CN105990202B - 基板处理装置和基板处理方法 - Google Patents

基板处理装置和基板处理方法 Download PDF

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Publication number
CN105990202B
CN105990202B CN201610158293.5A CN201610158293A CN105990202B CN 105990202 B CN105990202 B CN 105990202B CN 201610158293 A CN201610158293 A CN 201610158293A CN 105990202 B CN105990202 B CN 105990202B
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China
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block
substrate
module
transfer
modules
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CN201610158293.5A
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Chinese (zh)
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CN105990202A (zh
Inventor
山冈辉贵
田岛直树
元井宏治
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
CN201610158293.5A 2015-03-19 2016-03-18 基板处理装置和基板处理方法 Active CN105990202B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015056467A JP6292155B2 (ja) 2015-03-19 2015-03-19 基板処理装置、基板処理方法及び記憶媒体
JP2015-056467 2015-03-19

Publications (2)

Publication Number Publication Date
CN105990202A CN105990202A (zh) 2016-10-05
CN105990202B true CN105990202B (zh) 2020-11-24

Family

ID=56925128

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CN201610158293.5A Active CN105990202B (zh) 2015-03-19 2016-03-18 基板处理装置和基板处理方法

Country Status (5)

Country Link
US (1) US9978619B2 (https=)
JP (1) JP6292155B2 (https=)
KR (1) KR102408670B1 (https=)
CN (1) CN105990202B (https=)
TW (1) TWI630673B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9964863B1 (en) * 2016-12-20 2018-05-08 Applied Materials, Inc. Post exposure processing apparatus
JP6811951B2 (ja) * 2017-02-03 2021-01-13 株式会社ディスコ 搬送機構
CN108873626B (zh) * 2018-07-02 2021-04-23 京东方科技集团股份有限公司 涂胶显影设备
JP7300935B2 (ja) * 2019-09-02 2023-06-30 東京エレクトロン株式会社 塗布、現像装置
JP7363591B2 (ja) * 2020-03-05 2023-10-18 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US11482433B2 (en) * 2020-07-17 2022-10-25 Intel Corporation Stacked thermal processing chamber modules for remote radiative heating in semiconductor device manufacture
JP7555210B2 (ja) * 2020-07-29 2024-09-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7571498B2 (ja) * 2020-11-25 2024-10-23 東京エレクトロン株式会社 基板処理装置及び基板処理方法
WO2025187444A1 (ja) * 2024-03-05 2025-09-12 東京エレクトロン株式会社 裏面処理装置、基板処理システム及び基板搬送方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101335187A (zh) * 2007-06-29 2008-12-31 株式会社迅动 基板处理装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4685584B2 (ja) * 2005-03-11 2011-05-18 東京エレクトロン株式会社 塗布、現像装置
US7403260B2 (en) * 2005-03-11 2008-07-22 Tokyo Electron Limited Coating and developing system
JP4654119B2 (ja) * 2005-11-29 2011-03-16 東京エレクトロン株式会社 塗布・現像装置及び塗布・現像方法
JP4816217B2 (ja) * 2006-04-14 2011-11-16 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5023679B2 (ja) * 2006-12-05 2012-09-12 東京エレクトロン株式会社 塗布、現像装置及びその方法並びに記憶媒体
JP2008258208A (ja) * 2007-03-30 2008-10-23 Tokyo Electron Ltd 塗布、現像装置及びその方法並びに記憶媒体
JP4924186B2 (ja) * 2007-04-27 2012-04-25 東京エレクトロン株式会社 塗布、現像装置及びその方法並びに記憶媒体
JP4464993B2 (ja) * 2007-06-29 2010-05-19 東京エレクトロン株式会社 基板の処理システム
JP5151383B2 (ja) * 2007-10-12 2013-02-27 東京エレクトロン株式会社 塗布、現像装置、その方法及び記憶媒体
JP2009135169A (ja) * 2007-11-29 2009-06-18 Tokyo Electron Ltd 基板処理システムおよび基板処理方法
JP2009231624A (ja) * 2008-03-24 2009-10-08 Sokudo Co Ltd 基板処理装置
JP5187274B2 (ja) * 2009-05-28 2013-04-24 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP2011003864A (ja) * 2009-06-22 2011-01-06 Tokyo Electron Ltd 基板搬送装置、基板搬送方法、塗布、現像装置及び記憶媒体
JP5736687B2 (ja) * 2009-10-06 2015-06-17 東京エレクトロン株式会社 基板処理装置
JP5562759B2 (ja) * 2009-11-04 2014-07-30 東京エレクトロン株式会社 基板処理装置
JP2011159884A (ja) * 2010-02-02 2011-08-18 Yaskawa Electric Corp 発塵防止機構を備えた基板搬送装置
US9004788B2 (en) * 2010-06-08 2015-04-14 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, and storage medium
JP5338757B2 (ja) * 2010-07-09 2013-11-13 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5608148B2 (ja) * 2011-11-25 2014-10-15 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置
JP5565422B2 (ja) * 2012-02-08 2014-08-06 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101335187A (zh) * 2007-06-29 2008-12-31 株式会社迅动 基板处理装置

Also Published As

Publication number Publication date
TWI630673B (zh) 2018-07-21
CN105990202A (zh) 2016-10-05
KR102408670B1 (ko) 2022-06-15
TW201701389A (zh) 2017-01-01
JP2016178185A (ja) 2016-10-06
KR20160113024A (ko) 2016-09-28
US20160274469A1 (en) 2016-09-22
US9978619B2 (en) 2018-05-22
JP6292155B2 (ja) 2018-03-14

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