CN105659382B - 用于控制堆叠裸片的位置的技术 - Google Patents

用于控制堆叠裸片的位置的技术 Download PDF

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CN105659382B
CN105659382B CN201480057576.XA CN201480057576A CN105659382B CN 105659382 B CN105659382 B CN 105659382B CN 201480057576 A CN201480057576 A CN 201480057576A CN 105659382 B CN105659382 B CN 105659382B
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bare chip
semiconductor bare
assembling
stair
semiconductor
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CN105659382A (zh
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M·H·S·达伊里格尔
R·D·霍普金斯
A·乔
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Oracle International Corp
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Oracle International Corp
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
CN201480057576.XA 2013-10-21 2014-09-24 用于控制堆叠裸片的位置的技术 Active CN105659382B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/059,302 2013-10-21
US14/059,302 US9209165B2 (en) 2013-10-21 2013-10-21 Technique for controlling positions of stacked dies
PCT/US2014/057237 WO2015060978A1 (en) 2013-10-21 2014-09-24 Technique for controlling positions of stacked dies

Publications (2)

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CN105659382A CN105659382A (zh) 2016-06-08
CN105659382B true CN105659382B (zh) 2019-04-12

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US (1) US9209165B2 (https=)
EP (1) EP3061131B1 (https=)
JP (1) JP6534386B2 (https=)
KR (1) KR102174120B1 (https=)
CN (1) CN105659382B (https=)
TW (1) TWI627682B (https=)
WO (1) WO2015060978A1 (https=)

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US10707171B2 (en) 2015-12-22 2020-07-07 Intel Corporation Ultra small molded module integrated with die by module-on-wafer assembly
US10234626B2 (en) * 2016-02-08 2019-03-19 Skorpios Technologies, Inc. Stepped optical bridge for connecting semiconductor waveguides
CN108878398B (zh) * 2017-05-16 2020-07-21 晟碟半导体（上海）有限公司 包括导电凸块互连的半导体器件
KR20190052957A (ko) * 2017-11-09 2019-05-17 에스케이하이닉스 주식회사 다이 오버시프트 지시 패턴을 포함하는 반도체 패키지
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