CN106409723B - 紫外线照射装置及紫外线照射方法 - Google Patents

紫外线照射装置及紫外线照射方法 Download PDF

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Publication number
CN106409723B
CN106409723B CN201610622675.9A CN201610622675A CN106409723B CN 106409723 B CN106409723 B CN 106409723B CN 201610622675 A CN201610622675 A CN 201610622675A CN 106409723 B CN106409723 B CN 106409723B
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China
Prior art keywords
irradiation
unit
housing
substrate
ultraviolet
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Chinese (zh)
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CN106409723A (zh
Inventor
稻尾吉浩
小西清孝
佐藤晶彦
细田浩
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Ameco Technology Co ltd
Process Equipment Business Division Preparation Co ltd
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Tokyo Ohka Kogyo Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/0231—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to electromagnetic radiation, e.g. UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02345—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light
    • H01L21/02348—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light treatment by exposure to UV light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31058—After-treatment of organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
CN201610622675.9A 2015-08-03 2016-08-01 紫外线照射装置及紫外线照射方法 Active CN106409723B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-153347 2015-08-03
JP2015153347A JP6596257B2 (ja) 2015-08-03 2015-08-03 紫外線照射装置及び紫外線照射方法

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CN106409723A CN106409723A (zh) 2017-02-15
CN106409723B true CN106409723B (zh) 2022-08-23

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JP (1) JP6596257B2 (ja)
KR (1) KR102654792B1 (ja)
CN (1) CN106409723B (ja)
TW (1) TWI688994B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6866193B2 (ja) * 2017-03-10 2021-04-28 東京応化工業株式会社 紫外線照射装置及び紫外線照射方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008096835A1 (ja) * 2007-02-05 2008-08-14 Tokyo Electron Limited 基板処理方法及び塗布現像処理装置
CN101976004A (zh) * 2010-09-03 2011-02-16 深圳市华星光电技术有限公司 液晶面板的紫外线固化装置以及固化方法
CN103168275A (zh) * 2010-11-04 2013-06-19 株式会社Orc制作所 曝光装置
WO2014129259A1 (ja) * 2013-02-22 2014-08-28 東京エレクトロン株式会社 成膜方法、コンピュータ記憶媒体及び成膜システム

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62143426A (ja) * 1985-12-18 1987-06-26 Hitachi Ltd 光照射装置
JPH0497515A (ja) 1990-08-15 1992-03-30 Nec Corp レジスト除去装置
JP3704677B2 (ja) * 2000-06-28 2005-10-12 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR20030082729A (ko) * 2002-04-18 2003-10-23 주식회사 디엠에스 노광 시스템
JP4086582B2 (ja) * 2002-08-06 2008-05-14 キヤノン株式会社 照明装置及び露光装置
JP4342974B2 (ja) * 2003-02-12 2009-10-14 東京エレクトロン株式会社 硬化処理装置及びその方法、並びに塗布膜形成装置
JP4508738B2 (ja) * 2004-06-17 2010-07-21 東京応化工業株式会社 熱安定化装置
JP2006114848A (ja) 2004-10-18 2006-04-27 Apex Corp 紫外線照射処理装置、紫外線照射処理方法及び半導体製造装置
JP4859660B2 (ja) * 2006-12-27 2012-01-25 東京応化工業株式会社 基板処置装置
JP5186224B2 (ja) * 2008-01-29 2013-04-17 東京応化工業株式会社 基板処置装置
JP5281350B2 (ja) * 2008-09-29 2013-09-04 株式会社オーク製作所 周辺露光装置及び周辺露光方法
WO2011080852A1 (ja) * 2009-12-28 2011-07-07 シャープ株式会社 液晶表示パネルの製造方法及び製造装置
JP5891013B2 (ja) * 2011-11-18 2016-03-22 東京応化工業株式会社 紫外線照射装置及び基板処理装置
JP6072644B2 (ja) * 2013-08-05 2017-02-01 東京エレクトロン株式会社 紫外線照射装置、基板処理方法、プログラム及びコンピュータ記憶媒体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008096835A1 (ja) * 2007-02-05 2008-08-14 Tokyo Electron Limited 基板処理方法及び塗布現像処理装置
CN101976004A (zh) * 2010-09-03 2011-02-16 深圳市华星光电技术有限公司 液晶面板的紫外线固化装置以及固化方法
CN103168275A (zh) * 2010-11-04 2013-06-19 株式会社Orc制作所 曝光装置
WO2014129259A1 (ja) * 2013-02-22 2014-08-28 東京エレクトロン株式会社 成膜方法、コンピュータ記憶媒体及び成膜システム

Also Published As

Publication number Publication date
JP2017034118A (ja) 2017-02-09
TW201709285A (zh) 2017-03-01
TWI688994B (zh) 2020-03-21
CN106409723A (zh) 2017-02-15
JP6596257B2 (ja) 2019-10-23
KR20170016286A (ko) 2017-02-13
KR102654792B1 (ko) 2024-04-05

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Effective date of registration: 20230607

Address after: Kanagawa, Japan

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Patentee before: TOKYO OHKA KOGYO Co.,Ltd.

Effective date of registration: 20230607

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Patentee after: Ameco Technology Co.,Ltd.

Address before: Kanagawa, Japan

Patentee before: Process Equipment Business Division Preparation Co.,Ltd.