CN106847879A - 一种斜面沟道的SiC MOSFET器件及制备方法 - Google Patents
一种斜面沟道的SiC MOSFET器件及制备方法 Download PDFInfo
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- CN106847879A CN106847879A CN201710038070.XA CN201710038070A CN106847879A CN 106847879 A CN106847879 A CN 106847879A CN 201710038070 A CN201710038070 A CN 201710038070A CN 106847879 A CN106847879 A CN 106847879A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0661—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body specially adapted for altering the breakdown voltage by removing semiconductor material at, or in the neighbourhood of, a reverse biased junction, e.g. by bevelling, moat etching, depletion etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
Abstract
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Priority Applications (2)
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CN201710038070.XA CN106847879B (zh) | 2017-01-19 | 2017-01-19 | 一种斜面沟道的SiC MOSFET器件及制备方法 |
PCT/CN2017/081000 WO2018133224A1 (zh) | 2017-01-19 | 2017-04-19 | 一种斜面沟道的SiC MOSFET器件及其制备方法 |
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CN201710038070.XA CN106847879B (zh) | 2017-01-19 | 2017-01-19 | 一种斜面沟道的SiC MOSFET器件及制备方法 |
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CN106847879A true CN106847879A (zh) | 2017-06-13 |
CN106847879B CN106847879B (zh) | 2021-12-03 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107393814A (zh) * | 2017-08-10 | 2017-11-24 | 中国科学院上海微系统与信息技术研究所 | 一种mos功率器件及其制备方法 |
CN107681001A (zh) * | 2017-07-24 | 2018-02-09 | 中国电子科技集团公司第五十五研究所 | 一种碳化硅开关器件及制作方法 |
CN111199972A (zh) * | 2018-11-16 | 2020-05-26 | 深圳比亚迪微电子有限公司 | 集成级联器件及其制备方法 |
CN114284359A (zh) * | 2021-12-23 | 2022-04-05 | 无锡新洁能股份有限公司 | 低阻碳化硅mosfet器件及其制造方法 |
CN114975127A (zh) * | 2022-08-01 | 2022-08-30 | 南京融芯微电子有限公司 | 一种新型碳化硅平面式功率mosfet器件的制造方法 |
CN116387348A (zh) * | 2023-04-27 | 2023-07-04 | 南京第三代半导体技术创新中心有限公司 | 一种精确控制短沟道的平面型SiC MOSFET及其制造方法 |
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CN112447507A (zh) * | 2019-08-30 | 2021-03-05 | 株洲中车时代半导体有限公司 | 一种提高沟槽栅击穿特性的goi测试样片制造方法 |
CN111129164B (zh) * | 2019-12-05 | 2023-09-26 | 中国电子科技集团公司第十三研究所 | 肖特基二极管及其制备方法 |
CN111048590B (zh) * | 2019-12-26 | 2023-03-21 | 北京工业大学 | 一种具有内嵌沟道二极管的双沟槽SiC MOSFET结构及其制备方法 |
CN111276545B (zh) * | 2020-02-12 | 2023-03-14 | 重庆伟特森电子科技有限公司 | 一种新型沟槽碳化硅晶体管器件及其制作方法 |
CN112530795A (zh) * | 2020-08-21 | 2021-03-19 | 中国工程物理研究院电子工程研究所 | 基于小角度深刻蚀工艺的碳化硅功率器件终端及制作方法 |
CN114068565A (zh) * | 2021-11-18 | 2022-02-18 | 中国电子科技集团公司第五十八研究所 | 基于Sense-Switch型nFLASH开关单元结构的制备以及加固方法 |
CN114335152B (zh) * | 2022-03-02 | 2022-05-24 | 江苏游隼微电子有限公司 | 一种碳化硅功率半导体器件及其制备方法 |
CN114823911B (zh) * | 2022-06-30 | 2022-10-04 | 成都蓉矽半导体有限公司 | 集成高速续流二极管的沟槽碳化硅mosfet及制备方法 |
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- 2017-04-19 WO PCT/CN2017/081000 patent/WO2018133224A1/zh active Application Filing
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JP2000091571A (ja) * | 1998-09-11 | 2000-03-31 | Oki Electric Ind Co Ltd | 半導体装置 |
US20050067630A1 (en) * | 2003-09-25 | 2005-03-31 | Zhao Jian H. | Vertical junction field effect power transistor |
US20050230686A1 (en) * | 2004-04-19 | 2005-10-20 | Denso Corporation | Silicon carbide semiconductor device and method for manufacturing the same |
CN1738054A (zh) * | 2004-08-20 | 2006-02-22 | 恩益禧电子股份有限公司 | 场效应晶体管及其制造方法、互补场效应晶体管 |
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CN103582938A (zh) * | 2011-06-03 | 2014-02-12 | 住友电气工业株式会社 | 氮化物电子器件、氮化物电子器件的制作方法 |
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CN105474403A (zh) * | 2013-08-08 | 2016-04-06 | 富士电机株式会社 | 高耐压半导体装置及其制造方法 |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107681001A (zh) * | 2017-07-24 | 2018-02-09 | 中国电子科技集团公司第五十五研究所 | 一种碳化硅开关器件及制作方法 |
WO2019019395A1 (zh) * | 2017-07-24 | 2019-01-31 | 中国电子科技集团公司第五十五研究所 | 一种碳化硅开关器件及制作方法 |
CN107681001B (zh) * | 2017-07-24 | 2020-04-07 | 中国电子科技集团公司第五十五研究所 | 一种碳化硅开关器件及制作方法 |
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CN107393814A (zh) * | 2017-08-10 | 2017-11-24 | 中国科学院上海微系统与信息技术研究所 | 一种mos功率器件及其制备方法 |
CN111199972A (zh) * | 2018-11-16 | 2020-05-26 | 深圳比亚迪微电子有限公司 | 集成级联器件及其制备方法 |
CN111199972B (zh) * | 2018-11-16 | 2023-05-16 | 比亚迪半导体股份有限公司 | 集成级联器件及其制备方法 |
CN114284359A (zh) * | 2021-12-23 | 2022-04-05 | 无锡新洁能股份有限公司 | 低阻碳化硅mosfet器件及其制造方法 |
CN114975127A (zh) * | 2022-08-01 | 2022-08-30 | 南京融芯微电子有限公司 | 一种新型碳化硅平面式功率mosfet器件的制造方法 |
CN116387348A (zh) * | 2023-04-27 | 2023-07-04 | 南京第三代半导体技术创新中心有限公司 | 一种精确控制短沟道的平面型SiC MOSFET及其制造方法 |
CN116387348B (zh) * | 2023-04-27 | 2023-10-27 | 南京第三代半导体技术创新中心有限公司 | 一种精确控制短沟道的平面型SiC MOSFET及其制造方法 |
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