CN105917479A - Led封装材料 - Google Patents
Led封装材料 Download PDFInfo
- Publication number
- CN105917479A CN105917479A CN201480058307.5A CN201480058307A CN105917479A CN 105917479 A CN105917479 A CN 105917479A CN 201480058307 A CN201480058307 A CN 201480058307A CN 105917479 A CN105917479 A CN 105917479A
- Authority
- CN
- China
- Prior art keywords
- led
- encapsulation material
- led encapsulation
- surfactant
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008393 encapsulating agent Substances 0.000 title claims abstract description 21
- 239000002245 particle Substances 0.000 claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 40
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 39
- 229920005989 resin Polymers 0.000 claims abstract description 38
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 38
- 125000001424 substituent group Chemical group 0.000 claims abstract description 28
- 229920000642 polymer Polymers 0.000 claims abstract description 25
- -1 dimethylsiloxane group Chemical group 0.000 claims abstract description 16
- 239000000203 mixture Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 102
- 239000004094 surface-active agent Substances 0.000 claims description 48
- 238000005538 encapsulation Methods 0.000 claims description 40
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims description 33
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 25
- 125000000524 functional group Chemical group 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 20
- 239000003112 inhibitor Substances 0.000 claims description 19
- 239000011159 matrix material Substances 0.000 claims description 18
- 229920001296 polysiloxane Polymers 0.000 claims description 18
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052739 hydrogen Inorganic materials 0.000 claims description 12
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 10
- 239000003431 cross linking reagent Substances 0.000 claims description 9
- 230000004907 flux Effects 0.000 claims description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 9
- 125000003944 tolyl group Chemical group 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical compound C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 claims description 5
- 229910018557 Si O Inorganic materials 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 2
- YBUIRAZOPRQNDE-UHFFFAOYSA-N [dimethoxy(methyl)silyl]methyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)COC(=O)C(C)=C YBUIRAZOPRQNDE-UHFFFAOYSA-N 0.000 claims description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 2
- 238000002454 metastable transfer emission spectrometry Methods 0.000 claims description 2
- 239000002105 nanoparticle Substances 0.000 claims description 2
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 claims description 2
- 229960003493 octyltriethoxysilane Drugs 0.000 claims description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 2
- 229910052593 corundum Inorganic materials 0.000 claims 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 2
- 229910001845 yogo sapphire Inorganic materials 0.000 claims 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 230000003466 anti-cipated effect Effects 0.000 claims 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 1
- 238000000605 extraction Methods 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000004408 titanium dioxide Substances 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 36
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 31
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 23
- 230000005284 excitation Effects 0.000 description 15
- 229920006387 Vinylite Polymers 0.000 description 14
- 238000005259 measurement Methods 0.000 description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 10
- 239000001257 hydrogen Substances 0.000 description 10
- 125000003118 aryl group Chemical group 0.000 description 9
- DCERHCFNWRGHLK-UHFFFAOYSA-N C[Si](C)C Chemical compound C[Si](C)C DCERHCFNWRGHLK-UHFFFAOYSA-N 0.000 description 8
- 229910007161 Si(CH3)3 Inorganic materials 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 229910052697 platinum Inorganic materials 0.000 description 8
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 7
- 230000010354 integration Effects 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- 238000010998 test method Methods 0.000 description 7
- 150000001335 aliphatic alkanes Chemical class 0.000 description 6
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 6
- NOKUWSXLHXMAOM-UHFFFAOYSA-N hydroxy(phenyl)silicon Chemical compound O[Si]C1=CC=CC=C1 NOKUWSXLHXMAOM-UHFFFAOYSA-N 0.000 description 4
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- VUXIKMOZKKNQMJ-UHFFFAOYSA-N C(C(C)(C)C)(=O)OC[Si](OCC)(OCC)OCC Chemical compound C(C(C)(C)C)(=O)OC[Si](OCC)(OCC)OCC VUXIKMOZKKNQMJ-UHFFFAOYSA-N 0.000 description 1
- 241000790917 Dioxys <bee> Species 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20130127331 | 2013-10-24 | ||
| KR10-2013-0127331 | 2013-10-24 | ||
| PCT/EP2014/072811 WO2015059258A1 (en) | 2013-10-24 | 2014-10-24 | Led encapsulant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105917479A true CN105917479A (zh) | 2016-08-31 |
Family
ID=51790697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480058307.5A Pending CN105917479A (zh) | 2013-10-24 | 2014-10-24 | Led封装材料 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20160254425A1 (ja) |
| EP (1) | EP3061138A1 (ja) |
| JP (1) | JP2016537810A (ja) |
| KR (1) | KR20150047448A (ja) |
| CN (1) | CN105917479A (ja) |
| TW (2) | TWI535792B (ja) |
| WO (2) | WO2015060693A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110072942A (zh) * | 2016-12-20 | 2019-07-30 | 美国陶氏有机硅公司 | 可固化有机硅组合物 |
| CN111712537A (zh) * | 2018-03-12 | 2020-09-25 | 美国陶氏有机硅公司 | 可固化有机硅组合物及其固化产物 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10152867B2 (en) | 2012-10-23 | 2018-12-11 | Kali Care, Inc. | Portable management and monitoring system for eye drop medication regiment |
| US10441214B2 (en) | 2015-01-29 | 2019-10-15 | Kali Care, Inc. | Monitoring adherence to a medication regimen using a sensor |
| US10366207B2 (en) | 2015-02-12 | 2019-07-30 | Kali Care, Inc. | Monitoring adherence to a medication regimen using a sensor |
| JP6925100B2 (ja) * | 2015-05-21 | 2021-08-25 | 日亜化学工業株式会社 | 発光装置 |
| KR102411541B1 (ko) * | 2015-08-07 | 2022-06-22 | 삼성디스플레이 주식회사 | 고분자 필름 형성용 조성물, 이로부터 제조된 고분자 필름 및 상기 고분자 필름을 포함한 전자 소자 |
| WO2017132137A1 (en) * | 2016-01-25 | 2017-08-03 | Carnegie Mellon University | Composite composition and modification of inorganic particles for use in composite compositions |
| TWI763735B (zh) | 2016-12-09 | 2022-05-11 | 美商道康寧公司 | 組成物、光漫散器和由其所形成之裝置、及相關方法 |
| US11664356B2 (en) | 2020-03-26 | 2023-05-30 | Nichia Corporation | Light emitting device |
| US11444225B2 (en) | 2020-09-08 | 2022-09-13 | Dominant Opto Technologies Sdn Bhd | Light emitting diode package having a protective coating |
| US11329206B2 (en) | 2020-09-28 | 2022-05-10 | Dominant Opto Technologies Sdn Bhd | Lead frame and housing sub-assembly for use in a light emitting diode package and method for manufacturing the same |
| AT524756A1 (de) | 2021-02-26 | 2022-09-15 | Gebrueder Busatis Ges M B H | Schneidleiste insbesondere Gegenschneide für Häckselmaschinen |
| CN114087547A (zh) * | 2021-11-24 | 2022-02-25 | 盐城东山精密制造有限公司 | 一种实现灯珠高效广角的工艺 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050006794A1 (en) * | 2003-07-09 | 2005-01-13 | Tsutomu Kashiwagi | Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device |
| US20050038188A1 (en) * | 2003-08-14 | 2005-02-17 | Dongchan Ahn | Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance |
| CN1674315A (zh) * | 2004-03-26 | 2005-09-28 | 株式会社小糸制作所 | 光源组件和车辆用前照灯 |
| CN101544833A (zh) * | 2008-03-24 | 2009-09-30 | 信越化学工业株式会社 | 固化性硅橡胶组合物以及半导体装置 |
| JP2012041428A (ja) * | 2010-08-18 | 2012-03-01 | Shin-Etsu Chemical Co Ltd | シリコーン樹脂組成物及び光半導体ケース |
Family Cites Families (20)
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|---|---|---|---|---|
| JP4586967B2 (ja) * | 2003-07-09 | 2010-11-24 | 信越化学工業株式会社 | 発光半導体被覆保護材及び発光半導体装置 |
| JP4821959B2 (ja) * | 2005-05-30 | 2011-11-24 | 信越化学工業株式会社 | フロロシリコーンゴム組成物及びゴム成型物 |
| RU2401846C2 (ru) * | 2006-04-25 | 2010-10-20 | Учреждение Российской академии наук Институт синтетических полимерных материалов им. Н.С. Ениколопова РАН (ИСПМ РАН) | Функциональные полиорганосилоксаны и композиция, способная к отверждению на их основе |
| JP4952051B2 (ja) * | 2006-05-10 | 2012-06-13 | ソニー株式会社 | 金属酸化物ナノ粒子及びその製造方法、並びに、発光素子組立体及び光学材料 |
| KR101374897B1 (ko) | 2007-08-14 | 2014-03-17 | 서울반도체 주식회사 | 산란수단을 갖는 ｌｅｄ 패키지 |
| JP5218741B2 (ja) * | 2008-03-04 | 2013-06-26 | スタンレー電気株式会社 | Ｌｅｄパッケージ |
| KR100980270B1 (ko) * | 2008-07-31 | 2010-09-07 | 한국과학기술원 | Ｌｅｄ 봉지용 실록산 수지 |
| CN102656233B (zh) * | 2009-05-01 | 2015-04-29 | 纳米系统公司 | 用于纳米结构体分散的官能化基质 |
| JP5707697B2 (ja) * | 2009-12-17 | 2015-04-30 | 日亜化学工業株式会社 | 発光装置 |
| CN102725356B (zh) * | 2010-01-25 | 2014-12-31 | Lg化学株式会社 | 可固化组合物 |
| EP2542624B2 (en) * | 2010-03-05 | 2024-01-10 | Momentive Performance Materials GmbH | Use of a curable polyorganosiloxane composition as an encapsulant for a solar cell module |
| JP2011219597A (ja) * | 2010-04-08 | 2011-11-04 | Nitto Denko Corp | シリコーン樹脂シート |
| JP5879739B2 (ja) * | 2010-04-28 | 2016-03-08 | 三菱化学株式会社 | 半導体発光装置用パッケージ及び発光装置 |
| JP2014505748A (ja) * | 2010-12-08 | 2014-03-06 | ダウ コーニング コーポレーション | 封止材を作成するのに好適な金属酸化物ナノ粒子を含むシロキサン組成物 |
| JP5522111B2 (ja) * | 2011-04-08 | 2014-06-18 | 信越化学工業株式会社 | シリコーン樹脂組成物及び当該組成物を使用した光半導体装置 |
| JP2013122037A (ja) * | 2011-11-10 | 2013-06-20 | Sekisui Chem Co Ltd | 光半導体装置用硬化性組成物及び光半導体装置 |
| EP2784104B1 (en) * | 2011-11-25 | 2020-06-17 | LG Chem, Ltd. | Production method of an organopolysiloxane |
| US8664156B2 (en) * | 2011-12-31 | 2014-03-04 | Sanford, L.P. | Irreversible thermochromic ink compositions |
| CN104039883A (zh) * | 2012-01-16 | 2014-09-10 | 奥斯兰姆施尔凡尼亚公司 | 有机硅接枝的核-壳颗粒、聚合物基体和包含其的led |
| JP2013214716A (ja) * | 2012-03-06 | 2013-10-17 | Nitto Denko Corp | 蛍光封止シート、発光ダイオード装置およびその製造方法 |
-
2014
- 2014-10-23 TW TW103136581A patent/TWI535792B/zh not_active IP Right Cessation
- 2014-10-24 WO PCT/KR2014/010085 patent/WO2015060693A1/ko active Application Filing
- 2014-10-24 TW TW103136963A patent/TW201535802A/zh unknown
- 2014-10-24 US US15/030,079 patent/US20160254425A1/en not_active Abandoned
- 2014-10-24 KR KR1020140145453A patent/KR20150047448A/ko not_active Application Discontinuation
- 2014-10-24 WO PCT/EP2014/072811 patent/WO2015059258A1/en active Application Filing
- 2014-10-24 EP EP14787196.6A patent/EP3061138A1/en not_active Withdrawn
- 2014-10-24 CN CN201480058307.5A patent/CN105917479A/zh active Pending
- 2014-10-24 JP JP2016526030A patent/JP2016537810A/ja not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050006794A1 (en) * | 2003-07-09 | 2005-01-13 | Tsutomu Kashiwagi | Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device |
| US20050038188A1 (en) * | 2003-08-14 | 2005-02-17 | Dongchan Ahn | Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance |
| CN1674315A (zh) * | 2004-03-26 | 2005-09-28 | 株式会社小糸制作所 | 光源组件和车辆用前照灯 |
| CN101544833A (zh) * | 2008-03-24 | 2009-09-30 | 信越化学工业株式会社 | 固化性硅橡胶组合物以及半导体装置 |
| JP2012041428A (ja) * | 2010-08-18 | 2012-03-01 | Shin-Etsu Chemical Co Ltd | シリコーン樹脂組成物及び光半導体ケース |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110072942A (zh) * | 2016-12-20 | 2019-07-30 | 美国陶氏有机硅公司 | 可固化有机硅组合物 |
| CN110072942B (zh) * | 2016-12-20 | 2022-01-25 | 美国陶氏有机硅公司 | 可固化有机硅组合物 |
| CN111712537A (zh) * | 2018-03-12 | 2020-09-25 | 美国陶氏有机硅公司 | 可固化有机硅组合物及其固化产物 |
| CN111712537B (zh) * | 2018-03-12 | 2022-07-22 | 美国陶氏有机硅公司 | 可固化有机硅组合物及其固化产物 |
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| Publication number | Publication date |
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| JP2016537810A (ja) | 2016-12-01 |
| US20160254425A1 (en) | 2016-09-01 |
| WO2015059258A1 (en) | 2015-04-30 |
| EP3061138A1 (en) | 2016-08-31 |
| WO2015060693A1 (ko) | 2015-04-30 |
| TWI535792B (zh) | 2016-06-01 |
| TW201522515A (zh) | 2015-06-16 |
| TW201535802A (zh) | 2015-09-16 |
| KR20150047448A (ko) | 2015-05-04 |
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