CN105870302A - 一种高色域白光量子点led的封装方法 - Google Patents
一种高色域白光量子点led的封装方法 Download PDFInfo
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- CN105870302A CN105870302A CN201610192415.2A CN201610192415A CN105870302A CN 105870302 A CN105870302 A CN 105870302A CN 201610192415 A CN201610192415 A CN 201610192415A CN 105870302 A CN105870302 A CN 105870302A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0083—Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/773—Nanoparticle, i.e. structure having three dimensions of 100 nm or less
- Y10S977/774—Exhibiting three-dimensional carrier confinement, e.g. quantum dots
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/949—Radiation emitter using nanostructure
- Y10S977/95—Electromagnetic energy
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (10)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610192415.2A CN105870302B (zh) | 2016-03-30 | 2016-03-30 | 一种高色域白光量子点led的封装方法 |
PCT/CN2016/110965 WO2017166871A1 (zh) | 2016-03-30 | 2016-12-20 | 一种高色域白光量子点led的封装方法 |
JP2018526991A JP2018525849A (ja) | 2016-03-30 | 2016-12-20 | 広色域白色量子ドットledの封止方法 |
US15/578,518 US10153407B2 (en) | 2016-03-30 | 2016-12-20 | Packaging method for high gamut white light quantum dot LED |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610192415.2A CN105870302B (zh) | 2016-03-30 | 2016-03-30 | 一种高色域白光量子点led的封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105870302A true CN105870302A (zh) | 2016-08-17 |
CN105870302B CN105870302B (zh) | 2019-01-29 |
Family
ID=56626660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610192415.2A Active CN105870302B (zh) | 2016-03-30 | 2016-03-30 | 一种高色域白光量子点led的封装方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10153407B2 (zh) |
JP (1) | JP2018525849A (zh) |
CN (1) | CN105870302B (zh) |
WO (1) | WO2017166871A1 (zh) |
Cited By (11)
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CN106384776A (zh) * | 2016-11-30 | 2017-02-08 | 深圳市聚飞光电股份有限公司 | 一种三明治型量子点led灯珠的封装方法 |
CN106449908A (zh) * | 2016-11-30 | 2017-02-22 | 深圳市聚飞光电股份有限公司 | 一种基于量子点荧光膜的led灯珠的封装方法 |
CN106449943A (zh) * | 2016-11-30 | 2017-02-22 | 芜湖聚飞光电科技有限公司 | 一种倒装型量子点led灯珠的成型封装方法 |
CN106558644A (zh) * | 2016-11-30 | 2017-04-05 | 深圳市聚飞光电股份有限公司 | 一种分层型量子点led灯珠的封装方法 |
CN106784177A (zh) * | 2016-11-30 | 2017-05-31 | 深圳市聚飞光电股份有限公司 | 一种量子点led灯珠的封装方法 |
CN106898679A (zh) * | 2017-03-31 | 2017-06-27 | 华南理工大学 | 一种量子点led背光器件及其制备方法 |
WO2017166871A1 (zh) * | 2016-03-30 | 2017-10-05 | 深圳市聚飞光电股份有限公司 | 一种高色域白光量子点led的封装方法 |
CN107379724A (zh) * | 2017-07-06 | 2017-11-24 | 北京北达聚邦科技有限公司 | 一种高显色性量子点荧光粉薄膜及其制备方法 |
CN107474832A (zh) * | 2017-08-16 | 2017-12-15 | 苏州轻光材料科技有限公司 | 一种黄光量子点的制备方法 |
KR20190127714A (ko) * | 2017-03-13 | 2019-11-13 | 수미토모 케미칼 컴퍼니 리미티드 | 페로브스카이트 화합물을 포함하는 혼합물 |
CN116694235A (zh) * | 2023-05-31 | 2023-09-05 | 深圳市华笙光电子有限公司 | 一种led灯专用封装胶的生产方法 |
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CN107944208B (zh) * | 2017-11-10 | 2020-06-19 | 江苏稳润光电有限公司 | 一种白光led荧光胶配比的计算方法 |
TWI716151B (zh) * | 2018-10-22 | 2021-01-11 | 優美特創新材料股份有限公司 | 含複合式色彩轉換光學材料之背光模組 |
CN109301053B (zh) * | 2018-11-09 | 2024-07-19 | 易美芯光(北京)科技有限公司 | 一种量子点led封装结构及其制造方法 |
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CN103236487A (zh) * | 2012-07-06 | 2013-08-07 | 璨圆光电股份有限公司 | 一种发光组件 |
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US20180158996A1 (en) | 2018-06-07 |
WO2017166871A1 (zh) | 2017-10-05 |
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US10153407B2 (en) | 2018-12-11 |
JP2018525849A (ja) | 2018-09-06 |
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