CN105487334B - 压印装置、压印方法及物品制造方法 - Google Patents
压印装置、压印方法及物品制造方法 Download PDFInfo
- Publication number
- CN105487334B CN105487334B CN201510622590.6A CN201510622590A CN105487334B CN 105487334 B CN105487334 B CN 105487334B CN 201510622590 A CN201510622590 A CN 201510622590A CN 105487334 B CN105487334 B CN 105487334B
- Authority
- CN
- China
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- imprinting apparatus
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 142
- 239000000463 material Substances 0.000 claims abstract description 54
- 238000005286 illumination Methods 0.000 claims abstract description 32
- 238000003860 storage Methods 0.000 claims description 18
- 238000009826 distribution Methods 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 230000007261 regionalization Effects 0.000 claims description 2
- 239000011800 void material Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 151
- 229920005989 resin Polymers 0.000 description 151
- 238000012545 processing Methods 0.000 description 19
- 238000000576 coating method Methods 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 17
- 239000000203 mixture Substances 0.000 description 10
- 239000004615 ingredient Substances 0.000 description 6
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 235000019994 cava Nutrition 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000010187 selection method Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014205201A JP6429573B2 (ja) | 2014-10-03 | 2014-10-03 | インプリント装置、インプリント方法および物品製造方法 |
| JP2014-205201 | 2014-10-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105487334A CN105487334A (zh) | 2016-04-13 |
| CN105487334B true CN105487334B (zh) | 2019-11-05 |
Family
ID=55632750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510622590.6A Active CN105487334B (zh) | 2014-10-03 | 2015-09-25 | 压印装置、压印方法及物品制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9405193B2 (enExample) |
| JP (1) | JP6429573B2 (enExample) |
| KR (1) | KR101993501B1 (enExample) |
| CN (1) | CN105487334B (enExample) |
| TW (1) | TWI610795B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6025079B2 (ja) * | 2014-10-07 | 2016-11-16 | 大日本印刷株式会社 | インプリント装置およびその制御方法 |
| JP6821414B2 (ja) * | 2016-12-13 | 2021-01-27 | キヤノン株式会社 | インプリント装置、及び物品の製造方法 |
| CN106681105A (zh) * | 2017-02-09 | 2017-05-17 | 深圳市华星光电技术有限公司 | 光阻涂布装置检测机构及光阻涂布机 |
| JP6993791B2 (ja) * | 2017-05-08 | 2022-01-14 | キヤノン株式会社 | インプリント装置 |
| JP7154839B2 (ja) * | 2018-06-26 | 2022-10-18 | キヤノン株式会社 | インプリント装置、インプリント方法および、物品製造方法 |
| JP7495814B2 (ja) * | 2020-05-13 | 2024-06-05 | キヤノン株式会社 | インプリント装置、および物品の製造方法 |
| JP7596134B2 (ja) * | 2020-12-09 | 2024-12-09 | キヤノン株式会社 | 形成装置、形成方法及び物品の製造方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101009218A (zh) * | 2006-01-24 | 2007-08-01 | 株式会社日立制作所 | 图形形成方法及图形形成装置 |
| JP2009266841A (ja) * | 2008-04-21 | 2009-11-12 | Toshiba Corp | ナノインプリント方法 |
| US7670530B2 (en) * | 2006-01-20 | 2010-03-02 | Molecular Imprints, Inc. | Patterning substrates employing multiple chucks |
| WO2010062328A2 (en) * | 2008-10-27 | 2010-06-03 | Molecular Imprints, Inc. | Dispense system |
| JP2012049471A (ja) * | 2010-08-30 | 2012-03-08 | Canon Inc | インプリント装置及び物品の製造方法 |
| CN103048879A (zh) * | 2011-10-14 | 2013-04-17 | 佳能株式会社 | 压印设备和使用该压印设备的物品制造方法 |
| JP2014041861A (ja) * | 2012-08-21 | 2014-03-06 | Dainippon Printing Co Ltd | インプリント装置およびインプリント方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5565034A (en) * | 1993-10-29 | 1996-10-15 | Tokyo Electron Limited | Apparatus for processing substrates having a film formed on a surface of the substrate |
| JP3760131B2 (ja) * | 2002-01-22 | 2006-03-29 | 東京エレクトロン株式会社 | 処理方法 |
| KR100877472B1 (ko) * | 2002-01-22 | 2009-01-07 | 도쿄엘렉트론가부시키가이샤 | 기판의 처리방법 및 기판의 처리장치 |
| US7309225B2 (en) | 2004-08-13 | 2007-12-18 | Molecular Imprints, Inc. | Moat system for an imprint lithography template |
| EP1825502A4 (en) * | 2004-12-01 | 2008-01-23 | Molecular Imprints Inc | EXPOSURE METHODS FOR THERMAL MANAGEMENT OF PRINTING LITHOGRAPHY METHODS |
| JP2010080630A (ja) * | 2008-09-25 | 2010-04-08 | Canon Inc | 押印装置および物品の製造方法 |
| JP5451450B2 (ja) * | 2010-02-24 | 2014-03-26 | キヤノン株式会社 | インプリント装置及びそのテンプレート並びに物品の製造方法 |
| JP5754965B2 (ja) * | 2011-02-07 | 2015-07-29 | キヤノン株式会社 | インプリント装置、および、物品の製造方法 |
| JP6123321B2 (ja) * | 2013-02-06 | 2017-05-10 | 大日本印刷株式会社 | インプリント方法およびインプリント装置 |
| JP6234207B2 (ja) * | 2013-12-18 | 2017-11-22 | キヤノン株式会社 | インプリント方法、インプリント装置および物品の製造方法 |
| WO2016052345A1 (ja) * | 2014-10-01 | 2016-04-07 | 大日本印刷株式会社 | インプリント装置、インプリント方法およびインプリント装置の制御方法 |
-
2014
- 2014-10-03 JP JP2014205201A patent/JP6429573B2/ja active Active
-
2015
- 2015-09-02 TW TW104129043A patent/TWI610795B/zh active
- 2015-09-23 KR KR1020150134262A patent/KR101993501B1/ko active Active
- 2015-09-25 US US14/865,648 patent/US9405193B2/en active Active
- 2015-09-25 CN CN201510622590.6A patent/CN105487334B/zh active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7670530B2 (en) * | 2006-01-20 | 2010-03-02 | Molecular Imprints, Inc. | Patterning substrates employing multiple chucks |
| CN101009218A (zh) * | 2006-01-24 | 2007-08-01 | 株式会社日立制作所 | 图形形成方法及图形形成装置 |
| JP2009266841A (ja) * | 2008-04-21 | 2009-11-12 | Toshiba Corp | ナノインプリント方法 |
| WO2010062328A2 (en) * | 2008-10-27 | 2010-06-03 | Molecular Imprints, Inc. | Dispense system |
| JP2012049471A (ja) * | 2010-08-30 | 2012-03-08 | Canon Inc | インプリント装置及び物品の製造方法 |
| CN103048879A (zh) * | 2011-10-14 | 2013-04-17 | 佳能株式会社 | 压印设备和使用该压印设备的物品制造方法 |
| JP2014041861A (ja) * | 2012-08-21 | 2014-03-06 | Dainippon Printing Co Ltd | インプリント装置およびインプリント方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US9405193B2 (en) | 2016-08-02 |
| JP2016076558A (ja) | 2016-05-12 |
| US20160097975A1 (en) | 2016-04-07 |
| JP6429573B2 (ja) | 2018-11-28 |
| TWI610795B (zh) | 2018-01-11 |
| CN105487334A (zh) | 2016-04-13 |
| TW201613740A (en) | 2016-04-16 |
| KR101993501B1 (ko) | 2019-06-26 |
| KR20160040425A (ko) | 2016-04-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |