JP4532303B2 - 半導体モジュール - Google Patents
半導体モジュール Download PDFInfo
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- JP4532303B2 JP4532303B2 JP2005032008A JP2005032008A JP4532303B2 JP 4532303 B2 JP4532303 B2 JP 4532303B2 JP 2005032008 A JP2005032008 A JP 2005032008A JP 2005032008 A JP2005032008 A JP 2005032008A JP 4532303 B2 JP4532303 B2 JP 4532303B2
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- metal electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/3754—Coating
- H01L2224/37599—Material
- H01L2224/376—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/848—Bonding techniques
- H01L2224/84801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/848—Bonding techniques
- H01L2224/8485—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
Description
2 負極側取出し端子(負極側取出し端子)
3 中間取出し端子
4 中間接続部(中間接続部)
6 樹脂
10 上アーム(上アーム部)
11 IGBT素子(第1半導体素子群)
12 ダイオード素子(第1半導体素子群)
13 金属電極(第1金属電極)
14 金属電極(第2金属電極)
15 ゲート電極端子
20 下アーム(下アーム部)
21 IGBT素子(第2半導体素子群)
22 ダイオード素子(第2半導体素子群)
23 金属電極(第3金属電極)
24 金属電極(第4金属電極)
25 ゲート電極端子
100 半導体モジュール(半導体モジュール)
Claims (4)
- 上アーム部を構成する第1半導体素子群と,下アーム部を構成する第2半導体素子群とを備え,前記第1半導体素子群と前記第2半導体素子群とを同一平面内に配置した半導体モジュールにおいて,
前記第1半導体素子群の一方の面側に位置する第1金属電極と,
前記第1半導体素子群の他方の面側に位置し,前記第1半導体素子群を挟んで前記第1金属電極と対向する第2金属電極と,
前記第2半導体素子群の一方の面側に位置し,前記第2金属電極と電気的に接続された第3金属電極と,
前記第2半導体素子群の他方の面側に位置し,前記第2半導体素子群を挟んで前記第3金属電極と対向する第4金属電極と,
一方の端部が前記第2金属電極のうちの前記下アーム部と対向する部位と接合し,他方の端部が前記第3金属電極のうちの前記上アーム部と対向する部位と接合し,前記第2金属電極と前記第3金属電極とを電気的に接続する中間接続部と,
前記第1金属電極のうちの前記下アーム部と対向する部位と接合する平板状の正極側取出し端子と,
前記第4金属電極のうちの前記上アーム部と対向する部位と接合する平板状の負極側取出し端子とを備えることを特徴とする半導体モジュール。 - 請求項1に記載する半導体モジュールにおいて,
前記第1金属電極を流れる主電流の向きが前記第2金属電極を流れる主電流の向きと略反対となるように前記第1半導体素子群を配置し,前記第3金属電極を流れる主電流の向きが前記第4金属電極を流れる主電流の向きと略反対となるように前記第2半導体素子群を配置することを特徴とする半導体モジュール。 - 請求項1または請求項2に記載する半導体モジュールにおいて,
電極面から見て,前記第1半導体素子群を構成する半導体素子と,前記第2半導体素子群を構成する半導体素子とが同一直線上に配置されていることを特徴とする半導体モジュール。 - 請求項1から請求項3のいずれか1つに記載する半導体モジュールにおいて,
前記正極側取出し端子と前記負極側取出し端子とは,その平面同士が対向していることを特徴とする半導体モジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005032008A JP4532303B2 (ja) | 2005-02-08 | 2005-02-08 | 半導体モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005032008A JP4532303B2 (ja) | 2005-02-08 | 2005-02-08 | 半導体モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006222149A JP2006222149A (ja) | 2006-08-24 |
JP4532303B2 true JP4532303B2 (ja) | 2010-08-25 |
Family
ID=36984271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005032008A Expired - Fee Related JP4532303B2 (ja) | 2005-02-08 | 2005-02-08 | 半導体モジュール |
Country Status (1)
Country | Link |
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JP (1) | JP4532303B2 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4436843B2 (ja) | 2007-02-07 | 2010-03-24 | 株式会社日立製作所 | 電力変換装置 |
JP5267021B2 (ja) * | 2008-09-30 | 2013-08-21 | 株式会社デンソー | 半導体装置およびそれを用いたインバータ回路 |
US8497572B2 (en) | 2010-07-05 | 2013-07-30 | Denso Corporation | Semiconductor module and method of manufacturing the same |
DE112010006032B4 (de) * | 2010-11-29 | 2018-10-04 | Toyota Jidosha Kabushiki Kaisha | Leistungsmodul, aufweisend eine Halbleitervorrichtung |
DE112013003222B4 (de) | 2012-06-29 | 2021-08-19 | Denso Corporation | Halbleitervorrichtung und Halbleitervorrichtungsverbindungsstruktur |
JP5739956B2 (ja) * | 2013-09-09 | 2015-06-24 | 日立オートモティブシステムズ株式会社 | 半導体モジュールおよびこれを用いた電力変換装置 |
JP2015225988A (ja) * | 2014-05-29 | 2015-12-14 | パナソニックIpマネジメント株式会社 | 半導体装置 |
US11570921B2 (en) * | 2015-06-11 | 2023-01-31 | Tesla, Inc. | Semiconductor device with stacked terminals |
CN107851636B (zh) | 2016-07-15 | 2020-08-14 | 新电元工业株式会社 | 半导体模块 |
DE102016120778B4 (de) | 2016-10-31 | 2024-01-25 | Infineon Technologies Ag | Baugruppe mit vertikal beabstandeten, teilweise verkapselten Kontaktstrukturen |
JP6368763B2 (ja) * | 2016-12-05 | 2018-08-01 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
JP6922450B2 (ja) * | 2017-06-08 | 2021-08-18 | 株式会社デンソー | 半導体モジュール |
JP6782809B2 (ja) * | 2019-04-05 | 2020-11-11 | 日立オートモティブシステムズ株式会社 | 半導体モジュール及びこれを備えた電力変換装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1056131A (ja) * | 1996-08-12 | 1998-02-24 | Denso Corp | 半導体装置 |
JP2000049281A (ja) * | 1998-07-31 | 2000-02-18 | Toshiba Corp | 半導体装置 |
JP2001308263A (ja) * | 2000-04-19 | 2001-11-02 | Denso Corp | 半導体スイッチングモジュ−ル及びそれを用いた半導体装置 |
JP2001332688A (ja) * | 2000-05-25 | 2001-11-30 | Nissan Motor Co Ltd | 電力配線構造及び半導体装置 |
JP2002203941A (ja) * | 2001-01-04 | 2002-07-19 | Nissan Motor Co Ltd | 半導体実装構造 |
-
2005
- 2005-02-08 JP JP2005032008A patent/JP4532303B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1056131A (ja) * | 1996-08-12 | 1998-02-24 | Denso Corp | 半導体装置 |
JP2000049281A (ja) * | 1998-07-31 | 2000-02-18 | Toshiba Corp | 半導体装置 |
JP2001308263A (ja) * | 2000-04-19 | 2001-11-02 | Denso Corp | 半導体スイッチングモジュ−ル及びそれを用いた半導体装置 |
JP2001332688A (ja) * | 2000-05-25 | 2001-11-30 | Nissan Motor Co Ltd | 電力配線構造及び半導体装置 |
JP2002203941A (ja) * | 2001-01-04 | 2002-07-19 | Nissan Motor Co Ltd | 半導体実装構造 |
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Publication number | Publication date |
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JP2006222149A (ja) | 2006-08-24 |
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