CN109983478A - The manufacturing method of electronic module for chip card - Google Patents
The manufacturing method of electronic module for chip card Download PDFInfo
- Publication number
- CN109983478A CN109983478A CN201780067843.5A CN201780067843A CN109983478A CN 109983478 A CN109983478 A CN 109983478A CN 201780067843 A CN201780067843 A CN 201780067843A CN 109983478 A CN109983478 A CN 109983478A
- Authority
- CN
- China
- Prior art keywords
- substrate
- cap rock
- module
- metal layer
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000011435 rock Substances 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000004377 microelectronic Methods 0.000 claims abstract description 10
- 238000004891 communication Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The present invention relates to the manufacturing methods of the electronic module for chip card, the module includes substrate (11) on one side, substrate (11) has on the first face (8) to be made it possible to contact the electric contact terminal to operate by the correspondence contact with smart card reader, and including the antenna (3) with an at least circle, microelectronic chip (2) and metal contact wires (4, 5, 6), metal contact wires (4, 5, 6) ring relative to the second face (7) protrusion is constituted, and the contact of microelectronic chip (2) is connected to the correspondence contact and/or contact terminal of antenna (3), it is characterized in that, to connecting line (4, 5, 6) after being routed, method includes the following steps: with the face positioned at chip (2) side of cap rock (13) overlay module, cap rock (13) is by coating line (4 , 5,6) ring, to reduce its height.
Description
Technical field
The present invention relates to contact-type electronic module or electronic module with contact and contactless double interface communication
Manufacturing method, and the chip card comprising this module.
Background technique
The existing microelectronic modules for being largely used to chip card in the prior art, for contact operation, contactless behaviour
Work or contact and contactless hybrid manipulation.
Most of cards with double interface communication include: according to prior art
Electronic module comprising microelectronic chip, for what is contacted with the corresponding terminal of contact chip card reader
Contact connection terminal and so as to it is connected to two contacts positioned at the back side of antenna;
To block made of plastic material, including antenna;
Make it possible to realize the conductive material of the connection between electronic module and antenna.
In order to manufacture such module, it is necessary to chip is deposited on substrate, then usually using very thin connecting line
To be electrically connected between the corresponding terminal of chip and the communication interface of module.
Then, need to be protected contact and the connecting line of chip with a polymerizable clad resin of drop.Then, this drop of being exposed to the sun is set
Rouge is so that it polymerize.Then it needs that about one angel's resin is waited to complete its crosslinking, the heat treatment then lasted for hours.
Finally, by binder deposition on a face of module, and module is glued in the cavity of card.
When this drop clad resin solidification, it still has the shape heaved.Then it must be ground module, so that it is again
With required thickness.
It was noticed that all these operations are complex and time-consuming, may be up to 5 days in total.
Summary of the invention
Goal of the invention
Therefore, general purpose of the invention be propose it is a kind of without disadvantages mentioned above for contact chip card or for having
The manufacturing method of the electronic module of the chip card of contact and contactless double interface communication.
It is another object of the present invention to propose that a kind of manufacturing method of electronic module, this method make it possible to be greatly decreased system
Quantity and relevant cost and the duration of step are made, but the reliability water usually obtained with known method will not be damaged
It is flat.
Summary of the invention
The principle of the invention lies in covered with material layer and caused by line after the stage for being connected to electric contact by connecting line
The ring with thickness surplus, this material layer enough firmly to force down ring and reduce the thickness of product, but enough
It is flexible so that connecting line be embedded in wherein without generate thickness surplus.
Therefore, subject of the present invention is a kind of manufacturing method of electronic module for chip card, and the module includes base
Plate, at least one side of the substrate include metal layer, and the substrate has cavity, and microelectronic chip is fixed in the cavity,
The microelectronic chip has output terminal, for being connected to electric contact terminal or being connected to the antenna of chip card, the connection
It is realized by metal contact wires, the metal contact wires constitute the ring of the face protrusion relative to substrate, which is characterized in that institute
Method is stated after the wiring of connecting line the following steps are included: covering the face of the module including cavity with cap rock, the cap rock
By the ring of the line of coating protrusion, to reduce its height and they pressed to the face of substrate.
It is equally applicable to the module for two metal layers that manufacture has positioned at substrate two sides according to the method for the present invention, or
Module with the single metal layer for being located at substrate unilateral side.
Therefore, when electronic module includes positioned at the upper metal layer and lower metal layer of substrate two sides, connecting line is formed relatively
In the ring of upper metal layer protrusion, this method proposes that line will be pressed on the upper metal layer by cap rock.
But when electronic module only includes lower metal layer, connecting line forms the ring relative to substrate bumps, the party
Method proposes that cap rock will directly bear against line on the substrate.
According to an aspect of the present invention, the cap rock is made with extendable plastic material, enough firmly to fulfil its lid
The effect of layer, and in the sufficiently flexible thickness to allow line to be mounted to cap rock to a certain degree, this helps to maintain them at
Its original position.
The electronic module that subject of the present invention is obtained also by the above method, and including this improvement and the electricity simplified
The chip card of submodule.
Detailed description of the invention
Other features and advantages of the present invention will be shown after having read the detailed description and the accompanying drawings, in which:
- Fig. 1 is to overlook the electronic module shown for chip card;
- Fig. 2 is the cross-sectional view of the electronic module of Fig. 1, and which show the drop of resin through being ground according to known manufacturing method;
- Fig. 3 is the cross-sectional view of the electronic module of Fig. 1 before coating connecting line;
- Fig. 4 is the cross-sectional view of the electronic module of Fig. 2 after coating connecting line according to the method for the present invention;
- Fig. 5 A, 5B and 5C show three kind mosaic modes of the connecting line in module confining bed with the section view amplified;
- Fig. 6 is to show to be applied to correspond to cuing open for the not module modification of the contact module of antenna according to the method for the present invention
View.
Specific embodiment
The top view of the microelectronic modules 1 for contactless chip card is shown in FIG. 1.The module 1 generally includes
Cavity, the bottom of the cavity be the receiving plane of microelectronic chip 2, the circle of antenna 3, chip interface communication each contact between
Connecting line 4,5,6 and antenna 3 correspondence contact.
The cross-sectional view of Fig. 2 is formed along the connecting line 4,5,6 of Fig. 1.It illustrates in greater detail the structure of module, should
Structure is obtained with traditional manufacturing method.Therefore, chip 2 is glued to metal layer 8, and metal layer 8 also includes the circle of antenna 3.
In the example shown in Fig. 2 to 4, which includes two metal layers 7,8 and positioned at 11 two sides of insulating substrate
Adhesive 10.The terminal (not shown) of the communication interface of chip 2 is connected to hard contact and/or the company of module by line 4,5,6
It is connected to the terminal of antenna 3.The metal covering of upper metal layer 7 is connected to the joint face of lower metal layer 8 by connecting line 6.For this purpose, it passes through well
14。
Tool is for the chip with contact and contactless double interface communication there are two this structure of metal layer 7,8
The typical structure of the module of card.
As can be seen that connecting line 4,5,6 forms the ring relative to upper 7 protrusion of metal layer.In the prior art, the thickness
It spends surplus and is packaged the absorption of resin 12, potting resin 12 is to protective wire 4,5,6.As can be seen in Figure 2 like that, encapsulation
Resin has flat surfaces, it is a drop resin, shown in be state after its processing, which is then ready for being transferred
Into the appropriate cavity of the finished product of such as chip card etc, or be transferred to for such as E-Passport or other official's certificates it
In the insert (insert) of the contactless product of class.
As can be seen that the overall thickness that the thickness scale that the left side of Fig. 2 indicates shows module is 280 microns.In addition to simplification
Except manufacturing step, one of target according to the method for the present invention is to enable in the thickness for not reducing chip or other component
In the case where reduce the thickness.
Fig. 3 shows the cross-sectional view similar to Fig. 2.It is with the module after 4,5,6 wiring of metal wire, metal wire 4,5,6
The ring of the upper surface protrusion relative to the substrate for carrying upper metal layer 7 is formed before any cladding operation of chip.
In this stage of manufacturing method, instead of a drop clad resin, the invention proposes protecting chip with cap rock 13,
Cap rock 13 is applied directly on the upper surface of the module of cavity side, to cover chip, cavity and upper metal plate 7.It applies
They are pressed to substrate so that it has the height of the upper surface of metal layer 7 again to coat connecting line 4,5,6 by coat 13
Degree.It actually surprisingly observes, can press these lines without being broken them to the connection of metal covering in this way, will not damage
The reliability of evil module.
As can be seen that the thickness of module has 180 microns again, than the thin one third in Fig. 2 by means of the present invention.
Advantageously, for cap rock 13, the thermoplastic material of such as polyurethane etc is selected, enough firmly to fulfil its cap rock
Effect, and sufficiently flexible to allow line 4,5,6 to be mounted in the thickness of cap rock 13 to a certain degree, this helps to protect them
It holds in its original position.
It still can be in module two sides adhesive disposed, in order to be transferred into the finished product of such as chip card etc.
Fig. 5 A, 5B and 5C show the slight squeeze of line, and the line just mentioned is more or less in cap rock 13
It inlays, large shows the deformation of line.
The section of the module with foregoing cap rock 13 is shown in FIG. 6, but it is so-called contact list
Face mould block, and it is compatible with 7816-1 standard.It only includes the single metal opposite with the reception side of cap rock 13 of substrate
Layer 8.
In this case, cap rock 13 can directly bear against the ring of line 4,5,6 on substrate 11.
In the case where in the figure, unique metal layer 8 is for realizing end in the case where card is operated with the way of contact
The contact of son, or the trace for realizing antenna.Similar structure may be implemented with the module with double interface communication.
Advantages of the present invention
Finally, being used to obtain the module for being used for chip card, meeting institute the invention proposes a kind of new improved manufacturing method
The purpose of setting.
By means of this method, it is no longer necessary to use resin-encapsulated chip, and no longer need to be packaged and appoint needed for processing
What is operated, and is ground as resin is baked with thickness.
Compared with the previously time of about 5 days manufacturing cycles, this method to save about 2 days time.
The simplicity of operation needed for manufacturing module by placement cap rock also results in the reduction of manufacturing cost.
Incidentally, this method makes it possible to obtain the module that thickness further decreases, and about 180 microns (are being related to base
In the case where the parameter constant of the thickness of plate, chip and line), this also allows for increasing this module and comprising this module
Chip card or certificate possibility usage scenario.
Type regardless of chip card, this new method are all suitable for: contact, contactless, double-mode.
Finally, properly the color on upper layer is selected to make it possible to most preferably be integrated into finished product.
Claims (7)
1. the manufacturing method of the electronic module for chip card, the module includes substrate (11), and the substrate (11) is at least
It on one side include metal layer (7,8) that the substrate (11) has cavity, and microelectronic chip (2) is fixed in the cavity, described micro-
Electronic chip (2) has output terminal, and for being connected to electric contact terminal or being connected to the antenna of chip card, the connection is by gold
Belonging to connecting line (4,5,6) Lai Shixian, the metal contact wires (4,5,6) constitute the ring of the face protrusion relative to substrate,
It is characterized in that, the method is after the wiring of connecting line (4,5,6) the following steps are included: being covered with cap rock (13) including chamber
The face of the module of body, the cap rock (13) will coat the ring of the line (4,5,6) of protrusion, to reduce its height and press them
To the face of substrate.
2. according to the method described in claim 1, wherein, electronic module includes the upper metal layer (7) positioned at substrate (11) two sides
With lower metal layer (8), connecting line (4,5,6) forms the ring relative to upper metal layer (7) protrusion, which is characterized in that cap rock
(13) line (4,5,6) will be pressed on the upper metal layer (7).
3. according to the method described in claim 1, wherein, electronic module only includes lower metal layer (8), connecting line (4,5,6) shape
At the ring relative to substrate (11) protrusion, which is characterized in that line (4,5,6) will be pressed in the substrate by cap rock (13)
(11) on.
4. the method according to any one of the preceding claims, which is characterized in that the cap rock (13) is with extendable
Plastic material is made, enough firmly to fulfil the effect of its cap rock, and it is sufficiently flexible to allow line (4,5,6) to inlay to a certain degree
It is embedded into the thickness of cap rock (13), this helps to maintain them at its original position.
5. according to the method described in claim 4, it is characterized in that, the extendable plastic material is polyurethane.
6. electronic module, which is characterized in that it is obtained by the method according to any one of the preceding claims.
7. the chip card with contact and contactless double interface communication, which is characterized in that it includes according to claim 6 institute
The electronic module stated.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1601576A FR3058545B1 (en) | 2016-11-04 | 2016-11-04 | METHOD FOR MANUFACTURING AN ELECTRONIC MODULE FOR A CHIP CARD |
FR1601576 | 2016-11-04 | ||
PCT/FR2017/000206 WO2018083389A1 (en) | 2016-11-04 | 2017-11-02 | Method for manufacturing an electronic module for a smart card |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109983478A true CN109983478A (en) | 2019-07-05 |
Family
ID=57906667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201780067843.5A Pending CN109983478A (en) | 2016-11-04 | 2017-11-02 | The manufacturing method of electronic module for chip card |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP3535695B1 (en) |
JP (2) | JP7166527B2 (en) |
CN (1) | CN109983478A (en) |
FR (1) | FR3058545B1 (en) |
MY (1) | MY194581A (en) |
PL (1) | PL3535695T3 (en) |
WO (1) | WO2018083389A1 (en) |
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CN1371505A (en) * | 1999-08-26 | 2002-09-25 | 因芬尼昂技术股份公司 | Chip card module and chip card encompassing said module as well as method for producing the chip card module |
JP2003289124A (en) * | 2002-03-28 | 2003-10-10 | Hitachi Ltd | Semiconductor module |
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2016
- 2016-11-04 FR FR1601576A patent/FR3058545B1/en active Active
-
2017
- 2017-11-02 JP JP2019546083A patent/JP7166527B2/en active Active
- 2017-11-02 MY MYPI2019002436A patent/MY194581A/en unknown
- 2017-11-02 WO PCT/FR2017/000206 patent/WO2018083389A1/en unknown
- 2017-11-02 EP EP17808531.2A patent/EP3535695B1/en active Active
- 2017-11-02 PL PL17808531T patent/PL3535695T3/en unknown
- 2017-11-02 CN CN201780067843.5A patent/CN109983478A/en active Pending
-
2022
- 2022-02-22 JP JP2022025254A patent/JP7273209B2/en active Active
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CN1213449A (en) * | 1996-01-17 | 1999-04-07 | 格姆普拉斯有限公司 | Contactless electronic module for card of label |
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Also Published As
Publication number | Publication date |
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EP3535695B1 (en) | 2020-05-27 |
JP7273209B2 (en) | 2023-05-12 |
JP7166527B2 (en) | 2022-11-08 |
JP2019536186A (en) | 2019-12-12 |
WO2018083389A1 (en) | 2018-05-11 |
FR3058545A1 (en) | 2018-05-11 |
EP3535695A1 (en) | 2019-09-11 |
PL3535695T3 (en) | 2020-11-30 |
MY194581A (en) | 2022-12-02 |
JP2022078128A (en) | 2022-05-24 |
FR3058545B1 (en) | 2018-10-26 |
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