CN106773554B - 光罩结构及coa型阵列基板 - Google Patents

光罩结构及coa型阵列基板 Download PDF

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CN106773554B
CN106773554B CN201710146792.7A CN201710146792A CN106773554B CN 106773554 B CN106773554 B CN 106773554B CN 201710146792 A CN201710146792 A CN 201710146792A CN 106773554 B CN106773554 B CN 106773554B
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shielding part
light shielding
center light
hollow out
photomask structure
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CN106773554A (zh
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孙涛
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to JP2019550211A priority patent/JP2020512583A/ja
Priority to EP17900639.0A priority patent/EP3598234A4/en
Priority to US15/539,701 priority patent/US10459331B2/en
Priority to KR1020197029777A priority patent/KR20190119665A/ko
Priority to PCT/CN2017/080735 priority patent/WO2018166027A1/zh
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007Filters, e.g. additive colour filters; Components for display devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70283Mask effects on the imaging process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting

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  • Optical Filters (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

本发明提供一种光罩结构及COA型阵列基板。所述光罩结构包括中心遮光部(1)、包围所述中心遮光部(1)并与中心遮光部(1)的外轮廓形状一致的外围遮光部(3)、以及夹在所述外围遮光部(3)与中心遮光部(1)之间的环形的镂空狭缝(5),曝光光线经过所述镂空狭缝(5)会发生衍射,产生传播反向的弯散及能量强度的渐变,配合负性光阻,能够使得最终制得的彩膜层过孔的坡度变缓,从而改善像素电极和金属材质的信号线之间的电连接质量,避免出现显示不良。

Description

光罩结构及COA型阵列基板
技术领域
本发明涉及液晶显示器件制程领域,尤其涉及一种光罩结构及COA型阵列基板。
背景技术
随着显示技术的不断发展,薄膜晶体管液晶显示器(Thin Film TransistorLiquid Crystal Display,TFT-LCD)因具有高画质、省电、机身薄、体积小、无辐射等优点,而被广泛地应用于手机、电视、个人数字助理、数字相机、笔记本电脑、台式计算机等各种消费性电子产品,成为平板显示装置中的主流。
现有市场上的液晶显示器大部分为背光型液晶显示器,其包括液晶显示面板及背光模组(backlight module)。传统的液晶显示面板由彩膜基板(Color Filter,CF)、薄膜晶体管阵列基板(Thin Film Transistor Array Substrate,TFT Array Substrate)、以及一配置于两基板间的液晶层(Liquid Crystal Layer)所构成,其工作原理是通过在两片基板上施加驱动电压来控制液晶层的液晶分子的旋转,将背光模组的光线折射出来产生画面。
目前,为了提高液晶显示面板的开口率,降低寄生电容效应,越来越多的液晶显示面板产品将彩膜集成设置在阵列基板一侧,即采用COA(Color Filter On Array)技术。与将彩膜和黑矩阵设在彩膜基板上的传统技术相比,COA型阵列基板不需要考虑对盒时的偏差,因此可以在保证黑矩阵能够遮挡栅极线、数据线和薄膜晶体管单元等需遮光的结构的前提下,适当减小黑矩阵的宽度,从而提高开口率。
如图1所示,现有的COA型阵列基板,其薄膜晶体管T10的阵列上依次层叠有保护层100、彩膜层200、像素电极300和黑矩阵(未图示),并且彩膜层200上开设有过孔201,以实现像素电极300和金属材质的信号线之间的电连接。在实际的生产过程中,利用光罩(Mask)的图案配合负性光阻来制作所述彩膜层200内的过孔201。负性光阻的特性是被光照射的区域不会被显影液去除,而不被光照射的区域则会被显影液去除,这与正性光阻的特性恰好相反。
如图2所示,现有的用于制作所述彩膜层200内的过孔201的光罩所采用的图案是一实心圆形的遮光区900、以及位于该遮光区900外围的镂空的透光区901,所述实心圆形的遮光区900对应于所述彩膜层200内的过孔201的位置。然而,如图3所示,使用上述现有的光罩来制作所述彩膜层200内的过孔201会使得过孔201处彩膜层200的厚度以及坡度(Taper)不容易控制,坡度较陡,容易引起过孔201内的像素电极300发生断裂,导致像素电极300和金属材质的信号线之间的电连接不佳,从而出现产品的显示不良。若要保证良好的电连接就需要制作尺寸更大的过孔201,这无疑会降低像素开口率,并且过孔201太大的状况容易导致气体在对盒制程后极易因震动而外泄,并扩散至液晶层,从而产生泡影(Bubble)并形成黑团,影响显示效果。
发明内容
本发明的目的在于提供一种光罩结构,能够使得彩膜层过孔的坡度变缓,改善像素电极和金属材质的信号线之间的电连接质量,避免出现显示不良。
本发明的目的还在于提供一种COA型阵列基板,其彩膜层过孔的坡度较缓和,能够改善像素电极和金属材质的信号线之间的电连接质量,避免出现显示不良。
为实现上述目的,本发明提供一种光罩结构,包括中心遮光部、包围所述中心遮光部并与中心遮光部的外轮廓形状一致的外围遮光部、以及夹在所述外围遮光部与中心遮光部之间的环形的镂空狭缝。
可选的,所述中心遮光部的外轮廓形状为圆形,所述外围遮光部对应为圆环形,所述镂空狭缝对应为圆环形。
可选的,所述中心遮光部的外轮廓形状为正方形,所述外围遮光部对应为正方形样式的环形,所述镂空狭缝对应为正方形样式的环形。
可选的,所述中心遮光部的外轮廓形状为正六边形,所述外围遮光部对应为正六边形样式的环形,所述镂空狭缝对应为正六边形样式的环形。
可选的,所述中心遮光部的外轮廓形状为正八边形,所述外围遮光部对应为正八边形样式的环形,所述镂空狭缝对应为正八边形样式的环形。
所述镂空狭缝的宽度小于等于2.0um。
所述外围遮光部的宽度大于0.5um且小于等于1.0um。
所述中心遮光部与外围遮光部的材质为铬。
本发明还提供一种COA型阵列基板,包括呈阵列式排布的薄膜晶体管、及自下至上依次层叠在所述薄膜晶体管上的保护层、彩膜层、像素电极、与黑矩阵;所述彩膜层上开设有过孔,所述像素电极经由所述过孔连接薄膜晶体管的漏极;
所述过孔由具有上述光罩结构的光罩进行制作,坡度缓和,能够改善像素电极和金属材质的信号线之间的电连接质量,避免出现显示不良。
本发明的有益效果:本发明提供的一种光罩结构,在外围遮光部与中心遮光部之间夹设环形的镂空狭缝,曝光光线经过所述镂空狭缝会发生衍射,产生传播反向的弯散及能量强度的渐变,配合负性光阻,能够使得最终制得的彩膜层过孔的坡度变缓,从而改善像素电极和金属材质的信号线之间的电连接质量,避免出现显示不良。本发明提供的一种COA型阵列基板,其彩膜层过孔由具有上述光罩结构的光罩进行制作,坡度缓和,能够改善像素电极和金属材质的信号线之间的电连接质量,避免出现显示不良。
附图说明
为了能更进一步了解本发明的特征以及技术内容,请参阅以下有关本发明的详细说明与附图,然而附图仅提供参考与说明用,并非用来对本发明加以限制。
附图中,
图1为现有的COA型阵列基板的剖面结构示意图;
图2为现有的用于制作彩膜层过孔的光罩所采用的图案的示意图;
图3为使用现有的光罩来制作彩膜层过孔造成过孔坡度较陡的示意图;
图4为本发明的光罩结构第一实施例的示意图;
图5为本发明的光罩结构第二实施例的示意图;
图6为本发明的光罩结构第三实施例的示意图;
图7为本发明的光罩结构第四实施例的示意图;
图8为使用具有本发明的光罩结构的光罩来制作彩膜层过孔使得过孔坡度变缓的示意图;
图9为本发明的COA型阵列基板的剖面结构示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果,以下结合本发明的优选实施例及其附图进行详细描述。
请同时参阅图4至图7,本发明提供一种光罩结构,用于制作COA型阵列基板内的彩膜层过孔,该光罩结构包括中心遮光部1、包围所述中心遮光部1并与中心遮光部1的外轮廓形状一致的外围遮光部3、以及夹在所述外围遮光部3与中心遮光部1之间的环形的镂空狭缝5。
采用本发明的光罩配合负性光阻进行使用,所述中心遮光部1、镂空狭缝5、及外围遮光部3共同构成的图案对应于最终制得的彩膜层过孔的位置。
根据光的衍射原理,光线在穿过狭缝、或小孔之类的障碍物后会发生不同程度的弯散传播,出现明暗条纹样的衍射图样,而且明暗条纹的边界并不锐利,呈现明暗相间的状态,同时,光线的能量强度也会渐变。本发明在外围遮光部3与中心遮光部1之间夹设环形的镂空狭缝5,曝光光线经过所述镂空狭缝5便会发生衍射,产生传播反向的弯散及能量强度的渐变,而不是像经过图2所示的现有光罩后那样仍沿直线传播;曝光后,不被光照射的区域被显影液去除,而被光照射的区域则不会被显影液去除,使得最终制得的彩膜层过孔的坡度如图8所示变缓,从而改善像素电极和金属材质的信号线之间的电连接质量,避免出现显示不良。
具体地,所述中心遮光部1与外围遮光部3的材质为铬(Cr)。
图4所示为本发明的光罩结构的第一实施例,在该第一实施例中,所述中心遮光部1的外轮廓形状为正八边形,所述外围遮光部3对应为正八边形样式的环形,所述镂空狭缝5对应为正八边形样式的环形。
将中心遮光部1的外轮廓至外围遮光部3的内轮廓的垂直距离定义为镂空狭缝5的宽度,将镂空狭缝5的宽度记作B,则B的最佳取值为:
B≤2.0um
当B>2.0um时,彩膜层过孔内会出现光阻残留,引起刻蚀残留,影响曝光光线的衍射效果。
将外围遮光部3的内轮廓与外轮廓之间的垂直距离定义为外围遮光部3的宽度,将外围遮光部3的宽度记作A,则A的最佳取值为:
0.5um<A≤1.0um
在外围遮光部3的宽度A的最佳取值范围内,最终制得的彩膜层过孔的坡度明显改善;而当A≤0.5um时,最终制得的彩膜层过孔的坡度接近竖直,衍射效果不能显现。
所述中心遮光部1的尺寸可根据不同的彩膜层过孔的具体大小来进行确定。
图5所示为本发明的光罩结构的第二实施例,在该第二实施例中,所述中心遮光部1的外轮廓形状为圆形,所述外围遮光部3对应为圆环形,所述镂空狭缝5对应为圆环形。外围遮光部3的宽度A、及镂空狭缝5的宽度B的取值同实施例一,此处不再进行重复描述。
图6所示为本发明的光罩结构的第三实施例,在该第三实施例中,所述中心遮光部1的外轮廓形状为正方形,所述外围遮光部3对应为正方形样式的环形,所述镂空狭缝5对应为正方形样式的环形。外围遮光部3的宽度A、及镂空狭缝5的宽度B的取值同实施例一,此处不再进行重复描述。
图7所示为本发明的光罩的结构的第四实施例,在该第四实施例中,所述中心遮光部1的外轮廓形状为正六边形,所述外围遮光部3对应为正六边形样式的环形,所述镂空狭缝5对应为正六边形样式的环形。外围遮光部3的宽度A、及镂空狭缝5的宽度B的取值同实施例一,此处不再进行重复描述。
当然,本发明的光罩结构并不仅限于以上四个实施例,中心遮光部1还可选用正五边形、正七边形、正十边形等不同边数的正多边形形状,外围遮光部3及镂空狭缝5为对应的正多边形样式的环形,这与曝光设备、刻蚀设备的精度有关系。若曝光设备、刻蚀设备的精度较高,则可选用边数较少的正多边形形状,反之,若曝光设备、刻蚀设备的精度较低,则可选用边数较多的正多边形形状。
请参阅图9,本发明还提供一种COA型阵列基板,包括呈阵列式排布的薄膜晶体管T、及自下至上依次层叠在所述薄膜晶体管T上的保护层10、彩膜层20、像素电极30、与黑矩阵(未图示)。所述彩膜层20上开设有过孔21,所述像素电极30经由所述过孔21连接薄膜晶体管T的漏极。
所述过孔21由具有上述光罩结构的光罩进行制作,坡度缓和,从而过孔21内的像素电极30不易断裂,和金属材质的信号线之间的电连接质量得以改善,能够避免出现显示不良。
综上所述,本发明的光罩结构,在外围遮光部与中心遮光部之间夹设环形的镂空狭缝,曝光光线经过所述镂空狭缝会发生衍射,产生传播反向的弯散及能量强度的渐变,配合负性光阻,能够使得最终制得的彩膜层过孔的坡度变缓,从而改善像素电极和金属材质的信号线之间的电连接质量,避免出现显示不良。本发明的COA型阵列基板,其彩膜层过孔由具有上述光罩结构的光罩进行制作,坡度缓和,能够改善像素电极和金属材质的信号线之间的电连接质量,避免出现显示不良。
以上所述,对于本领域的普通技术人员来说,可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形,而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。

Claims (9)

1.一种光罩结构,其特征在于,用于制作COA型阵列基板内的彩膜层过孔,包括中心遮光部(1)、包围所述中心遮光部(1)并与中心遮光部(1)的外轮廓形状一致的外围遮光部(3)、以及夹在所述外围遮光部(3)与中心遮光部(1)之间的环形的镂空狭缝(5);
使用时,所述中心遮光部(1)、镂空狭缝(5)、及外围遮光部(3)共同构成的图案对应于所述彩膜层过孔的位置。
2.如权利要求1所述的光罩结构,其特征在于,所述中心遮光部(1)的外轮廓形状为圆形,所述外围遮光部(3)对应为圆环形,所述镂空狭缝(5)对应为圆环形。
3.如权利要求1所述的光罩结构,其特征在于,所述中心遮光部(1)的外轮廓形状为正方形,所述外围遮光部(3)对应为正方形样式的环形,所述镂空狭缝(5)对应为正方形样式的环形。
4.如权利要求1所述的光罩结构,其特征在于,所述中心遮光部(1)的外轮廓形状为正六边形,所述外围遮光部(3)对应为正六边形样式的环形,所述镂空狭缝(5)对应为正六边形样式的环形。
5.如权利要求1所述的光罩结构,其特征在于,所述中心遮光部(1)的外轮廓形状为正八边形,所述外围遮光部(3)对应为正八边形样式的环形,所述镂空狭缝(5)对应为正八边形样式的环形。
6.如权利要求1至5任一项所述的光罩结构,其特征在于,所述镂空狭缝(5)的宽度(B)小于等于2.0um。
7.如权利要求6所述的光罩结构,其特征在于,所述外围遮光部(3)的宽度(A)大于0.5um且小于等于1.0um。
8.如权利要求1所述的光罩结构,其特征在于,所述中心遮光部(1)与外围遮光部(3)的材质为铬。
9.一种COA型阵列基板,其特征在于,包括呈阵列式排布的薄膜晶体管(T)、及自下至上依次层叠在所述薄膜晶体管(T)上的保护层(10)、彩膜层(20)、像素电极(30)、与黑矩阵;所述彩膜层(20)上开设有过孔(21),所述像素电极(30)经由所述过孔(21)连接薄膜晶体管(T)的漏极;
所述过孔(21)由具有如权利要求1所述的光罩结构的光罩进行制作,坡度缓和。
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