CN111081845A - 一种量子点材料led灯丝及其制备方法 - Google Patents
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Abstract
本发明涉及一种量子点材料LED灯丝的制备方法，量子点LED灯丝的制备方法，包括超声波固晶、二氧化硅包覆的的量子点配备、金线键合、二氧化硅包覆的量子点粉涂敷、回流焊等步骤，其中封装材料使用二氧化硅包覆的CsPbBr3/Cs4PbBr6核壳结构量子点，所述二氧化硅包覆的CsPbBr3/Cs4PbBr6核壳结构量子点由以下重量份的原料制备得到：二氧化硅1.052g，0.326g(1mol)碳酸铯，5ml正辛酸，0.367g(1mol)溴化铅，与1.094g(2mol)四辛基溴化铵，3ml甲苯，0.7mlAPTES。本发明所生产出的量子点LED灯丝克服了现有技术中存在的出射角小，出光率低的技术缺陷，所生产的量子点LED灯丝能够大大提高发光效率。
Description
技术领域
本发明属于半导体灯具照明领域，具体涉及一种新型量子点材料LED灯丝的制备方法
背景技术
随着时代进步，LED技术已经融入到生活之中，LED灯丝灯也占据很大市场。
目前量子点荧光粉由于其优异的光电性能被广大研究者研究，但是量子点荧光粉在应用在LED照明领域的时候由于它的可靠性低难以封装成光源，并且针对量子点灯丝的发明目前还没有被人发明。
发明内容
基于上述技术原理，本发明提供一种量子点材料LED灯丝的制备方式，以保证LED灯丝的优秀性能。
具体如下技术方案：
一种量子点材料LED灯丝的制备，方法包括如下步骤：
提供蓝宝石灯丝基板和一定数量LED芯片，通过水平横向排列的方式沿着灯丝基板延长方向固定于灯丝基板；
在LED芯片间隔间利用金属焊线连接形成电连接结构，在垂直于基板的投影面和水平方向的基板投影面上金属焊线都具有一定弧度；
涂敷使用新型的二氧化硅覆盖CsPbBr3/Cs4PbBr6的量子点，覆盖于金线键合的芯片之上。
所述二氧化硅包覆的CsPbBr3/Cs4PbBr6核壳结构量子点由以下重量份的原料制备得到:二氧化硅1.052g，0.326g(1mol)碳酸铯，5ml正辛酸,0.367g(1mol)溴化铅，与1.094g(2mol)四辛基溴化铵，3ml甲苯，0.7mlAPTES。
提供碳酸铯、正辛酸、四辛基溴化铵、甲苯、溴化铅和APTES，将所述溶液进行混合，得到含有量子点的粗液，加入乙酸乙酯进行粗液分散，并离心提纯，得到含有CsPbBr3/Cs4PbBr6量子点的溶液。
提供蓝宝石基板片，形成具有凹槽的蓝宝石基板排列。
在基板和蓝宝石基底之间加入Ag/Au并利用超声波固晶进行焊接。
在所述蓝宝石基板进行蓝宝石固定焊接，并进行涂胶形成灯丝。
一种量子点材料LED量子点灯丝，包括：蓝宝石灯丝基板、一定数量的LED芯片、金属焊线以及二氧化硅包覆的量子点，一定数量的LED芯片通过水平横向排列的方式沿着灯丝基板延长方向固定于灯丝基板；在LED芯片间隔间利用金属焊线连接形成电连接结构，在垂直于基板的投影面和水平方向的基板投影面上金属焊线都具有一定弧度。
本发明采用蓝宝石基板，能显著提高LED的发光效果应用；在支架设置凹槽，将所述蓝宝石基板进行蓝宝石固定焊接，并进行涂胶形成灯丝，形成具有凹槽的蓝宝石基板排列；在基板和蓝宝石基底之间加入Ag/Au并利用超声波固晶进行焊接，有效提升了出光率。
本发明的新型量子点制备材料的使用，大幅度提升了发光的效果，利用荧光量子点易发光、自发光等特性，降低了能源的损耗；
本发明生产的量子点LED灯丝克服了现有技术中存在的光衰明显，出光率低的技术缺陷，能够大大提高量子点LED灯丝的发光效率。
附图说明
图1为实例量子点LED灯丝制备过程中LED芯片排布与金属焊线电连接结构图；
图2为实例量子点LED灯丝截面结构图。
图3为实例量子点LED灯丝制备过程中蓝宝石基板结构图。
图4为制备量子点LED灯丝的光谱图
其中：10、灯丝基板，20、LED芯片，30、金属焊线，40、二氧化硅覆盖CsPbBr3/Cs4PbBr6核壳结构量子点。
具体实施方式
下面结合具体实施方式和附图对本发明进行详细说明，仅作为参考解释。
附图用以论证实例，参考文本内容，技术人员可以理解其他可能的方法实例以及本发明优势。
本发明提供一种量子点材料LED灯丝的制备方式，步骤如下：
提供蓝宝石灯丝基板和一定数量LED芯片，通过水平横向排列的方式沿着灯丝基板延长方向固定于灯丝基板；如图1所示；该水平横向排列在蓝宝石灯丝基板设置一列。
在LED芯片间隔间利用金属焊线连接形成电连接结构，在垂直于基板的投影面和水平方向的基板投影面上金属焊线都具有一定弧度，如图1所示。
涂抹二氧化硅覆盖CsPbBr3/Cs4PbBr6核壳结构量子点，使用封装胶覆盖金属焊线和LED芯片，如图2所示。
蓝宝石基板，能显著提高LED的发光效果应用；在支架设置凹槽，将所述蓝宝石基板进行蓝宝石固定焊接，并进行涂胶形成灯丝，形成具有凹槽的蓝宝石基板排列；在基板和蓝宝石基底之间加入Ag/Au并利用超声波固晶进行焊接，有效提升了出光率；
所述金属焊线，在垂直于基板的投影面和水平方向的基板投影面上金属焊线都具有一定弧度，有效增长了导线长度，从而增大了灯丝的受力强度，进而提升了灯丝的耐久度；
同时，新型材料量子点LED灯丝克服了现有技术中存在的出射角小，出光率低的技术缺陷，能够大大提高量子点LED灯丝的发光效率。
参照图1至图3所示，本实施例提供的一种LED灯丝，包括：蓝宝石灯丝基板10、LED芯片20、金属焊线30、二氧化硅覆盖CsPbBr3/Cs4PbBr6核壳结构量子点层40，一定数量的LED芯片20通过水平横向排列的方式沿着灯丝基板10延长方向固定于灯丝基板10，如图1所示，该水平横向排列在蓝宝石灯丝基板10设置一列。在LED芯片20间隔间利用金属焊线30连接形成电连接结构，在垂直于基板10的投影面和水平方向的基板10投影面上金属焊线30都具有一定弧度，如图1所示，二氧化硅覆盖CsPbBr3/Cs4PbBr6核壳结构量子点40覆盖金属焊线30和LED芯片20。
在LED芯片20间隔间利用金属焊线30连接形成电连接结构，在垂直于基板10的投影面和水平方向的基板10投影面上金属焊线30都具有一定弧度，有效增长了导线长度，从而增大了灯丝的受力强度，进而提升了灯丝的耐久度；
如图3所示，采用蓝宝石基板10，能显著提高LED的发光效果应用；在支架设置凹槽，将所述蓝宝石基板10进行蓝宝石固定焊接，并进行涂胶形成灯丝，形成具有凹槽的蓝宝石基板排列；在基板和蓝宝石基底之间加入Ag/Au并利用超声波固晶进行焊接，有效提升了出光率。
基于上述的量子点灯丝，对其进行积分球测试发现，它的光效达到103lm/W,Ra达到88，其在CIE色坐标的落点如图四所示，通过图中可以知道灯丝是发白光。
本发明并不局限于所述的具体实例，在不脱离发明的精神实质情况下，领域内技术人员的技术操作应用与改进，均在本发明的保护范围内。
Claims (5)
1.量子点材料LED灯丝制备，特征在于：灯丝制备过程包括固晶、二氧化硅包覆的的量子点配备、金线键合、二氧化硅包覆的量子点粉涂敷、回流焊等步骤；涂抹二氧化硅覆盖CsPbBr3/Cs4PbBr6核壳结构量子点，使用封装胶覆盖金属焊线和LED芯片。
2.根据权利要求1所述的量子点材料LED灯丝制备方法，其特征在于：所述二氧化硅包覆的CsPbBr3/Cs4PbBr6核壳结构量子点由以下重量份的原料制备得到：二氧化硅1.052g,0.326g(1mol)碳酸铯，5ml正辛酸,0.367g(1mmol)溴化铅，与1.094g(2mmol)四辛基溴化铵，3ml甲苯，0.7mlAPTES。无需真空保护，于常温下搅拌5min，将溴化铅溶解，获得铅源溶液,将铯源溶液均匀混合到铅源溶液中，无需真空保护，于常温下搅拌5min，然后加入0.7mlAPTES，获得含有量子点的粗液。
3.根据权利要求1所述的LED灯丝的制备方法，其特征在于：采用蓝宝石基板，能显著提高LED的发光效果应用；在支架设置凹槽，将所述蓝宝石基板进行蓝宝石固定焊接，并进行涂胶形成灯丝，形成具有凹槽的蓝宝石基板排列；在基板和蓝宝石基底之间加入Ag/Au并利用超声波固晶进行焊接，有效提升了出光率。
4.根据权利要求3所述LED量子点灯丝，其特征在于：二氧化硅包覆的量子点粉采用远离涂敷的方法进行涂敷。
5.根据权利要求3所述LED量子点灯丝，其特征在于：金线键合机制是在低二氧化硅包覆的量子点材料熔点温度下，辅助超声摩擦能量实现金线与电极之间的原子扩散而形成键合。
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