JP6679312B2 - 銀被覆銅粉およびその製造方法 - Google Patents

銀被覆銅粉およびその製造方法 Download PDF

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Publication number
JP6679312B2
JP6679312B2 JP2016000026A JP2016000026A JP6679312B2 JP 6679312 B2 JP6679312 B2 JP 6679312B2 JP 2016000026 A JP2016000026 A JP 2016000026A JP 2016000026 A JP2016000026 A JP 2016000026A JP 6679312 B2 JP6679312 B2 JP 6679312B2
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Japan
Prior art keywords
silver
copper powder
coated copper
coated
mass
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JP2016000026A
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English (en)
Japanese (ja)
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JP2016130365A (ja
JP2016130365A5 (enExample
Inventor
徳昭 野上
徳昭 野上
洋 神賀
洋 神賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Electronics Materials Co Ltd
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Dowa Electronics Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Electronics Materials Co Ltd filed Critical Dowa Electronics Materials Co Ltd
Priority to KR1020177019349A priority Critical patent/KR20170105013A/ko
Priority to PCT/JP2016/000034 priority patent/WO2016114106A1/ja
Priority to US15/542,464 priority patent/US20180272425A1/en
Priority to CN201680005161.7A priority patent/CN107206491B/zh
Priority to TW105100676A priority patent/TWI680470B/zh
Publication of JP2016130365A publication Critical patent/JP2016130365A/ja
Publication of JP2016130365A5 publication Critical patent/JP2016130365A5/ja
Application granted granted Critical
Publication of JP6679312B2 publication Critical patent/JP6679312B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
  • Chemically Coating (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Manufacturing & Machinery (AREA)
JP2016000026A 2015-01-13 2016-01-04 銀被覆銅粉およびその製造方法 Active JP6679312B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020177019349A KR20170105013A (ko) 2015-01-13 2016-01-06 은 피복 구리분 및 그의 제조 방법
PCT/JP2016/000034 WO2016114106A1 (ja) 2015-01-13 2016-01-06 銀被覆銅粉およびその製造方法
US15/542,464 US20180272425A1 (en) 2015-01-13 2016-01-06 Silver-coated copper powder and method for producing same
CN201680005161.7A CN107206491B (zh) 2015-01-13 2016-01-06 涂银铜粉及其制造方法
TW105100676A TWI680470B (zh) 2015-01-13 2016-01-11 覆銀銅粉、其製造方法及使用該覆銀銅粉之導電性糊以及使用該導電性糊之太陽電池用電極之製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015004008 2015-01-13
JP2015004008 2015-01-13

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020012301A Division JP2020076155A (ja) 2015-01-13 2020-01-29 銀被覆銅粉およびその製造方法

Publications (3)

Publication Number Publication Date
JP2016130365A JP2016130365A (ja) 2016-07-21
JP2016130365A5 JP2016130365A5 (enExample) 2018-12-06
JP6679312B2 true JP6679312B2 (ja) 2020-04-15

Family

ID=56415196

Family Applications (2)

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JP2016000026A Active JP6679312B2 (ja) 2015-01-13 2016-01-04 銀被覆銅粉およびその製造方法
JP2020012301A Pending JP2020076155A (ja) 2015-01-13 2020-01-29 銀被覆銅粉およびその製造方法

Family Applications After (1)

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JP2020012301A Pending JP2020076155A (ja) 2015-01-13 2020-01-29 銀被覆銅粉およびその製造方法

Country Status (5)

Country Link
US (1) US20180272425A1 (enExample)
JP (2) JP6679312B2 (enExample)
KR (1) KR20170105013A (enExample)
CN (1) CN107206491B (enExample)
TW (1) TWI680470B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6811080B2 (ja) 2016-02-03 2021-01-13 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅粉およびその製造方法
WO2017135138A1 (ja) * 2016-02-03 2017-08-10 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅粉およびその製造方法
JP6236557B1 (ja) * 2016-03-18 2017-11-22 Ｄｏｗａエレクトロニクス株式会社 銀テルル被覆ガラス粉およびその製造方法、ならびに導電性ペーストおよびその製造方法
JP6246877B1 (ja) 2016-09-08 2017-12-13 Ｄｏｗａエレクトロニクス株式会社 導電性ペーストおよびその製造方法、ならびに太陽電池の製造方法
JP7090511B2 (ja) * 2017-09-29 2022-06-24 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3202488A (en) * 1964-03-04 1965-08-24 Chomerics Inc Silver-plated copper powder
US4716081A (en) * 1985-07-19 1987-12-29 Ercon, Inc. Conductive compositions and conductive powders for use therein
JP4138171B2 (ja) * 1999-08-12 2008-08-20 エヌ・イーケムキャット株式会社 銀電気めっき浴
AU2001292338A1 (en) * 2000-10-02 2002-04-15 Asahi Kasei Kabushiki Kaisha Functional alloy particles
JP4261973B2 (ja) * 2003-04-28 2009-05-13 日本化学工業株式会社 導電性無電解めっき粉体の製造方法
JP2007073545A (ja) * 2005-09-02 2007-03-22 Tsukuba Semi Technology:Kk 半導体デバイスの結晶質改善方法
CN1876282A (zh) * 2006-07-07 2006-12-13 清华大学 一种铜粉表面化学镀银的方法
KR20080039796A (ko) * 2006-11-01 2008-05-07 엔.이. 켐캣 가부시키가이샤 금―은 합금 도금액
JP4666663B2 (ja) * 2007-11-30 2011-04-06 三井金属鉱業株式会社 銀化合物被覆銅粉、その銀化合物被覆銅粉の製造方法、その銀化合物被覆銅粉の保管方法及びその銀化合物被覆銅粉を用いた導電性ペースト
CN101774025A (zh) * 2010-01-19 2010-07-14 山东天诺光电材料有限公司 一种镀银铜粉的制备方法
CN102211185B (zh) * 2011-05-17 2014-01-22 陈钢强 银包铜合金粉
KR101151366B1 (ko) * 2011-11-24 2012-06-08 한화케미칼 주식회사 도전성 입자 및 이의 제조방법
WO2013089816A1 (en) * 2011-12-15 2013-06-20 Henkel Corporation Selective coating of exposed copper on silver-plated copper
KR102011166B1 (ko) * 2012-01-17 2019-08-14 도와 일렉트로닉스 가부시키가이샤 은 피복 구리 합금 분말 및 그의 제조 방법
CN102873324A (zh) * 2012-10-17 2013-01-16 厦门大学 一种包裹型铜镍银复合粉体及其制备方法
JP5785532B2 (ja) * 2012-11-30 2015-09-30 三井金属鉱業株式会社 銀コート銅粉及びその製造方法
WO2017135138A1 (ja) * 2016-02-03 2017-08-10 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅粉およびその製造方法

Also Published As

Publication number Publication date
JP2020076155A (ja) 2020-05-21
KR20170105013A (ko) 2017-09-18
JP2016130365A (ja) 2016-07-21
TW201631603A (zh) 2016-09-01
TWI680470B (zh) 2019-12-21
CN107206491A (zh) 2017-09-26
US20180272425A1 (en) 2018-09-27
CN107206491B (zh) 2019-12-06

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