CN106068549B - 基于钴的互连及其制造方法 - Google Patents

基于钴的互连及其制造方法 Download PDF

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CN106068549B
CN106068549B CN201580002697.9A CN201580002697A CN106068549B CN 106068549 B CN106068549 B CN 106068549B CN 201580002697 A CN201580002697 A CN 201580002697A CN 106068549 B CN106068549 B CN 106068549B
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cobalt
adhesion layer
fill material
fill
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CN106068549A (zh
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C·J·杰泽斯基
T·K·因杜库里
R·V·谢比亚姆
C·T·卡弗
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Intel Corp
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Intel Corp
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    • H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H01L21/76831—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers in via holes or trenches, e.g. non-conductive sidewall liners
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  • Engineering & Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
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US9997457B2 (en) * 2013-12-20 2018-06-12 Intel Corporation Cobalt based interconnects and methods of fabrication thereof
US9847289B2 (en) * 2014-05-30 2017-12-19 Applied Materials, Inc. Protective via cap for improved interconnect performance
EP3155650A4 (en) * 2014-06-16 2018-03-14 Intel Corporation Seam healing of metal interconnects
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