CN106784238A - 量子点透镜型直下式led背光源的制作方法 - Google Patents
量子点透镜型直下式led背光源的制作方法 Download PDFInfo
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Abstract
本发明公开了一种量子点透镜型直下式LED背光源的制作方法,首先制备荧光胶A并将荧光胶A滴入LED支架中,然后制备量子点荧光胶B,将量子点荧光胶B涂覆于LED透镜表面,之后在量子点荧光胶B表面涂覆光固化胶保护层。量子点荧光胶B中采用量子点荧光材料,其半波宽较窄,可以极大提升LED背光源的色域值,色域值可达NTSC 96%以上。并且将量子点荧光粉制备于荧光胶中,解决了量子点荧光粉容易团聚失效的问题,该制作方法工艺简单、成本低廉,易于工业化生产。同时量子点荧光胶B涂覆于LED透镜上,并进行封装胶水包覆保护,减少了湿气、氧气对量子点荧光材料的侵蚀,同时避免量子点荧光材料直接接触发光芯片、受发光芯片的高温影响,提高了灯珠的可靠性。
Description
技术领域
本发明属于LED背光源技术领域,涉及一种背光源的制作方法,具体地说涉及一种量子点透镜型直下式LED背光源的制作方法。
背景技术
液晶显示作为当今社会各领域的主流显示技术越来越受到人们的青睐,随着科技的进步和人们生活水平的提高,人们对液晶显示设备的品质要求也越来越高,尤其在色域和亮度方面。为了提高液晶显示的性能,近年来发光二极管(LED)由于具有体积小、能耗低、发热小、长寿命、实时色彩可控等优点已逐步取代传统的冷阴极荧光灯管,成为新一代液晶显示背光源。
目前LED背光的结构是利用篮光LED去激发黄色荧光粉形成白光背光源,但由于光源中缺少红光成分,色域值只能达到NTSC 65%~72%。为了进一步提高色域值,技术人员普遍采用了蓝光芯片同时激发红光荧光粉、绿光荧光粉的方式,但由于现用荧光粉的半波宽较宽,故即使采用这种方式,也只能将背光源的色域值提升至NTSC 80%左右。同时,现有荧光粉的激发效率低,为实现高色域白光需要大量荧光粉,导致LED封装过程中荧光粉的浓度(荧光粉占封装胶水的比例)很高,从而极大地增加了封装作业的难度以及产品的不良率。荧光粉还存在光谱宽、光衰大、颗粒均匀度差的问题,妨碍了液晶显示的亮度和色度的提高。
量子点荧光粉是一种新型的纳米荧光材料,其粒径只有2-10nm,仅相当于10-50个原子的宽度,有光谱随尺寸可调、发射峰半波宽窄、斯托克斯位移大、激发效率高等一系列独特的光学性能,受到LED背光行业的广泛关注。目前,量子点荧光粉实现高色域白光的方式主要有:(1)将量子点荧光粉制成光学膜材,填充于导光板或者贴于液晶屏幕内,通过蓝光或紫外光背光灯珠激发,获得白光;(2)将量子点荧光粉制成玻璃管,置于屏幕侧面,通过蓝光或紫外光背光灯珠激发,获得白光。但是,这两种实现方式的工艺复杂、光转化效率低、成本较高,很难实现大规模产业化,同时量子点荧光粉易团聚失效,且色域值依然不理想。
发明内容
为此,本发明所要解决的技术问题在于现有量子点背光源制作工艺复杂、成本高,且光转化效率低、材料易团聚失效、色域值不理想,从而提出一种制作工艺简单、成本低廉、显色效果优异的量子点透镜型直下式LED背光源的制作方法。
为解决上述技术问题,本发明的技术方案为:
本发明提供一种量子点透镜型直下式LED背光源的制作方法,其包括如下步骤:
a、按照质量比1:1-300将发光材料A与封装胶水混合均匀,制得荧光胶A,所述发光材料A为量子点荧光粉和/或稀土元素掺杂的无机荧光粉;
b、将所述荧光胶A滴入固定有发光芯片的LED支架中,并将滴入的所述荧光胶A固化,得到LED灯珠;
c、按照质量比1:1-300将量子点荧光粉与封装胶水混合均匀,制得量子点荧光胶B;
d、将所述荧光胶B涂覆于LED透镜内表面或外表面,并将涂覆的量子点荧光胶B固化;
e、在固化后的量子点荧光胶B表面涂覆封装胶水,并将所述封装胶水固化,得到具有封装胶保护层的LED透镜,将得到的LED透镜固定于所述LED灯珠外部,即得到LED背光源。
作为优选,所述量子点荧光粉、所述稀土元素掺杂的无机荧光粉发射光峰值波长为450-660nm,所述量子点荧光粉为BaS、AgInS2、NaCl、Fe2O3、In2O3、InAs、InN、InP、CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、GaAs、GaN、GaS、GaSe、InGaAs、MgS、MgSe、MgTe、PbS、PbSe、PbTe、Cd(SxSe1-x)、BaTiO3、PbZrO3、CsPbCl3、CsPbBr3、CsPbI3中的至少一种。
作为优选,所述无机荧光粉为硅酸盐、铝酸盐、磷酸盐、氮化物、氟化物荧光粉中的至少一种。
作为优选,所述发光芯片为发射光峰值波长230-400nm的紫外光芯片或发射光峰值波长420-480nm的蓝光芯片。
作为优选,所述步骤b中,所述荧光胶A的体积占所述LED支架体积的90-100%,所述荧光胶A在80-160℃下烘烤0.5-8h固化。
作为优选,所述封装胶水为环氧类封装胶水、有机硅类封装胶水、聚氨酯封装胶水中的至少一种。
作为优选,所述步骤b后还包括将所述LED灯珠焊接于FPC表面的步骤,所述焊接采用回流焊,所述回流焊最高温度为240-275℃,最高温度区间内加热时间为10-30s。
作为优选,所述步骤d中,所述量子点荧光胶B的涂覆厚度为5-500μm,所述量子点荧光胶B在230-400nm的紫外光下照射3-100s固化。
作为优选,所述步骤e中,所述封装胶水的涂覆厚度为10-1000μm,所述封装胶水在230-400nm的紫外光下照射5-200s固化。
作为优选,所述量子点荧光粉为粉末状或溶剂分散状。
本发明的上述技术方案相比现有技术具有以下优点:
(1)本发明所述的量子点透镜型直下式LED背光源的制作方法,首先制备荧光胶A并将荧光胶A滴入LED支架中,然后制备量子点荧光胶B,将量子点荧光胶B涂覆于LED透镜表面,之后在量子点荧光胶B表面涂覆光固化胶保护层。量子点荧光胶B中采用量子点荧光材料,其半波宽较窄,可以极大提升LED背光源的色域值,本发明所述的方法制得的LED背光源色域值可达NTSC 96%以上。并且将量子点荧光粉制备于荧光胶中,解决了量子点荧光粉容易团聚失效的问题,该制作方法工艺简单、生产成本低廉,易于工业化生产。同时量子点荧光胶B涂覆于LED透镜上,并进行封装胶水包覆保护,减少了湿气、氧气对量子点荧光材料的侵蚀,同时避免量子点荧光材料直接接触发光芯片、受发光芯片的高温影响,提高了灯珠的可靠性。
(2)本发明所述的量子点透镜型直下式LED背光源的制作方法,本发明采用量子点荧光粉获得白光LED灯珠,量子点荧光粉激发效率高,涂覆厚度可控,降低了封装作业的难度及产品不良率,适合大批量工业化生产。
附图说明
为了使本发明的内容更容易被清楚的理解,下面根据本发明的具体实施例并结合附图,对本发明作进一步详细的说明,其中
图1是本发明实施例1所述LED背光源的结构示意图;
图2是本发明实施例2所述的LED背光源的结构示意图。
图中附图标记表示为:1-支架;2-金属镀层;3-发光芯片;4-键合线;5-荧光胶层A;6-LED透镜;7-量子点荧光胶层B;8-封装胶保护层。
具体实施方式
实施例1
本实施例提供一种量子点透镜型直下式LED背光源的制作方法,其包括如下步骤:
a、称取0.08g发光材料A,所述发光材料A为发射光波长530nm CsPbCl3、CsPbI3绿光量子点荧光粉,其中,所述CsPbI3荧光粉为0.04g,称取24g环氧类封装胶水,并将其与发光材料A混合、真空脱泡搅拌,得到荧光胶A,所述量子点荧光粉为粉末状,或者也可为溶剂分散状;
b、将所述荧光胶A滴入固定有发光芯片的LED支架中,控制荧光胶A的体积占支架杯壳体积的90%,所述发光芯片为发射光波长455nm的蓝光芯片,并将滴有荧光胶A的LED支架置于烘箱中,在80℃下烘烤8h,得到LED灯珠;然后根据LED灯珠选取合适的FPC,在FPC表面涂覆锡膏,并将FPC置于回流焊炉中进行回流焊,回流焊最高温度为240℃,最高温区间内加热时间为30s;
c、称取0.12g发射光波长为650nm的BaS、CdS红光量子点荧光粉,其中BaS为0.05g,称取0.12g有机硅类光固化封装胶水并将其加入量子点荧光粉中,真空脱泡搅拌均匀,即得量子点荧光胶B;
d、将所述量子点荧光胶B涂覆于LED透镜内表面,涂覆厚度为5μm,并将涂覆有量子点荧光胶B的LED透镜置于紫外固化炉中,在230nm的紫外光下照射3s,使量子点荧光胶B固化;
e、在固化后的量子点荧光胶B表面涂覆聚氨酯类光固化封装胶水,涂覆厚度为10μm,使封装胶水完全包覆量子点荧光胶B,并将涂覆有封装胶水的LED透镜置于紫外固化炉中,在235nm的紫外光下照射7s,使封装胶水固化,得到具有封装胶保护层的LED透镜,将得到的LED透镜固定于所述LED灯珠外部,所述蓝光芯片与荧光胶A发出的绿光、量子点荧光胶B发出的红光复合,得到白光发射,即得到LED背光源。
本实施例中,所述LED背光源的结构如图1所示,包括LED单色灯条,所述LED灯条包括支架1、设置于所述支架1上表面的金属镀层2、固定于所述金属镀层表面的发光芯片3,所述发光芯片与所述金属镀层2还通过键合线4连接,所述发光芯片3外部封装有荧光胶层A5,所述LED灯条外部设置有所述LED透镜6,所述LED透镜内表面涂覆有量子点荧光胶层B7,所述量子点荧光胶层B7表面又涂覆有封装胶保护层8。
实施例2
本实施例提供一种量子点透镜型直下式LED背光源的制作方法,其包括如下步骤:
a、称取1.86g发光材料A,所述发光材料A包括0.52g发射光波长540nm的硅酸盐绿光荧光粉、1.34g发射光波长625nm的氟化物红光荧光粉,称取1.86g有机硅类封装胶水,并将其与发光材料A混合、真空脱泡搅拌,得到荧光胶A;
b、将所述荧光胶A滴入固定有发光芯片的LED支架中,控制荧光胶A的体积占支架杯壳体积的100%,所述发光芯片为发射光波长290nm的紫外光芯片,并将滴有荧光胶A的LED支架置于烘箱中,在160℃下烘烤0.5h,得到LED灯珠;然后根据LED灯珠选取合适的FPC,在FPC表面涂覆锡膏,并将FPC置于回流焊炉中进行回流焊,回流焊最高温度为275℃,最高温区间内加热时间为10s;
c、称取0.05g发射光波长为450nm的MgS、CdS蓝光量子点荧光粉,其中MgS为0.025g,称取15g环氧类光固化封装胶水并将其加入量子点荧光粉中,真空脱泡搅拌均匀,即得量子点荧光胶B,所述量子点荧光粉为粉末状,或者也可为溶剂分散状;
d、将所述量子点荧光胶B涂覆于LED透镜内表面,涂覆厚度为500μm,并将涂覆有量子点荧光胶B的LED透镜置于紫外固化炉中,在400nm的紫外光下照射100s,使量子点荧光胶B固化;
e、在固化后的量子点荧光胶B表面涂覆聚氨酯类光固化封装胶水,涂覆厚度为1000μm,使封装胶水完全包覆量子点荧光胶B,并将涂覆有封装胶水的LED透镜置于紫外固化炉中,在395nm的紫外光下照射200s,使封装胶水固化,得到具有封装胶保护层的LED透镜,将得到的LED透镜固定于所述LED灯珠外部,即得到LED背光源。
本实施例中,所述LED背光源的结构如图2所示,包括LED单色灯条,所述LED灯条包括支架1、设置于所述支架1上表面的金属镀层2、固定于所述金属镀层表面的发光芯片3,所述发光芯片与所述金属镀层2还通过键合线4连接,所述发光芯片3外部封装有荧光胶层A5,所述LED灯条外部设置有所述LED透镜6,所述LED透镜6外表面涂覆有量子点荧光胶层B7,所述量子点荧光胶层B7表面又涂覆有封装胶保护层8。
实施例3
本实施例提供一种量子点透镜型直下式LED背光源的制作方法,其包括如下步骤:
a、称取0.12g发光材料A,所述发光材料A包括0.02g发射光波长526nm的ZnTe绿光量子点荧光粉、0.1g发射光波长526nm的氮化物红光荧光粉,称取3.05g环氧类封装胶水,并将其与发光材料A混合、真空脱泡搅拌,得到荧光胶A,所述量子点荧光粉为粉末状,或者也可为溶剂分散状;
b、将所述荧光胶A滴入固定有发光芯片的LED支架中,控制荧光胶A的体积占支架杯壳体积的95%,所述发光芯片为发射光波长440nm的蓝光芯片,并将滴有荧光胶A的LED支架置于烘箱中,在120℃下烘烤4h,得到LED灯珠;然后根据LED灯珠选取合适的FPC,在FPC表面涂覆锡膏,并将FPC置于回流焊炉中进行回流焊,回流焊最高温度为255℃,最高温区间内加热时间为20s;
c、称取0.08g发射光波长为650nm的PbZrO3红光量子点荧光粉,称取4.54g聚氨酯类光固化封装胶水并将其加入量子点荧光粉中,真空脱泡搅拌均匀,即得量子点荧光胶B;
d、将所述量子点荧光胶B涂覆于LED透镜内表面,涂覆厚度为200μm,并将涂覆有量子点荧光胶B的LED透镜置于紫外固化炉中,在365nm的紫外光下照射50s,使量子点荧光胶B固化;
e、在固化后的量子点荧光胶B表面涂覆有机硅类光固化封装胶水,涂覆厚度为750μm,使封装胶水完全包覆量子点荧光胶B,并将涂覆有封装胶水的LED透镜置于紫外固化炉中,在230nm的紫外光下照射130s,使封装胶水固化,得到具有封装胶保护层的LED透镜,将得到的LED透镜固定于所述LED灯珠外部,即得到LED背光源。
实验例
测试实施例1-3所述的方法制作得到的LED背光源的色坐标和色域值,结果如表1所示。
表1
从上述结果可以看出,采用实施例1-3所述的方法得到的LED背光源的发光光色均处于白光区,且具有高色域值,色域值均可达NTSC96%以上。
显然,上述实施例仅仅是为清楚地说明所作的举例,而并非对实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引伸出的显而易见的变化或变动仍处于本发明创造的保护范围之中。
Claims (10)
1.一种量子点透镜型直下式LED背光源的制作方法,其特征在于,包括如下步骤:
a、按照质量比1:1-300将发光材料A与封装胶水混合均匀,制得荧光胶A,所述发光材料A为量子点荧光粉和/或稀土元素掺杂的无机荧光粉;
b、将所述荧光胶A滴入固定有发光芯片的LED支架中,并将滴入的所述荧光胶A固化,得到LED灯珠;
c、按照质量比1:1-300将量子点荧光粉与封装胶水混合均匀,制得量子点荧光胶B;
d、将所述量子点荧光胶B涂覆于LED透镜内表面或外表面,并将涂覆的量子点荧光胶B固化;
e、在固化后的量子点荧光胶B表面涂覆封装胶水,并将所述封装胶水固化,得到具有封装胶保护层的LED透镜,将得到的LED透镜固定于所述LED灯珠外部,即得到LED背光源。
2.根据权利要求1所述的量子点透镜型直下式LED背光源的制作方法,其特征在于,所述量子点荧光粉、所述稀土元素掺杂的无机荧光粉发射光峰值波长为450-660nm,所述量子点荧光粉为BaS、AgInS2、NaCl、Fe2O3、In2O3、InAs、InN、InP、CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、GaAs、GaN、GaS、GaSe、InGaAs、MgS、MgSe、MgTe、PbS、PbSe、PbTe、Cd(SxSe1-x)、BaTiO3、PbZrO3、CsPbCl3、CsPbBr3、CsPbI3中的至少一种。
3.根据权利要求2所述的量子点透镜型直下式LED背光源的制作方法,其特征在于,所述无机荧光粉为硅酸盐、铝酸盐、磷酸盐、氮化物、氟化物荧光粉中的至少一种。
4.根据权利要求3所述的量子点透镜型直下式LED背光源的制作方法,其特征在于,所述发光芯片为发射光峰值波长230-400nm的紫外光芯片或发射光峰值波长420-480nm的蓝光芯片。
5.根据权利要求4所述的量子点透镜型直下式LED背光源的制作方法,其特征在于,所述步骤b中,所述荧光胶A的体积占所述LED支架体积的90-100%,所述荧光胶A在80-160℃下烘烤0.5-8h固化。
6.根据权利要求5所述的量子点透镜型直下式LED背光源的制作方法,其特征在于,所述封装胶水为环氧类封装胶水、有机硅类封装胶水、聚氨酯封装胶水中的至少一种。
7.根据权利要求6所述的量子点透镜型直下式LED背光源的制作方法,其特征在于,所述步骤b后还包括将所述LED灯珠焊接于FPC表面的步骤,所述焊接采用回流焊,所述回流焊最高温度为240-275℃,最高温度区间内加热时间为10-30s。
8.根据权利要求7所述的量子点透镜型直下式LED背光源的制作方法,其特征在于,所述步骤d中,所述量子点荧光胶B的涂覆厚度为5-500μm,所述量子点荧光胶B在230-400nm的紫外光下照射3-100s固化。
9.根据权利要求8所述的量子点透镜型直下式LED背光源的制作方法,其特征在于,所述步骤e中,所述封装胶水的涂覆厚度为10-1000μm,所述封装胶水在230-400nm的紫外光下照射5-200s固化。
10.根据权利要求9所述的量子点透镜型直下式LED背光源的制作方法,其特征在于,所述量子点荧光粉为粉末状或溶剂分散状。
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