KR100980270B1 - Led 봉지용 실록산 수지 - Google Patents
Led 봉지용 실록산 수지 Download PDFInfo
- Publication number
- KR100980270B1 KR100980270B1 KR1020080074862A KR20080074862A KR100980270B1 KR 100980270 B1 KR100980270 B1 KR 100980270B1 KR 1020080074862 A KR1020080074862 A KR 1020080074862A KR 20080074862 A KR20080074862 A KR 20080074862A KR 100980270 B1 KR100980270 B1 KR 100980270B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- resin composition
- led encapsulation
- organic
- groups
- Prior art date
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 42
- 229920005989 resin Polymers 0.000 title abstract description 56
- 239000011347 resin Substances 0.000 title abstract description 56
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 title abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 41
- 150000004703 alkoxides Chemical class 0.000 claims abstract description 29
- 239000011342 resin composition Substances 0.000 claims abstract description 28
- 239000000203 mixture Substances 0.000 claims abstract description 25
- 125000000524 functional group Chemical group 0.000 claims abstract description 22
- 238000006482 condensation reaction Methods 0.000 claims abstract description 17
- 125000000962 organic group Chemical group 0.000 claims abstract description 8
- 238000007789 sealing Methods 0.000 claims abstract description 6
- 238000006243 chemical reaction Methods 0.000 claims description 23
- 239000003054 catalyst Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 19
- 150000001875 compounds Chemical class 0.000 claims description 16
- 238000000016 photochemical curing Methods 0.000 claims description 16
- 229920001187 thermosetting polymer Polymers 0.000 claims description 15
- OLLFKUHHDPMQFR-UHFFFAOYSA-N dihydroxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](O)(O)C1=CC=CC=C1 OLLFKUHHDPMQFR-UHFFFAOYSA-N 0.000 claims description 14
- 229910000077 silane Inorganic materials 0.000 claims description 14
- -1 acryl group Chemical group 0.000 claims description 11
- 125000003700 epoxy group Chemical group 0.000 claims description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
- 125000006552 (C3-C8) cycloalkyl group Chemical group 0.000 claims description 9
- 239000002738 chelating agent Substances 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 9
- 125000003545 alkoxy group Chemical group 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 238000001723 curing Methods 0.000 claims description 6
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 claims description 6
- 125000003342 alkenyl group Chemical group 0.000 claims description 5
- 125000003277 amino group Chemical group 0.000 claims description 5
- 125000005641 methacryl group Chemical group 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 claims description 4
- 125000006701 (C1-C7) alkyl group Chemical group 0.000 claims description 4
- SDTMFDGELKWGFT-UHFFFAOYSA-N 2-methylpropan-2-olate Chemical compound CC(C)(C)[O-] SDTMFDGELKWGFT-UHFFFAOYSA-N 0.000 claims description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 4
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 claims description 4
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical group [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 4
- 229920000180 alkyd Chemical group 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 125000001047 cyclobutenyl group Chemical group C1(=CCC1)* 0.000 claims description 4
- 125000004185 ester group Chemical group 0.000 claims description 4
- 125000001033 ether group Chemical group 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 4
- 125000002560 nitrile group Chemical group 0.000 claims description 4
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 4
- 125000001174 sulfone group Chemical group 0.000 claims description 4
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 150000008065 acid anhydrides Chemical class 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 3
- ZGSOBQAJAUGRBK-UHFFFAOYSA-N propan-2-olate;zirconium(4+) Chemical compound [Zr+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] ZGSOBQAJAUGRBK-UHFFFAOYSA-N 0.000 claims description 3
- 239000010936 titanium Chemical group 0.000 claims description 3
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 claims description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical group CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 2
- 125000006649 (C2-C20) alkynyl group Chemical group 0.000 claims description 2
- KKYDYRWEUFJLER-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,10,10,10-heptadecafluorodecyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F KKYDYRWEUFJLER-UHFFFAOYSA-N 0.000 claims description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 2
- NGCRLFIYVFOUMZ-UHFFFAOYSA-N 2,3-dichloroquinoxaline-6-carbonyl chloride Chemical compound N1=C(Cl)C(Cl)=NC2=CC(C(=O)Cl)=CC=C21 NGCRLFIYVFOUMZ-UHFFFAOYSA-N 0.000 claims description 2
- IZXRSZNHUSJWIQ-UHFFFAOYSA-N 2-methylpropan-2-ol;titanium Chemical compound [Ti].CC(C)(C)O.CC(C)(C)O.CC(C)(C)O.CC(C)(C)O IZXRSZNHUSJWIQ-UHFFFAOYSA-N 0.000 claims description 2
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 claims description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims description 2
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 claims description 2
- HGEKXQRHZRDGKO-UHFFFAOYSA-N 3-tripropoxysilylpropyl prop-2-enoate Chemical compound CCCO[Si](OCCC)(OCCC)CCCOC(=O)C=C HGEKXQRHZRDGKO-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- PVLBXNICXUCXTA-UHFFFAOYSA-N [2-hydroxy-3-(3-triethoxysilylpropylamino)propyl] prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCNCC(O)COC(=O)C=C PVLBXNICXUCXTA-UHFFFAOYSA-N 0.000 claims description 2
- RNFUJUQPEUUTEZ-UHFFFAOYSA-N [2-hydroxy-3-(3-tripropoxysilylpropylamino)propyl] prop-2-enoate Chemical compound CCCO[Si](OCCC)(OCCC)CCCNCC(O)COC(=O)C=C RNFUJUQPEUUTEZ-UHFFFAOYSA-N 0.000 claims description 2
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 claims description 2
- 239000000654 additive Substances 0.000 claims description 2
- 125000000304 alkynyl group Chemical group 0.000 claims description 2
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 claims description 2
- JPUHCPXFQIXLMW-UHFFFAOYSA-N aluminium triethoxide Chemical group CCO[Al](OCC)OCC JPUHCPXFQIXLMW-UHFFFAOYSA-N 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- PVZMSIQWTGPSHJ-UHFFFAOYSA-N butan-1-ol;tantalum Chemical compound [Ta].CCCCO.CCCCO.CCCCO.CCCCO.CCCCO PVZMSIQWTGPSHJ-UHFFFAOYSA-N 0.000 claims description 2
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 claims description 2
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 claims description 2
- XKJVJPFYOTXUSM-UHFFFAOYSA-N butoxy-ethyl-dimethoxysilane Chemical compound CCCCO[Si](CC)(OC)OC XKJVJPFYOTXUSM-UHFFFAOYSA-N 0.000 claims description 2
- UKSWSALBYQIBJN-UHFFFAOYSA-N dihydroxy-bis(2-methylpropyl)silane Chemical compound CC(C)C[Si](O)(O)CC(C)C UKSWSALBYQIBJN-UHFFFAOYSA-N 0.000 claims description 2
- UARGAUQGVANXCB-UHFFFAOYSA-N ethanol;zirconium Chemical compound [Zr].CCO.CCO.CCO.CCO UARGAUQGVANXCB-UHFFFAOYSA-N 0.000 claims description 2
- NNBRCHPBPDRPIT-UHFFFAOYSA-N ethenyl(tripropoxy)silane Chemical compound CCCO[Si](OCCC)(OCCC)C=C NNBRCHPBPDRPIT-UHFFFAOYSA-N 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical group [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 claims description 2
- 150000004692 metal hydroxides Chemical class 0.000 claims description 2
- RJMRIDVWCWSWFR-UHFFFAOYSA-N methyl(tripropoxy)silane Chemical compound CCCO[Si](C)(OCCC)OCCC RJMRIDVWCWSWFR-UHFFFAOYSA-N 0.000 claims description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002105 nanoparticle Substances 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 150000007524 organic acids Chemical class 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 claims description 2
- XPGAWFIWCWKDDL-UHFFFAOYSA-N propan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCC[O-].CCC[O-].CCC[O-].CCC[O-] XPGAWFIWCWKDDL-UHFFFAOYSA-N 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical group [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- PKLMYPSYVKAPOX-UHFFFAOYSA-N tetra(propan-2-yloxy)germane Chemical compound CC(C)O[Ge](OC(C)C)(OC(C)C)OC(C)C PKLMYPSYVKAPOX-UHFFFAOYSA-N 0.000 claims description 2
- GXMNGLIMQIPFEB-UHFFFAOYSA-N tetraethoxygermane Chemical compound CCO[Ge](OCC)(OCC)OCC GXMNGLIMQIPFEB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 claims description 2
- MYWQGROTKMBNKN-UHFFFAOYSA-N tributoxyalumane Chemical compound [Al+3].CCCC[O-].CCCC[O-].CCCC[O-] MYWQGROTKMBNKN-UHFFFAOYSA-N 0.000 claims description 2
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 claims description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 2
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 claims description 2
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 claims description 2
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 claims description 2
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims description 2
- 229930195735 unsaturated hydrocarbon Chemical group 0.000 claims description 2
- KCIKCCHXZMLVDE-UHFFFAOYSA-N silanediol Chemical compound O[SiH2]O KCIKCCHXZMLVDE-UHFFFAOYSA-N 0.000 claims 2
- LTKACMBVEOKTGC-UHFFFAOYSA-N [2-hydroxy-3-(3-trimethoxysilylpropylamino)propyl] prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCNCC(O)COC(=O)C=C LTKACMBVEOKTGC-UHFFFAOYSA-N 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 230000003078 antioxidant effect Effects 0.000 claims 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims 1
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- OZWKZRFXJPGDFM-UHFFFAOYSA-N tripropoxysilane Chemical compound CCCO[SiH](OCCC)OCCC OZWKZRFXJPGDFM-UHFFFAOYSA-N 0.000 claims 1
- 238000002834 transmittance Methods 0.000 abstract description 18
- 238000009833 condensation Methods 0.000 abstract description 10
- 230000005494 condensation Effects 0.000 abstract description 10
- 239000008393 encapsulating agent Substances 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 3
- 150000001282 organosilanes Chemical class 0.000 abstract description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 21
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 7
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 6
- 229910001863 barium hydroxide Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 238000001029 thermal curing Methods 0.000 description 5
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 4
- 239000004342 Benzoyl peroxide Substances 0.000 description 4
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 4
- 235000019400 benzoyl peroxide Nutrition 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical group CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 150000003017 phosphorus Chemical class 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- BWHDROKFUHTORW-UHFFFAOYSA-N tritert-butylphosphane Chemical compound CC(C)(C)P(C(C)(C)C)C(C)(C)C BWHDROKFUHTORW-UHFFFAOYSA-N 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 description 1
- KEZFXJCJYHJJQS-UHFFFAOYSA-N 3-propoxysilylpropyl prop-2-enoate Chemical compound C(C=C)(=O)OCCC[SiH2]OCCC KEZFXJCJYHJJQS-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000005410 aryl sulfonium group Chemical group 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- QKIUAMUSENSFQQ-UHFFFAOYSA-N dimethylazanide Chemical compound C[N-]C QKIUAMUSENSFQQ-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- UUCCCPNEFXQJEL-UHFFFAOYSA-L strontium dihydroxide Chemical compound [OH-].[OH-].[Sr+2] UUCCCPNEFXQJEL-UHFFFAOYSA-L 0.000 description 1
- 229910001866 strontium hydroxide Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- AUHHYELHRWCWEZ-UHFFFAOYSA-N tetrachlorophthalic anhydride Chemical compound ClC1=C(Cl)C(Cl)=C2C(=O)OC(=O)C2=C1Cl AUHHYELHRWCWEZ-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 238000002211 ultraviolet spectrum Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/58—Metal-containing linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Silicon Polymers (AREA)
- Led Device Packages (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (18)
- 유기알콕시실란 단독 또는 유기알콕시실란과 금속 알콕사이드의 혼합물과, 유기실란디올의 비가수 축합 반응에 의해 제조되며, 상기 유기알콕시실란 또는 유기실란디올의 유기기가 열경화 또는 광경화 가능한 작용기를 갖는 것을 특징으로 하는 유기 올리고실록산 하이브리드를 포함하는 LED 봉지용 수지 조성물.
- 제 1항에 있어서상기 금속 알콕사이드는 유기 알콕시실란에 대해 1~80mol%로 사용되는 LED 봉지용 수지 조성물.
- 제 1항에 있어서,상기 유기 알콕시실란은 하기 화학식 1의 화합물 또는 이의 혼합물로부터 선택되는 LED 봉지용 수지 조성물.[화학식 1][상기 화학식 1에서 R1은 (C1~C20)알킬, (C3~C8)사이클로알킬, (C3~C8)사이 클로알킬로 치환된 (C1~C20)알킬, (C2~C20)알케닐, (C2~C20)알키닐, (C6~C20)아릴로부터 선택되고, 상기 R1은 아크릴기, 메타크릴기, 알릴기, 할로겐기, 아미노기, 머캡토기, 에테르기, 에스테르기, (C1~C20)알콕시기, 술폰기, 니트로기, 하이드록시기, 사이클로부텐기, 카르보닐기, 카르복실기, 알키드기, 우레탄기, 비닐기, 니트릴기, 및 에폭시기로부터 선택되는 1종 이상의 작용기를 가질 수 있으며; R2은 직쇄 또는 분지쇄 (C1~C7)알킬이다.]
- 제 1항에 있어서,상기 유기 실란디올은 하기 화학식 2의 화합물 또는 이의 혼합물로부터 선택되는 LED 봉지용 수지 조성물.[화학식 2][상기 화학식 2에서 R3 및 R4는 독립적으로 (C1~C20)알킬, (C3~C8)사이클로알킬, (C3~C8)사이클로알킬로 치환된 (C1~C20)알킬, (C2~C20)알케닐, (C2~C20)알키닐, (C6~C20)아릴로부터 선택되고, 상기 R3 및 R4은 아크릴기, 메타크릴기, 알릴기, 할로겐기, 아미노기, 머캡토기, 에테르기, 에스테르기, (C1~C20)알콕시기, 술폰기, 니트로기, 하이드록시기, 사이클로부텐기, 카르보닐기, 카르복실기, 알키드기, 우레탄기, 비닐기, 니트릴기, 및 에폭시기로부터 선택되는 1종 이상의 작용기를 가질 수 있다.]
- 제 3항에 있어서,상기 유기 알콕시실란은 3-글리시독시프로필트리메톡시실란, 3-글리시독시프로필트리에톡시실란, 2-(3,4-에폭시사이클로헥실)에틸트리메톡시실란, 2-(3,4-에폭시사이클로헥실)에틸트리에톡시실란, 메틸트리메톡시실란, 메틸트리에톡시실란, 메 틸트리프로폭시실란, 프로필에틸트리메톡시실란, 에틸트리에톡시실란, 비닐트리메톡시실란, 비닐트리에톡시실란, 비닐트리프로폭시실란, 페닐트리메톡시실란, N-(3-아크릴옥시-2-하이드록시프로필)-3-아미노프로필트리에톡시실란, N-(3-아크릴옥시-2-하이드록시프로필)-3-아미노프로필트리메톡시실란, N-(3-아크릴옥시-2-하이드록시프로필)-3-아미노프로필트리프로폭시실란, 3-아크릴옥시프로필메틸비스(트리메톡시)실란, 3-아크릴옥시프로필트리메톡시실란, 3-아크릴옥시프로필트리에톡시실란, 3-아크릴옥시프로필트리프로폭시실란, 3-(메트)아크릴옥시프로필트리메톡시실란, 3-(메트)아크릴옥시프로필트리에톡시실란, 3-(메트)아크릴옥시프로필트리프로폭시실란, N-(아미노에틸-3-아미노프로필)트리메톡시실란, N-(2-아미노에틸-3-아미노프로필)트리에톡시실란, 3-아미노프로필트리메톡시실란, 3-아미노프로필트리에톡시실란, 클로로프로필트리메톡시실란, 클로로프로필트리에톡시실란, 헵타데카플루오르데실트리메톡시실란 또는 이들의 혼합물로부터 선택되는 LED 봉지용 수지 조성물.
- 제 4항에 있어서,상기 유기 실란디올은 다이페닐실란디올, 다이아이소부틸실란디올 또는 이의 혼합물로부터 선택되는 LED 봉지용 수지 조성물.
- 제 5항에 있어서,상기 금속알콕사이드는 알루미늄에톡사이드, 탄탈럼에톡사이드, 게르마늄에톡사이드, 티타늄에톡사이드, 지르코니움에톡사이드, 지르코늄프로폭사이드, 티타늄프로폭사이드, 알루미늄아이소프로폭사이드, 게르마늄아이소프로폭사이드, 티타늄아이소프로폭사이드, 지르코늄아이소프로폭사이드, 알루미늄트리부톡사이드, 탄탈럼부톡사이드, 알루미늄 t-부톡사이드, 티타늄부톡사이드, 티타늄 t-부톡사이드, 지르코늄부톡사이드, 지르코늄 t-부톡사이드 또는 이의 혼합물로부터 선택되는 LED 봉지용 수지 조성물.
- 제 1항에 있어서,상기 유기알콕시 실란과 금속알콕사이드의 혼합물은 금속 킬레이트제를 더 함유하는 LED 봉지용 수지 조성물.
- 제 9항에 있어서,상기 금속 킬레이트제는 금속알콕사이드의 알콕사이드에 대하여 1/5 내지 1/2 당량으로 함유되는 LED 봉지용 수지 조성물.
- 제 9항에 있어서,상기 금속 킬레이트제는 β-디케토네이트 화합물 또는 불포화 탄화수소기를 가지는 유기산으로부터 선택되는 LED 봉지용 수지 조성물.
- 제 1항에 있어서,상기 축합 반응은 수산화금속 촉매 하에 이루어지는 LED 봉지용 수지 조성물.
- 제 1항에 있어서,상기 유기 올리고실록산 하이브리드는 열경화 또는 광경화 가능한 작용기를 포함하는 LED 봉지용 수지 조성물.
- 삭제
- 제 1항에 있어서,상기 LED 봉지용 수지 조성물은 열경화를 위해 산무수물 경화제가 첨가된 LED 봉지용 수지 조성물.
- 제 1항에 있어서,상기 LED 봉지용 수지 조성물은 광경화성 또는 열경화성 관능기를 갖는 모노머를 더 함유하는 LED 봉지용 수지 조성물.
- 제 1항에 있어서,상기 LED 봉지용 수지 조성물은 용매, 염료, 안료, 계면 활성제, 산화 방지제, 산화물 또는 질화물 나노입자, 방염제, 금속충진제, 또는 내열제로부터 선택되는 1종 이상의 첨가제를 더 함유하는 LED 봉지용 수지 조성물.
- 제 1항 내지 제 13항 및 제 15항 내지 제 17항 중 어느 한 항의 LED 봉지용 수지 조성물을 사용하여 캡슐화된 LED.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080074862A KR100980270B1 (ko) | 2008-07-31 | 2008-07-31 | Led 봉지용 실록산 수지 |
JP2009088947A JP2010037538A (ja) | 2008-07-31 | 2009-04-01 | Led封止用樹脂組成物 |
EP09158633A EP2157624A1 (en) | 2008-07-31 | 2009-04-23 | Resin composition for led encapsulation |
US12/463,321 US20100025724A1 (en) | 2008-07-31 | 2009-05-08 | Resin Composition for LED Encapsulation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080074862A KR100980270B1 (ko) | 2008-07-31 | 2008-07-31 | Led 봉지용 실록산 수지 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100013368A KR20100013368A (ko) | 2010-02-10 |
KR100980270B1 true KR100980270B1 (ko) | 2010-09-07 |
Family
ID=41334583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080074862A KR100980270B1 (ko) | 2008-07-31 | 2008-07-31 | Led 봉지용 실록산 수지 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20100025724A1 (ko) |
EP (1) | EP2157624A1 (ko) |
JP (1) | JP2010037538A (ko) |
KR (1) | KR100980270B1 (ko) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012093820A2 (ko) * | 2011-01-06 | 2012-07-12 | 주식회사 동진쎄미켐 | 광학소자 봉지용 실리콘 수지 조성물 |
KR101355995B1 (ko) * | 2012-02-28 | 2014-01-29 | 한국과학기술원 | 내열성 광학 실록산 수지 조성물 |
KR101356387B1 (ko) * | 2011-08-09 | 2014-01-29 | 한국과학기술원 | 광학용 투명 하이브리드 재료 |
US9070838B2 (en) | 2011-06-10 | 2015-06-30 | Samsung Electronics Co., Ltd. | Optoelectronic device and stacking structure |
US9657143B2 (en) | 2012-12-26 | 2017-05-23 | Cheil Industries, Inc. | Curable polysiloxane composition for optical device and encapsulant and optical device |
KR101890332B1 (ko) * | 2017-02-28 | 2018-08-21 | 에스케이씨 주식회사 | 광학 재료용 실록산 티올 올리고머 |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2370502A1 (en) * | 2008-12-03 | 2011-10-05 | Soreq Nuclear Research Center | Uv-curable inorganic-organic hybrid resin and method for preparation thereof |
US8372504B2 (en) * | 2009-01-13 | 2013-02-12 | Korea Advanced Institute Of Science And Technology | Transparent composite compound |
KR20110101791A (ko) * | 2010-03-09 | 2011-09-16 | 주식회사 케이씨씨 | 발광 다이오드 소자용 고굴절 실리콘 조성물의 제조 방법 |
DE102010046091A1 (de) | 2010-09-20 | 2012-03-22 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip, Verfahren zur Herstellung und Anwendung in einem optoelektronischen Bauelement |
US8573804B2 (en) * | 2010-10-08 | 2013-11-05 | Guardian Industries Corp. | Light source, device including light source, and/or methods of making the same |
EP2661648A1 (en) | 2011-01-05 | 2013-11-13 | Dow Corning Corporation | Polyheterosiloxanes for high refractive index materials |
EP2665762B1 (en) | 2011-01-21 | 2020-12-02 | Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V. | Polymerizable compositions, cured products obtained therewith, and use of these materials |
US8257988B1 (en) | 2011-05-17 | 2012-09-04 | Rohm And Haas Electronic Materials Llc | Method of making light emitting diodes |
US8258636B1 (en) | 2011-05-17 | 2012-09-04 | Rohm And Haas Electronic Materials Llc | High refractive index curable liquid light emitting diode encapsulant formulation |
JP5824577B2 (ja) * | 2011-06-17 | 2015-11-25 | エルジー・ケム・リミテッド | 高屈折組成物 |
US8455607B2 (en) | 2011-08-17 | 2013-06-04 | Rohm And Haas Electronic Materials Llc | Curable liquid composite light emitting diode encapsulant |
US8450445B2 (en) | 2011-08-17 | 2013-05-28 | Rohm And Haas Electronic Materials Llc | Light emitting diode manufacturing method |
KR101686572B1 (ko) | 2011-10-21 | 2016-12-15 | 삼성전자 주식회사 | 발광 소자 |
GB201119813D0 (en) * | 2011-11-17 | 2011-12-28 | Dow Corning | Silicone resins and its use in polymers |
TW201408675A (zh) * | 2012-07-19 | 2014-03-01 | Hitachi Chemical Co Ltd | 鈍化層形成用組成物、帶有鈍化層的半導體基板、帶有鈍化層的半導體基板的製造方法、太陽電池元件、太陽電池元件的製造方法及太陽電池 |
KR101600653B1 (ko) * | 2012-12-26 | 2016-03-07 | 제일모직주식회사 | 봉지용 조성물, 이를 포함하는 장벽층 및 이를 포함하는 봉지화된 장치 |
EP2970666B1 (en) | 2013-03-15 | 2016-10-19 | Dow Corning Corporation | Aryl group-containing siloxane compositions including alkaline earth metal |
TWI535792B (zh) * | 2013-10-24 | 2016-06-01 | 瓦克化學公司 | Led封裝材料 |
WO2015193558A1 (en) | 2014-06-19 | 2015-12-23 | Inkron Oy | A method of making a siloxane polymer composition |
EP3158005A1 (en) * | 2014-06-19 | 2017-04-26 | Inkron OY | Composition having siloxane polymer and particle |
KR101602896B1 (ko) * | 2014-06-27 | 2016-03-11 | 최광수 | 경화성 실리콘 수지 조성물 |
DE102016104790A1 (de) | 2016-03-15 | 2017-09-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Materialien für die LED-Verkapselung |
US10606658B2 (en) * | 2016-03-22 | 2020-03-31 | International Business Machines Corporation | Approach to recommending mashups |
KR20180034937A (ko) | 2016-09-28 | 2018-04-05 | 모멘티브퍼포먼스머티리얼스코리아 주식회사 | 유기 전자 소자 봉지재용 조성물 및 이를 이용하여 형성된 봉지재 |
DE102018125183A1 (de) * | 2018-10-11 | 2020-04-16 | Osram Opto Semiconductors Gmbh | Umhüllungsmaterial, konversionsmaterial, optoelektronisches bauelement und verfahren zur herstellung eines umhüllungsmaterials |
WO2020225881A1 (ja) * | 2019-05-08 | 2020-11-12 | 昭和電工マテリアルズ株式会社 | バリア材及びそれを備える製品 |
DE102020121337A1 (de) | 2020-08-13 | 2022-02-17 | Tdk Electronics Ag | Piezoelektrischer Wandler und Verfahren zur Einstellung der elektromechanischen Eigenschaften eines piezoelektrischen Wandlers |
CN114702677A (zh) * | 2022-04-11 | 2022-07-05 | 华南理工大学 | 一种有机硅材料脱除羟基的工艺 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7393469B2 (en) * | 2003-07-31 | 2008-07-01 | Ramazan Benrashid | High performance sol-gel spin-on glass materials |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2729961B1 (fr) * | 1995-01-31 | 1997-04-25 | Rhone Poulenc Chimie | Procede de preparation de resine polyorganosiloxane, eventuellement alcoxylee, par condensation non hydrolytique |
DE19706515A1 (de) * | 1997-02-19 | 1998-08-20 | Inst Neue Mat Gemein Gmbh | Hydroxylgruppen-arme organisch/anorganische Komposite, Verfahren zu deren Herstellung und deren Verwendung |
DE19932629A1 (de) * | 1999-07-13 | 2001-01-18 | Fraunhofer Ges Forschung | Organisch modifizierte, lagerstabile, UV-härtbare, NIR-durchlässige und in Schichtdicken von 1 bis 150 mum fotostrukturierbare Kieselsäurepolykondensate, deren Herstellung und deren Verwendung |
JP2003002951A (ja) | 2001-06-25 | 2003-01-08 | New Japan Chem Co Ltd | 液状エポキシ樹脂組成物の薄膜硬化物 |
US6632892B2 (en) * | 2001-08-21 | 2003-10-14 | General Electric Company | Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst |
US6965006B2 (en) * | 2002-04-10 | 2005-11-15 | Rpo Pty Ltd. | Metal alkoxide polymers |
JP2004186168A (ja) | 2002-11-29 | 2004-07-02 | Shin Etsu Chem Co Ltd | 発光ダイオード素子用シリコーン樹脂組成物 |
US7241851B2 (en) * | 2002-12-30 | 2007-07-10 | Momentive Performance Materials Inc. | Silicone condensation reaction |
JP2004359756A (ja) * | 2003-06-03 | 2004-12-24 | Wacker Asahikasei Silicone Co Ltd | Led用封止剤組成物 |
KR100614976B1 (ko) * | 2004-04-12 | 2006-08-25 | 한국과학기술원 | 광소자 또는 디스플레이에 이용되는 무기/유기혼성올리고머, 나노혼성고분자 및 그 제조방법 |
EP1736500A4 (en) * | 2004-04-16 | 2010-03-24 | Jsr Corp | COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR, OPTICAL SEMICONDUCTOR SEALING MATERIAL, AND PROCESS FOR PRODUCING A COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR |
JP2006336010A (ja) * | 2005-05-02 | 2006-12-14 | Jsr Corp | シロキサン系縮合物およびその製造方法、ポリシロキサン組成物 |
EP2067800A4 (en) * | 2006-09-29 | 2010-02-24 | Asahi Kasei Emd Corp | POLYORGANOSILOXANE COMPOSITION |
JP4800179B2 (ja) * | 2006-11-02 | 2011-10-26 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
US20090121251A1 (en) * | 2007-11-13 | 2009-05-14 | Lumination Llc | Siloxane-hydantoin copolymer, optoelectronic device encapsulated therewith and method |
-
2008
- 2008-07-31 KR KR1020080074862A patent/KR100980270B1/ko active IP Right Grant
-
2009
- 2009-04-01 JP JP2009088947A patent/JP2010037538A/ja active Pending
- 2009-04-23 EP EP09158633A patent/EP2157624A1/en not_active Withdrawn
- 2009-05-08 US US12/463,321 patent/US20100025724A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7393469B2 (en) * | 2003-07-31 | 2008-07-01 | Ramazan Benrashid | High performance sol-gel spin-on glass materials |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012093820A2 (ko) * | 2011-01-06 | 2012-07-12 | 주식회사 동진쎄미켐 | 광학소자 봉지용 실리콘 수지 조성물 |
WO2012093820A3 (ko) * | 2011-01-06 | 2012-12-20 | 주식회사 동진쎄미켐 | 광학소자 봉지용 실리콘 수지 조성물 |
US9070838B2 (en) | 2011-06-10 | 2015-06-30 | Samsung Electronics Co., Ltd. | Optoelectronic device and stacking structure |
KR101356387B1 (ko) * | 2011-08-09 | 2014-01-29 | 한국과학기술원 | 광학용 투명 하이브리드 재료 |
KR101355995B1 (ko) * | 2012-02-28 | 2014-01-29 | 한국과학기술원 | 내열성 광학 실록산 수지 조성물 |
US8921441B2 (en) | 2012-02-28 | 2014-12-30 | Korea Advanced Institute Of Science And Technology | Thermally resistant optical siloxane resin composition |
US9657143B2 (en) | 2012-12-26 | 2017-05-23 | Cheil Industries, Inc. | Curable polysiloxane composition for optical device and encapsulant and optical device |
KR101890332B1 (ko) * | 2017-02-28 | 2018-08-21 | 에스케이씨 주식회사 | 광학 재료용 실록산 티올 올리고머 |
Also Published As
Publication number | Publication date |
---|---|
US20100025724A1 (en) | 2010-02-04 |
EP2157624A1 (en) | 2010-02-24 |
KR20100013368A (ko) | 2010-02-10 |
JP2010037538A (ja) | 2010-02-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100980270B1 (ko) | Led 봉지용 실록산 수지 | |
JP5444631B2 (ja) | 光半導体素子封止用組成物、その硬化物および光半導体素子封止体 | |
KR101158784B1 (ko) | 실란올 축합 촉매, 가열 경화성 광반도체 봉지용 실리콘 수지 조성물 및 이것을 이용하는 광반도체 봉지체 | |
KR101282051B1 (ko) | 형광색소 실록산 하이브리드 수지 | |
TWI583741B (zh) | 可固化組成物 | |
KR101251553B1 (ko) | 엘이디 봉지재용 실록산 수지 조성물 | |
JP2011219729A (ja) | 加熱硬化性シリコーン樹脂組成物およびこれを用いる光半導体封止体 | |
JP2009102574A (ja) | 光半導体素子用硬化性組成物 | |
KR20160127041A (ko) | 광전자 응용제품을 위한 하이브리드 재료 | |
US10435420B2 (en) | High-RI siloxane monomers, their polymerization and use | |
US10889690B2 (en) | Siloxane monomers, their polymerization and uses thereof | |
JP2008056857A (ja) | 光半導体用熱硬化性組成物、光半導体素子用封止剤、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材及び光半導体装置 | |
JP5678592B2 (ja) | 加熱硬化性光半導体封止用シリコーン樹脂組成物およびこれを用いる光半導体封止体 | |
JP6015864B2 (ja) | 硬化性樹脂組成物 | |
JP5369553B2 (ja) | シロキサン樹脂組成物、硬化物およびこれを用いた光半導体 | |
JP2011159912A (ja) | 光半導体素子用封止剤及び光半導体装置 | |
KR101768439B1 (ko) | 표면 개질된 실리콘 양자점으로부터 제조되는 실리콘 수지를 함유하는 조성물 및 이의 제조방법 | |
TW201800492A (zh) | 有機矽金屬複合物、包括其之可固化有機聚矽氧烷組合物及包括此組合物的光學材料 | |
JP2012144664A (ja) | シロキサンハイブリッド樹脂、同樹脂を含む硬化性樹脂組成物、同組成物を含む光半導体素子封止用組成物ならびに光半導体素子接着剤用組成物 | |
KR101591146B1 (ko) | 경화성 조성물 | |
JP5435728B2 (ja) | 光半導体封止体 | |
JP2008174640A (ja) | 光半導体用熱硬化性組成物、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材、光半導体素子用封止剤及び光半導体素子 | |
JP5560982B2 (ja) | シラノール縮合触媒、光半導体封止用熱硬化性シリコーン樹脂組成物およびこれを用いる封止体 | |
KR20140015216A (ko) | 경화성 조성물 | |
JP2011208109A (ja) | ポリオルガノシロキサンの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E90F | Notification of reason for final refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130730 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20140724 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20150601 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20160727 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20170725 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20180409 Year of fee payment: 14 |