WO2012093820A3 - 광학소자 봉지용 실리콘 수지 조성물 - Google Patents

광학소자 봉지용 실리콘 수지 조성물 Download PDF

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Publication number
WO2012093820A3
WO2012093820A3 PCT/KR2012/000020 KR2012000020W WO2012093820A3 WO 2012093820 A3 WO2012093820 A3 WO 2012093820A3 KR 2012000020 W KR2012000020 W KR 2012000020W WO 2012093820 A3 WO2012093820 A3 WO 2012093820A3
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WO
WIPO (PCT)
Prior art keywords
chemical formula
resin composition
silicone resin
optical element
compound
Prior art date
Application number
PCT/KR2012/000020
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English (en)
French (fr)
Other versions
WO2012093820A2 (ko
Inventor
송석진
김재현
주한복
박종대
Original Assignee
주식회사 동진쎄미켐
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 동진쎄미켐 filed Critical 주식회사 동진쎄미켐
Publication of WO2012093820A2 publication Critical patent/WO2012093820A2/ko
Publication of WO2012093820A3 publication Critical patent/WO2012093820A3/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58—Metal-containing linkages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

본 발명은 광학소자 봉지용 실리콘 수지 조성물에 관한 것으로서, (a) 하기 화학식 1의 유기실란을 하기 화학식 2의 금속(IV) 알콕사이드와 치환반응시켜 하기 화학식 3의 화합물을 얻은 후, (b) 이를 하기 화학식 4의 유기실란과 축합반응시켜 하기 화학식 5의 화합물을 얻은 다음, (c) 이를 중축합 촉매 존재 하에서 중축합하여 제조한 실리콘계 고분자 수지를 포함하는 본 발명의 실리콘 수지 조성물은 투명성을 확보하면서도 높은 굴절률과 우수한 가공성을 제공할 수 있으므로, 광학소자의 봉지제로서 유용하게 사용될 수 있다.
PCT/KR2012/000020 2011-01-06 2012-01-02 광학소자 봉지용 실리콘 수지 조성물 WO2012093820A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110001343A KR20120079966A (ko) 2011-01-06 2011-01-06 광학소자 봉지용 실리콘 수지 조성물
KR10-2011-0001343 2011-01-06

Publications (2)

Publication Number Publication Date
WO2012093820A2 WO2012093820A2 (ko) 2012-07-12
WO2012093820A3 true WO2012093820A3 (ko) 2012-12-20

Family

ID=46457819

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/000020 WO2012093820A2 (ko) 2011-01-06 2012-01-02 광학소자 봉지용 실리콘 수지 조성물

Country Status (3)

Country Link
KR (1) KR20120079966A (ko)
TW (1) TW201231562A (ko)
WO (1) WO2012093820A2 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014119907A1 (en) * 2013-01-31 2014-08-07 Kolon Industries, Inc. Silicone resin and method of preparing the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920004191B1 (ko) * 1986-10-03 1992-05-30 피이피이지이 인더스트리이즈 인코포레이팃드 유기 알콕시 실란/금속 산화물의 중합 생성물과 이것의 코우팅 및 그 제조방법
US20080008867A1 (en) * 2006-07-04 2008-01-10 Shin-Etsu Chemical Co., Ltd. Resin composition for sealing optical device and cured product thereof
US20090252970A1 (en) * 2006-10-13 2009-10-08 Shinichi Tamura Polymeric composition comprising metal alkoxide condensation product, organic silane compound and boron compound
KR100980270B1 (ko) * 2008-07-31 2010-09-07 한국과학기술원 Ｌｅｄ 봉지용 실록산 수지

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920004191B1 (ko) * 1986-10-03 1992-05-30 피이피이지이 인더스트리이즈 인코포레이팃드 유기 알콕시 실란/금속 산화물의 중합 생성물과 이것의 코우팅 및 그 제조방법
US20080008867A1 (en) * 2006-07-04 2008-01-10 Shin-Etsu Chemical Co., Ltd. Resin composition for sealing optical device and cured product thereof
US20090252970A1 (en) * 2006-10-13 2009-10-08 Shinichi Tamura Polymeric composition comprising metal alkoxide condensation product, organic silane compound and boron compound
KR100980270B1 (ko) * 2008-07-31 2010-09-07 한국과학기술원 Ｌｅｄ 봉지용 실록산 수지

Also Published As

Publication number Publication date
WO2012093820A2 (ko) 2012-07-12
KR20120079966A (ko) 2012-07-16
TW201231562A (en) 2012-08-01

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