CN106233624B - 水晶振动装置以及其制造方法 - Google Patents

水晶振动装置以及其制造方法 Download PDF

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Publication number
CN106233624B
CN106233624B CN201580020585.6A CN201580020585A CN106233624B CN 106233624 B CN106233624 B CN 106233624B CN 201580020585 A CN201580020585 A CN 201580020585A CN 106233624 B CN106233624 B CN 106233624B
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China
Prior art keywords
crystal
package
mentioned
packaging part
vibration
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CN201580020585.6A
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English (en)
Chinese (zh)
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CN106233624A (zh
Inventor
池田功
古井仁哉
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication of CN106233624A publication Critical patent/CN106233624A/zh
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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
CN201580020585.6A 2014-04-24 2015-01-27 水晶振动装置以及其制造方法 Active CN106233624B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014090080 2014-04-24
JP2014-090080 2014-04-24
PCT/JP2015/052118 WO2015162958A1 (ja) 2014-04-24 2015-01-27 水晶振動装置及びその製造方法

Publications (2)

Publication Number Publication Date
CN106233624A CN106233624A (zh) 2016-12-14
CN106233624B true CN106233624B (zh) 2018-12-21

Family

ID=54332132

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580020585.6A Active CN106233624B (zh) 2014-04-24 2015-01-27 水晶振动装置以及其制造方法

Country Status (5)

Country Link
US (1) US10511282B2 (enExample)
JP (1) JP5991452B2 (enExample)
CN (1) CN106233624B (enExample)
TW (1) TW201543811A (enExample)
WO (1) WO2015162958A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107733394A (zh) * 2017-09-18 2018-02-23 维沃移动通信有限公司 一种晶振及其制作方法和电子设备
JP6856132B2 (ja) * 2017-09-22 2021-04-07 株式会社村田製作所 圧電振動子及び圧電振動子の製造方法
WO2019065519A1 (ja) * 2017-09-27 2019-04-04 株式会社村田製作所 圧電振動子及び圧電振動子の製造方法
TWI763298B (zh) * 2021-02-03 2022-05-01 國立陽明交通大學 石英振盪器的製作方法與結構
WO2024047745A1 (ja) * 2022-08-30 2024-03-07 京セラ株式会社 振動デバイス

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010041550A (ja) * 2008-08-07 2010-02-18 Nippon Dempa Kogyo Co Ltd 圧電デバイスとその製造方法
CN102201796A (zh) * 2010-03-19 2011-09-28 精工爱普生株式会社 封装件、电子装置、以及电子装置的制造方法
CN102420580A (zh) * 2010-09-28 2012-04-18 日本电波工业株式会社 压电装置
JP2012142909A (ja) * 2010-10-15 2012-07-26 Nippon Dempa Kogyo Co Ltd 圧電デバイス及び圧電デバイスの製造方法
CN102684636A (zh) * 2011-03-09 2012-09-19 精工爱普生株式会社 振动元件、振子、振荡器以及电子设备
CN102769443A (zh) * 2011-05-06 2012-11-07 日本电波工业株式会社 压电振动片、具有压电振动片的压电装置及压电装置的制造方法
JP2013046120A (ja) * 2011-08-23 2013-03-04 Nippon Dempa Kogyo Co Ltd 表面実装型圧電デバイス
CN103227617A (zh) * 2012-01-31 2013-07-31 日本电波工业株式会社 水晶振动片及水晶元件

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JPS5188948A (ja) * 1975-02-01 1976-08-04 Horiariirenmechirenperuokishidono seizohoho
JPS5478690A (en) * 1977-12-05 1979-06-22 Matsushima Kogyo Co Ltd Crystal vibrator
JPS5478693A (en) * 1977-12-05 1979-06-22 Matsushima Kogyo Co Ltd Crystal vibrator
JPH0478690A (ja) * 1990-07-23 1992-03-12 A Fin Arnold モジユラー浮遊構造物およびその製造方法
DE4419085C2 (de) * 1993-05-31 1999-09-02 Murata Manufacturing Co Chipförmiger Baustein mit piezoelektrischer Resonanz
JP3141723B2 (ja) * 1995-04-11 2001-03-05 株式会社村田製作所 幅モードを利用した共振子及び共振部品
JP2000323959A (ja) * 1999-05-14 2000-11-24 Murata Mfg Co Ltd 圧電部品
JP4424009B2 (ja) * 2003-05-30 2010-03-03 株式会社村田製作所 圧電共振部品の製造方法
JP2006166390A (ja) * 2004-02-05 2006-06-22 Seiko Epson Corp 圧電振動片、圧電振動子及び圧電発振器
JP5003039B2 (ja) 2006-07-10 2012-08-15 セイコーエプソン株式会社 水晶振動子パッケージ、発振器、及び電子機器
JP5188948B2 (ja) * 2008-12-19 2013-04-24 京セラクリスタルデバイス株式会社 水晶振動子
JP5507298B2 (ja) 2010-03-12 2014-05-28 エスアイアイ・クリスタルテクノロジー株式会社 水晶振動板の製造方法
JP2012060628A (ja) * 2010-08-07 2012-03-22 Nippon Dempa Kogyo Co Ltd 圧電デバイス及びその製造方法
JP2013012977A (ja) * 2011-06-30 2013-01-17 Nippon Dempa Kogyo Co Ltd 圧電デバイス及び圧電デバイスの製造方法
WO2016063863A1 (ja) * 2014-10-22 2016-04-28 株式会社村田製作所 共振子及び共振装置
WO2017126185A1 (ja) * 2016-01-21 2017-07-27 株式会社村田製作所 水晶振動子及びその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010041550A (ja) * 2008-08-07 2010-02-18 Nippon Dempa Kogyo Co Ltd 圧電デバイスとその製造方法
CN102201796A (zh) * 2010-03-19 2011-09-28 精工爱普生株式会社 封装件、电子装置、以及电子装置的制造方法
CN102420580A (zh) * 2010-09-28 2012-04-18 日本电波工业株式会社 压电装置
JP2012142909A (ja) * 2010-10-15 2012-07-26 Nippon Dempa Kogyo Co Ltd 圧電デバイス及び圧電デバイスの製造方法
CN102684636A (zh) * 2011-03-09 2012-09-19 精工爱普生株式会社 振动元件、振子、振荡器以及电子设备
CN102769443A (zh) * 2011-05-06 2012-11-07 日本电波工业株式会社 压电振动片、具有压电振动片的压电装置及压电装置的制造方法
JP2013046120A (ja) * 2011-08-23 2013-03-04 Nippon Dempa Kogyo Co Ltd 表面実装型圧電デバイス
CN103227617A (zh) * 2012-01-31 2013-07-31 日本电波工业株式会社 水晶振动片及水晶元件

Also Published As

Publication number Publication date
CN106233624A (zh) 2016-12-14
US10511282B2 (en) 2019-12-17
TW201543811A (zh) 2015-11-16
WO2015162958A1 (ja) 2015-10-29
US20170026027A1 (en) 2017-01-26
TWI562537B (enExample) 2016-12-11
JPWO2015162958A1 (ja) 2017-04-13
JP5991452B2 (ja) 2016-09-14

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