CN106252312B - 具有堆叠端子的半导体器件 - Google Patents
具有堆叠端子的半导体器件 Download PDFInfo
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- CN106252312B CN106252312B CN201610416351.XA CN201610416351A CN106252312B CN 106252312 B CN106252312 B CN 106252312B CN 201610416351 A CN201610416351 A CN 201610416351A CN 106252312 B CN106252312 B CN 106252312B
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- terminal
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- semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/63—Connectors not provided for in any of the groups H01L24/10 - H01L24/50 and subgroups; Manufacturing methods related thereto
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/22—Spot welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/244—Overlap seam welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K33/00—Specially-profiled edge portions of workpieces for making soldering or welding connections; Filling the seams formed thereby
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/89—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using at least one connector not provided for in any of the groups H01L24/81 - H01L24/86
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/24—Frameworks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/63—Connectors not provided for in any of the groups H01L2224/10 - H01L2224/50 and subgroups; Manufacturing methods related thereto
- H01L2224/68—Structure, shape, material or disposition of the connectors after the connecting process
- H01L2224/70—Structure, shape, material or disposition of the connectors after the connecting process of a plurality of connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Inverter Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/737,086 US11570921B2 (en) | 2015-06-11 | 2015-06-11 | Semiconductor device with stacked terminals |
US14/737,086 | 2015-06-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106252312A CN106252312A (zh) | 2016-12-21 |
CN106252312B true CN106252312B (zh) | 2021-05-11 |
Family
ID=57394884
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610416351.XA Active CN106252312B (zh) | 2015-06-11 | 2016-06-08 | 具有堆叠端子的半导体器件 |
Country Status (4)
Country | Link |
---|---|
US (2) | US11570921B2 (zh) |
JP (2) | JP7088625B2 (zh) |
CN (1) | CN106252312B (zh) |
DE (1) | DE102016108562A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10090279B2 (en) * | 2017-03-03 | 2018-10-02 | Semiconductor Components Industries, Llc | Stray inductance reduction in packaged semiconductor devices and modules |
CN107393914A (zh) * | 2017-08-30 | 2017-11-24 | 扬州国扬电子有限公司 | 一种具有平行安装电极组合的功率模组 |
JP7267716B2 (ja) * | 2018-11-12 | 2023-05-02 | ローム株式会社 | 半導体装置 |
JP7095649B2 (ja) | 2019-04-24 | 2022-07-05 | トヨタ自動車株式会社 | 車両駆動装置用回転機の端子接続構造 |
JP7467913B2 (ja) | 2019-12-27 | 2024-04-16 | 富士電機株式会社 | 半導体装置 |
DE102020111573B4 (de) | 2020-04-28 | 2023-09-14 | Semikron Elektronik Gmbh & Co. Kg | Leistungselektronische Anordnung mit Gleichspannungsverbindungselement und Verfahren zur Herstellung |
DE112022000173T5 (de) * | 2021-06-23 | 2023-07-20 | Fuji Electric Co., Ltd. | Halbleitermodul und verfahren zu dessen herstellung |
Citations (3)
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CN101820106A (zh) * | 2009-01-13 | 2010-09-01 | 通用汽车环球科技运作公司 | 低电感母线组件 |
CN102881682A (zh) * | 2011-07-11 | 2013-01-16 | 株式会社日立制作所 | 半导体功率模块 |
CN204130523U (zh) * | 2014-07-08 | 2015-01-28 | 南京银茂微电子制造有限公司 | 一种功率模块引线端子 |
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JP2008306867A (ja) * | 2007-06-08 | 2008-12-18 | Fuji Electric Systems Co Ltd | 電力変換装置および電気部品の接続方法 |
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JP2011252935A (ja) * | 2008-09-26 | 2011-12-15 | Sharp Corp | 回路基板及び表示装置 |
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JP5835466B2 (ja) * | 2012-03-28 | 2015-12-24 | 富士電機株式会社 | 半導体装置 |
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JP6295768B2 (ja) * | 2014-03-26 | 2018-03-20 | 株式会社デンソー | 半導体装置の製造方法 |
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JP6354392B2 (ja) * | 2014-07-03 | 2018-07-11 | 株式会社デンソー | 半導体装置 |
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2015
- 2015-06-11 US US14/737,086 patent/US11570921B2/en active Active
-
2016
- 2016-04-18 JP JP2016082836A patent/JP7088625B2/ja active Active
- 2016-05-10 DE DE102016108562.6A patent/DE102016108562A1/de active Pending
- 2016-06-08 CN CN201610416351.XA patent/CN106252312B/zh active Active
-
2021
- 2021-06-15 JP JP2021099119A patent/JP7393387B2/ja active Active
-
2023
- 2023-01-27 US US18/160,965 patent/US20230171909A1/en active Pending
Patent Citations (3)
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CN101820106A (zh) * | 2009-01-13 | 2010-09-01 | 通用汽车环球科技运作公司 | 低电感母线组件 |
CN102881682A (zh) * | 2011-07-11 | 2013-01-16 | 株式会社日立制作所 | 半导体功率模块 |
CN204130523U (zh) * | 2014-07-08 | 2015-01-28 | 南京银茂微电子制造有限公司 | 一种功率模块引线端子 |
Also Published As
Publication number | Publication date |
---|---|
DE102016108562A1 (de) | 2016-12-15 |
CN106252312A (zh) | 2016-12-21 |
JP7393387B2 (ja) | 2023-12-06 |
JP7088625B2 (ja) | 2022-06-21 |
JP2021141339A (ja) | 2021-09-16 |
US11570921B2 (en) | 2023-01-31 |
JP2017005241A (ja) | 2017-01-05 |
US20230171909A1 (en) | 2023-06-01 |
US20160366778A1 (en) | 2016-12-15 |
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Address after: Texas, USA Patentee after: TESLA, Inc. Address before: California, USA Patentee before: TESLA, Inc. |
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CP02 | Change in the address of a patent holder |