CN102211185A - 银包铜合金粉 - Google Patents
银包铜合金粉 Download PDFInfo
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- CN102211185A CN102211185A CN2011101416928A CN201110141692A CN102211185A CN 102211185 A CN102211185 A CN 102211185A CN 2011101416928 A CN2011101416928 A CN 2011101416928A CN 201110141692 A CN201110141692 A CN 201110141692A CN 102211185 A CN102211185 A CN 102211185A
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- silver
- copper
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Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201110141692.8A CN102211185B (zh) | 2011-05-17 | 2011-05-17 | 银包铜合金粉 |
Applications Claiming Priority (1)
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CN201110141692.8A CN102211185B (zh) | 2011-05-17 | 2011-05-17 | 银包铜合金粉 |
Publications (2)
Publication Number | Publication Date |
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CN102211185A true CN102211185A (zh) | 2011-10-12 |
CN102211185B CN102211185B (zh) | 2014-01-22 |
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CN201110141692.8A Active CN102211185B (zh) | 2011-05-17 | 2011-05-17 | 银包铜合金粉 |
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CN (1) | CN102211185B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103000250A (zh) * | 2012-11-07 | 2013-03-27 | 宁波广博纳米新材料股份有限公司 | 低银含量晶体硅太阳能电池用背面银浆及其制备方法 |
CN105328182A (zh) * | 2015-09-29 | 2016-02-17 | 安徽工业大学 | 一种核壳结构银包铜纳米粉体材料的制备方法 |
CN106794516A (zh) * | 2014-08-29 | 2017-05-31 | 同和电子科技有限公司 | 银被覆铜粉及其制造方法 |
CN107206491A (zh) * | 2015-01-13 | 2017-09-26 | 同和电子科技有限公司 | 涂银铜粉及其制造方法 |
CN107863176A (zh) * | 2017-11-27 | 2018-03-30 | 中国有色桂林矿产地质研究院有限公司 | 一种低收缩率氧化锌压敏电阻电极银浆及制备方法 |
CN113000837A (zh) * | 2021-03-10 | 2021-06-22 | 昆明理工大学 | 一种添加锌中间层的银包铜复合粉体制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000328232A (ja) * | 1999-05-18 | 2000-11-28 | Nisshin Steel Co Ltd | 導電性粉末およびその製造方法並びにそれを使用した塗料 |
CN1577638A (zh) * | 2003-07-08 | 2005-02-09 | 日立化成工业株式会社 | 导电粉末和其制备方法 |
CN101516550A (zh) * | 2006-08-30 | 2009-08-26 | 尤米科尔股份公司及两合公司 | 核/壳型催化剂颗粒及它们的制备方法 |
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2011
- 2011-05-17 CN CN201110141692.8A patent/CN102211185B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000328232A (ja) * | 1999-05-18 | 2000-11-28 | Nisshin Steel Co Ltd | 導電性粉末およびその製造方法並びにそれを使用した塗料 |
CN1577638A (zh) * | 2003-07-08 | 2005-02-09 | 日立化成工业株式会社 | 导电粉末和其制备方法 |
CN101516550A (zh) * | 2006-08-30 | 2009-08-26 | 尤米科尔股份公司及两合公司 | 核/壳型催化剂颗粒及它们的制备方法 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103000250A (zh) * | 2012-11-07 | 2013-03-27 | 宁波广博纳米新材料股份有限公司 | 低银含量晶体硅太阳能电池用背面银浆及其制备方法 |
CN103000250B (zh) * | 2012-11-07 | 2015-04-08 | 宁波广博纳米新材料股份有限公司 | 低银含量晶体硅太阳能电池用背面银浆及其制备方法 |
CN106794516A (zh) * | 2014-08-29 | 2017-05-31 | 同和电子科技有限公司 | 银被覆铜粉及其制造方法 |
CN106794516B (zh) * | 2014-08-29 | 2020-05-26 | 同和电子科技有限公司 | 银被覆铜粉及其制造方法 |
CN107206491A (zh) * | 2015-01-13 | 2017-09-26 | 同和电子科技有限公司 | 涂银铜粉及其制造方法 |
CN107206491B (zh) * | 2015-01-13 | 2019-12-06 | 同和电子科技有限公司 | 涂银铜粉及其制造方法 |
CN105328182A (zh) * | 2015-09-29 | 2016-02-17 | 安徽工业大学 | 一种核壳结构银包铜纳米粉体材料的制备方法 |
CN105328182B (zh) * | 2015-09-29 | 2017-04-05 | 安徽工业大学 | 一种核壳结构银包铜纳米粉体材料的制备方法 |
CN107863176A (zh) * | 2017-11-27 | 2018-03-30 | 中国有色桂林矿产地质研究院有限公司 | 一种低收缩率氧化锌压敏电阻电极银浆及制备方法 |
CN113000837A (zh) * | 2021-03-10 | 2021-06-22 | 昆明理工大学 | 一种添加锌中间层的银包铜复合粉体制备方法 |
CN113000837B (zh) * | 2021-03-10 | 2022-11-18 | 昆明理工大学 | 一种添加锌中间层的银包铜复合粉体制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102211185B (zh) | 2014-01-22 |
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Effective date of registration: 20161031 Address after: 223801 Suqian province high tech Development Zone, Jiangshan Road, No. 23, No. Patentee after: Jiangsu Bo move new materials Limited by Share Ltd Address before: 315100 Zhejiang City, Yinzhou Province, Central District, Yinzhou District Road, talent apartment, room 2, building 2114, room Patentee before: Chen Gangqiang Patentee before: Ningbo Guangbo New Nanomaterials Stock Co.,Ltd. |
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Effective date of registration: 20170116 Address after: 315100 Zhejiang City, Yinzhou Province, Central District, Yinzhou District Road, talent apartment, room 2, building 2114, room Patentee after: Chen Gangqiang Patentee after: Jiangsu Bo move new materials Limited by Share Ltd Address before: 223801 Suqian province high tech Development Zone, Jiangshan Road, No. 23, No. Patentee before: Jiangsu Bo move new materials Limited by Share Ltd |