TWI680470B - 覆銀銅粉、其製造方法及使用該覆銀銅粉之導電性糊以及使用該導電性糊之太陽電池用電極之製造方法 - Google Patents

覆銀銅粉、其製造方法及使用該覆銀銅粉之導電性糊以及使用該導電性糊之太陽電池用電極之製造方法 Download PDF

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Publication number
TWI680470B
TWI680470B TW105100676A TW105100676A TWI680470B TW I680470 B TWI680470 B TW I680470B TW 105100676 A TW105100676 A TW 105100676A TW 105100676 A TW105100676 A TW 105100676A TW I680470 B TWI680470 B TW I680470B
Authority
TW
Taiwan
Prior art keywords
silver
copper powder
coated copper
coated
mass
Prior art date
Application number
TW105100676A
Other languages
English (en)
Chinese (zh)
Other versions
TW201631603A (zh
Inventor
野上德昭
Noriaki Nogami
神賀洋
Hiroshi Kamiga
Original Assignee
日商同和電子科技有限公司
Dowa Electronics Materials Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商同和電子科技有限公司, Dowa Electronics Materials Co., Ltd. filed Critical 日商同和電子科技有限公司
Publication of TW201631603A publication Critical patent/TW201631603A/zh
Application granted granted Critical
Publication of TWI680470B publication Critical patent/TWI680470B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Chemically Coating (AREA)
  • Non-Insulated Conductors (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Manufacturing & Machinery (AREA)
TW105100676A 2015-01-13 2016-01-11 覆銀銅粉、其製造方法及使用該覆銀銅粉之導電性糊以及使用該導電性糊之太陽電池用電極之製造方法 TWI680470B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015-004008 2015-01-13
JP2015004008 2015-01-13
JP2016000026A JP6679312B2 (ja) 2015-01-13 2016-01-04 銀被覆銅粉およびその製造方法
JP2016-000026 2016-01-04

Publications (2)

Publication Number Publication Date
TW201631603A TW201631603A (zh) 2016-09-01
TWI680470B true TWI680470B (zh) 2019-12-21

Family

ID=56415196

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105100676A TWI680470B (zh) 2015-01-13 2016-01-11 覆銀銅粉、其製造方法及使用該覆銀銅粉之導電性糊以及使用該導電性糊之太陽電池用電極之製造方法

Country Status (5)

Country Link
US (1) US20180272425A1 (enExample)
JP (2) JP6679312B2 (enExample)
KR (1) KR20170105013A (enExample)
CN (1) CN107206491B (enExample)
TW (1) TWI680470B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017135138A1 (ja) * 2016-02-03 2017-08-10 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅粉およびその製造方法
JP6811080B2 (ja) 2016-02-03 2021-01-13 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅粉およびその製造方法
JP6236557B1 (ja) * 2016-03-18 2017-11-22 Ｄｏｗａエレクトロニクス株式会社 銀テルル被覆ガラス粉およびその製造方法、ならびに導電性ペーストおよびその製造方法
JP6246877B1 (ja) 2016-09-08 2017-12-13 Ｄｏｗａエレクトロニクス株式会社 導電性ペーストおよびその製造方法、ならびに太陽電池の製造方法
JP7090511B2 (ja) * 2017-09-29 2022-06-24 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
WO2023167302A1 (ja) * 2022-03-04 2023-09-07 三井金属鉱業株式会社 リン含有銀被覆銅粒子の製造方法、及びリン含有銀被覆銅粒子

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW573073B (en) * 1999-08-12 2004-01-21 Ne Chemcat Corp Silver plating bath
JP2008106368A (ja) * 2007-11-30 2008-05-08 Mitsui Mining & Smelting Co Ltd 銀化合物被覆銅粉、その銀化合物被覆銅粉の製造方法、その銀化合物被覆銅粉の保管方法及びその銀化合物被覆銅粉を用いた導電性ペースト
TW201323542A (zh) * 2011-12-15 2013-06-16 Henkel Corp 於鍍銀之銅上選擇性塗覆經曝露之銅
TW201333226A (zh) * 2012-01-17 2013-08-16 同和電子科技有限公司 銀被覆銅合金粉末及其製造方法
TW201430167A (zh) * 2012-11-30 2014-08-01 三井金屬鑛業股份有限公司 覆銀之銅粉及其製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3202488A (en) * 1964-03-04 1965-08-24 Chomerics Inc Silver-plated copper powder
US4716081A (en) * 1985-07-19 1987-12-29 Ercon, Inc. Conductive compositions and conductive powders for use therein
WO2002028574A1 (fr) * 2000-10-02 2002-04-11 Asahi Kasei Kabushiki Kaisha Particules d'alliage fonctionnel
JP4261973B2 (ja) * 2003-04-28 2009-05-13 日本化学工業株式会社 導電性無電解めっき粉体の製造方法
JP2007073545A (ja) * 2005-09-02 2007-03-22 Tsukuba Semi Technology:Kk 半導体デバイスの結晶質改善方法
CN1876282A (zh) * 2006-07-07 2006-12-13 清华大学 一种铜粉表面化学镀银的方法
TW200825213A (en) * 2006-11-01 2008-06-16 N E Chemcat Corp Gold-silver alloy plating liquid
CN101774025A (zh) * 2010-01-19 2010-07-14 山东天诺光电材料有限公司 一种镀银铜粉的制备方法
CN102211185B (zh) * 2011-05-17 2014-01-22 陈钢强 银包铜合金粉
KR101151366B1 (ko) * 2011-11-24 2012-06-08 한화케미칼 주식회사 도전성 입자 및 이의 제조방법
CN102873324A (zh) * 2012-10-17 2013-01-16 厦门大学 一种包裹型铜镍银复合粉体及其制备方法
WO2017135138A1 (ja) * 2016-02-03 2017-08-10 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅粉およびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW573073B (en) * 1999-08-12 2004-01-21 Ne Chemcat Corp Silver plating bath
JP2008106368A (ja) * 2007-11-30 2008-05-08 Mitsui Mining & Smelting Co Ltd 銀化合物被覆銅粉、その銀化合物被覆銅粉の製造方法、その銀化合物被覆銅粉の保管方法及びその銀化合物被覆銅粉を用いた導電性ペースト
TW201323542A (zh) * 2011-12-15 2013-06-16 Henkel Corp 於鍍銀之銅上選擇性塗覆經曝露之銅
TW201333226A (zh) * 2012-01-17 2013-08-16 同和電子科技有限公司 銀被覆銅合金粉末及其製造方法
TW201430167A (zh) * 2012-11-30 2014-08-01 三井金屬鑛業股份有限公司 覆銀之銅粉及其製造方法

Also Published As

Publication number Publication date
JP2020076155A (ja) 2020-05-21
JP6679312B2 (ja) 2020-04-15
TW201631603A (zh) 2016-09-01
JP2016130365A (ja) 2016-07-21
CN107206491A (zh) 2017-09-26
US20180272425A1 (en) 2018-09-27
CN107206491B (zh) 2019-12-06
KR20170105013A (ko) 2017-09-18

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