CN107206491B - 涂银铜粉及其制造方法 - Google Patents

涂银铜粉及其制造方法 Download PDF

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Publication number
CN107206491B
CN107206491B CN201680005161.7A CN201680005161A CN107206491B CN 107206491 B CN107206491 B CN 107206491B CN 201680005161 A CN201680005161 A CN 201680005161A CN 107206491 B CN107206491 B CN 107206491B
Authority
CN
China
Prior art keywords
silver
copper powder
coated copper
coated
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201680005161.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN107206491A (zh
Inventor
野上德昭
神贺洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Electronics Materials Co Ltd
Original Assignee
Dowa Electronics Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Electronics Materials Co Ltd filed Critical Dowa Electronics Materials Co Ltd
Priority claimed from PCT/JP2016/000034 external-priority patent/WO2016114106A1/ja
Publication of CN107206491A publication Critical patent/CN107206491A/zh
Application granted granted Critical
Publication of CN107206491B publication Critical patent/CN107206491B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Chemically Coating (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Manufacturing & Machinery (AREA)
CN201680005161.7A 2015-01-13 2016-01-06 涂银铜粉及其制造方法 Expired - Fee Related CN107206491B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2015-004008 2015-01-13
JP2015004008 2015-01-13
JP2016-000026 2016-01-04
JP2016000026A JP6679312B2 (ja) 2015-01-13 2016-01-04 銀被覆銅粉およびその製造方法
PCT/JP2016/000034 WO2016114106A1 (ja) 2015-01-13 2016-01-06 銀被覆銅粉およびその製造方法

Publications (2)

Publication Number Publication Date
CN107206491A CN107206491A (zh) 2017-09-26
CN107206491B true CN107206491B (zh) 2019-12-06

Family

ID=56415196

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680005161.7A Expired - Fee Related CN107206491B (zh) 2015-01-13 2016-01-06 涂银铜粉及其制造方法

Country Status (5)

Country Link
US (1) US20180272425A1 (enExample)
JP (2) JP6679312B2 (enExample)
KR (1) KR20170105013A (enExample)
CN (1) CN107206491B (enExample)
TW (1) TWI680470B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017135138A1 (ja) * 2016-02-03 2017-08-10 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅粉およびその製造方法
JP6811080B2 (ja) 2016-02-03 2021-01-13 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅粉およびその製造方法
JP6236557B1 (ja) * 2016-03-18 2017-11-22 Ｄｏｗａエレクトロニクス株式会社 銀テルル被覆ガラス粉およびその製造方法、ならびに導電性ペーストおよびその製造方法
JP6246877B1 (ja) 2016-09-08 2017-12-13 Ｄｏｗａエレクトロニクス株式会社 導電性ペーストおよびその製造方法、ならびに太陽電池の製造方法
JP7090511B2 (ja) * 2017-09-29 2022-06-24 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1471446A (zh) * 2000-10-02 2004-01-28 ������������ʽ���� 官能化合金颗粒
JP2004323962A (ja) * 2003-04-28 2004-11-18 Nippon Chem Ind Co Ltd 導電性無電解めっき粉体及びその製造方法
CN102211185A (zh) * 2011-05-17 2011-10-12 陈钢强 银包铜合金粉
CN102873324A (zh) * 2012-10-17 2013-01-16 厦门大学 一种包裹型铜镍银复合粉体及其制备方法
CN103314413A (zh) * 2011-11-24 2013-09-18 韩化石油化学株式会社 导电颗粒及其制备方法
CN104066535A (zh) * 2012-01-17 2014-09-24 同和电子科技有限公司 涂银的铜合金粉末及其生产方法

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US3202488A (en) * 1964-03-04 1965-08-24 Chomerics Inc Silver-plated copper powder
US4716081A (en) * 1985-07-19 1987-12-29 Ercon, Inc. Conductive compositions and conductive powders for use therein
JP4138171B2 (ja) * 1999-08-12 2008-08-20 エヌ・イーケムキャット株式会社 銀電気めっき浴
JP2007073545A (ja) * 2005-09-02 2007-03-22 Tsukuba Semi Technology:Kk 半導体デバイスの結晶質改善方法
CN1876282A (zh) * 2006-07-07 2006-12-13 清华大学 一种铜粉表面化学镀银的方法
KR20080039796A (ko) * 2006-11-01 2008-05-07 엔.이. 켐캣 가부시키가이샤 금―은 합금 도금액
JP4666663B2 (ja) * 2007-11-30 2011-04-06 三井金属鉱業株式会社 銀化合物被覆銅粉、その銀化合物被覆銅粉の製造方法、その銀化合物被覆銅粉の保管方法及びその銀化合物被覆銅粉を用いた導電性ペースト
CN101774025A (zh) * 2010-01-19 2010-07-14 山东天诺光电材料有限公司 一种镀银铜粉的制备方法
CN104321464A (zh) * 2011-12-15 2015-01-28 汉高知识产权控股有限责任公司 镀银铜的暴露铜的选择性涂覆
JP5785532B2 (ja) * 2012-11-30 2015-09-30 三井金属鉱業株式会社 銀コート銅粉及びその製造方法
WO2017135138A1 (ja) * 2016-02-03 2017-08-10 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅粉およびその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1471446A (zh) * 2000-10-02 2004-01-28 ������������ʽ���� 官能化合金颗粒
JP2004323962A (ja) * 2003-04-28 2004-11-18 Nippon Chem Ind Co Ltd 導電性無電解めっき粉体及びその製造方法
CN102211185A (zh) * 2011-05-17 2011-10-12 陈钢强 银包铜合金粉
CN103314413A (zh) * 2011-11-24 2013-09-18 韩化石油化学株式会社 导电颗粒及其制备方法
CN104066535A (zh) * 2012-01-17 2014-09-24 同和电子科技有限公司 涂银的铜合金粉末及其生产方法
CN102873324A (zh) * 2012-10-17 2013-01-16 厦门大学 一种包裹型铜镍银复合粉体及其制备方法

Also Published As

Publication number Publication date
KR20170105013A (ko) 2017-09-18
US20180272425A1 (en) 2018-09-27
TW201631603A (zh) 2016-09-01
JP2020076155A (ja) 2020-05-21
JP6679312B2 (ja) 2020-04-15
CN107206491A (zh) 2017-09-26
JP2016130365A (ja) 2016-07-21
TWI680470B (zh) 2019-12-21

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