can directly bear against the ring of line 4,5,6 on substrate 11.
In the case where in the figure, unique metal layer 8 is for realizing end in the case where card is operated with the way of contact The contact of son, or the trace for realizing antenna.Similar structure may be implemented with the module with double interface communication.
Advantages of the present invention
Finally, being used to obtain the module for being used for chip card, meeting institute the invention proposes a kind of new improved manufacturing method The purpose of setting.
By means of this method, it is no longer necessary to use resin-encapsulated chip, and no longer need to be packaged and appoint needed for processing What is operated, and is ground as resin is baked with thickness.
Compared with the previously time of about 5 days manufacturing cycles, this method to save about 2 days time.
The simplicity of operation needed for manufacturing module by placement cap rock also results in the reduction of manufacturing cost.
Incidentally, this method makes it possible to obtain the module that thickness further decreases, and about 180 microns (are being related to base In the case where the parameter constant of the thickness of plate, chip and line), this also allows for increasing this module and comprising this module Chip card or certificate possibility usage scenario.
Type regardless of chip card, this new method are all suitable for: contact, contactless, double-mode.
Finally, properly the color on upper layer is selected to make it possible to most preferably be integrated into finished product.

Claims (7)

1. the manufacturing method of the electronic module for chip card, the module includes substrate (11), and the substrate (11) is at least It on one side include metal layer (7,8) that the substrate (11) has cavity, and microelectronic chip (2) is fixed in the cavity, described micro- Electronic chip (2) has output terminal, and for being connected to electric contact terminal or being connected to the antenna of chip card, the connection is by gold Belonging to connecting line (4,5,6) Lai Shixian, the metal contact wires (4,5,6) constitute the ring of the face protrusion relative to substrate, It is characterized in that, the method is after the wiring of connecting line (4,5,6) the following steps are included: being covered with cap rock (13) including chamber The face of the module of body, the cap rock (13) will coat the ring of the line (4,5,6) of protrusion, to reduce its height and press them To the face of substrate.
2. according to the method described in claim 1, wherein, electronic module includes the upper metal layer (7) positioned at substrate (11) two sides With lower metal layer (8), connecting line (4,5,6) forms the ring relative to upper metal layer (7) protrusion, which is characterized in that cap rock (13) line (4,5,6) will be pressed on the upper metal layer (7).
3. according to the method described in claim 1, wherein, electronic module only includes lower metal layer (8), connecting line (4,5,6) shape At the ring relative to substrate (11) protrusion, which is characterized in that line (4,5,6) will be pressed in the substrate by cap rock (13) (11) on.
4. the method according to any one of the preceding claims, which is characterized in that the cap rock (13) is with extendable Plastic material is made, enough firmly to fulfil the effect of its cap rock, and it is sufficiently flexible to allow line (4,5,6) to inlay to a certain degree It is embedded into the thickness of cap rock (13), this helps to maintain them at its original position.
5. according to the method described in claim 4, it is characterized in that, the extendable plastic material is polyurethane.
6. electronic module, which is characterized in that it is obtained by the method according to any one of the preceding claims.
7. the chip card with contact and contactless double interface communication, which is characterized in that it includes according to claim 6 institute The electronic module stated.
CN201780067843.5A 2016-11-04 2017-11-02 The manufacturing method of electronic module for chip card Pending CN109983478A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1601576A FR3058545B1 (en) 2016-11-04 2016-11-04 METHOD FOR MANUFACTURING AN ELECTRONIC MODULE FOR A CHIP CARD
FR1601576 2016-11-04
PCT/FR2017/000206 WO2018083389A1 (en) 2016-11-04 2017-11-02 Method for manufacturing an electronic module for a smart card

Publications (1)

Publication Number Publication Date
CN109983478A true CN109983478A (en) 2019-07-05

Family

ID=57906667

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780067843.5A Pending CN109983478A (en) 2016-11-04 2017-11-02 The manufacturing method of electronic module for chip card

Country Status (7)

Country Link
EP (1) EP3535695B1 (en)
JP (2) JP7166527B2 (en)
CN (1) CN109983478A (en)
FR (1) FR3058545B1 (en)
MY (1) MY194581A (en)
PL (1) PL3535695T3 (en)
WO (1) WO2018083389A1 (en)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1213449A (en) * 1996-01-17 1999-04-07 格姆普拉斯有限公司 Contactless electronic module for card of label
CN1292907A (en) * 1998-03-09 2001-04-25 格姆普拉斯公司 Method for making contactless cards
CN1343340A (en) * 1999-03-12 2002-04-03 格姆普拉斯公司 Method for making electronic device usch as contactless card
CN1371505A (en) * 1999-08-26 2002-09-25 因芬尼昂技术股份公司 Chip card module and chip card encompassing said module as well as method for producing the chip card module
JP2003289124A (en) * 2002-03-28 2003-10-10 Hitachi Ltd Semiconductor module
CN1596419A (en) * 2002-09-13 2005-03-16 Ask股份有限公司 Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness
US20080205012A1 (en) * 2006-12-21 2008-08-28 Infineon Technologies Ag Chip card module and method of producing a chip card module
CN101341499A (en) * 2005-12-05 2009-01-07 斯迈达Ip有限公司 Chip card and method for production of a chip card
EP2608114A1 (en) * 2011-12-19 2013-06-26 Gemalto SA Method for producing a mould with an integrated circuit chip protected by a pad
WO2013172715A1 (en) * 2012-05-18 2013-11-21 Louis Rinze Henricus Adrianus Willemsen Chip card device and method for manufacture thereof
CN103999098A (en) * 2011-12-14 2014-08-20 金雅拓股份有限公司 Method for manufacturing smart cards
CN104995642A (en) * 2012-10-15 2015-10-21 智能包装技术公司 Simplified electronic module for a smart card with a dual communication interface

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JPH09240178A (en) * 1996-03-13 1997-09-16 Citizen Watch Co Ltd Manufacture of communication ic card
JP2000207521A (en) 1999-01-18 2000-07-28 Toppan Printing Co Ltd Composite ic card and its manufacture
JP2003243673A (en) 2001-07-31 2003-08-29 Kyocera Corp Optical semiconductor device
JP2006253430A (en) 2005-03-11 2006-09-21 Renesas Technology Corp Semiconductor device and its manufacturing method

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1213449A (en) * 1996-01-17 1999-04-07 格姆普拉斯有限公司 Contactless electronic module for card of label
CN1292907A (en) * 1998-03-09 2001-04-25 格姆普拉斯公司 Method for making contactless cards
CN1343340A (en) * 1999-03-12 2002-04-03 格姆普拉斯公司 Method for making electronic device usch as contactless card
CN1371505A (en) * 1999-08-26 2002-09-25 因芬尼昂技术股份公司 Chip card module and chip card encompassing said module as well as method for producing the chip card module
JP2003289124A (en) * 2002-03-28 2003-10-10 Hitachi Ltd Semiconductor module
CN1596419A (en) * 2002-09-13 2005-03-16 Ask股份有限公司 Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness
CN101341499A (en) * 2005-12-05 2009-01-07 斯迈达Ip有限公司 Chip card and method for production of a chip card
US20080205012A1 (en) * 2006-12-21 2008-08-28 Infineon Technologies Ag Chip card module and method of producing a chip card module
CN103999098A (en) * 2011-12-14 2014-08-20 金雅拓股份有限公司 Method for manufacturing smart cards
EP2608114A1 (en) * 2011-12-19 2013-06-26 Gemalto SA Method for producing a mould with an integrated circuit chip protected by a pad
WO2013172715A1 (en) * 2012-05-18 2013-11-21 Louis Rinze Henricus Adrianus Willemsen Chip card device and method for manufacture thereof
CN104995642A (en) * 2012-10-15 2015-10-21 智能包装技术公司 Simplified electronic module for a smart card with a dual communication interface

Also Published As

Publication number Publication date
EP3535695B1 (en) 2020-05-27
JP7273209B2 (en) 2023-05-12
JP7166527B2 (en) 2022-11-08
JP2019536186A (en) 2019-12-12
WO2018083389A1 (en) 2018-05-11
FR3058545A1 (en) 2018-05-11
EP3535695A1 (en) 2019-09-11
PL3535695T3 (en) 2020-11-30
MY194581A (en) 2022-12-02
JP2022078128A (en) 2022-05-24
FR3058545B1 (en) 2018-10-26

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Application publication date: 20190705