CN105392927A - 通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置 - Google Patents

通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置 Download PDF

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Publication number
CN105392927A
CN105392927A CN201480037944.4A CN201480037944A CN105392927A CN 105392927 A CN105392927 A CN 105392927A CN 201480037944 A CN201480037944 A CN 201480037944A CN 105392927 A CN105392927 A CN 105392927A
Authority
CN
China
Prior art keywords
germanium
tin
solution
certain amount
containing compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480037944.4A
Other languages
English (en)
Chinese (zh)
Inventor
T·A·伍德罗
J·A·尼耳森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boeing Co
Original Assignee
Boeing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boeing Co filed Critical Boeing Co
Priority to CN202010757612.0A priority Critical patent/CN111876805B/zh
Publication of CN105392927A publication Critical patent/CN105392927A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
CN201480037944.4A 2013-07-05 2014-04-29 通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置 Pending CN105392927A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010757612.0A CN111876805B (zh) 2013-07-05 2014-04-29 通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/935,768 US10633754B2 (en) 2013-07-05 2013-07-05 Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium
US13/935,768 2013-07-05
PCT/US2014/035815 WO2015002690A1 (en) 2013-07-05 2014-04-29 Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202010757612.0A Division CN111876805B (zh) 2013-07-05 2014-04-29 通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置

Publications (1)

Publication Number Publication Date
CN105392927A true CN105392927A (zh) 2016-03-09

Family

ID=50819983

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201480037944.4A Pending CN105392927A (zh) 2013-07-05 2014-04-29 通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置
CN202010757612.0A Active CN111876805B (zh) 2013-07-05 2014-04-29 通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202010757612.0A Active CN111876805B (zh) 2013-07-05 2014-04-29 通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置

Country Status (5)

Country Link
US (2) US10633754B2 (enExample)
EP (1) EP3017091B1 (enExample)
JP (1) JP6453321B2 (enExample)
CN (2) CN105392927A (enExample)
WO (1) WO2015002690A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109158712A (zh) * 2018-09-27 2019-01-08 格林美（武汉）城市矿产循环产业园开发有限公司 一种双轴调节螺纹环镀修复装置
CN112601840A (zh) * 2018-08-28 2021-04-02 学校法人工学院大学 金属膜形成用组合物的制造方法、金属膜的制造方法、金属膜、金属膜层叠体和金属膜形成用组合物的制造装置
CN114561633A (zh) * 2022-02-23 2022-05-31 吉安宏达秋科技有限公司 镀锡液及其制备方法和用于印制线路板的镀锡方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749626A (en) * 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
US20030201188A1 (en) * 2002-04-30 2003-10-30 Schetty Robert A. Minimizing whisker growth in tin electrodeposits
JP2009052130A (ja) * 2007-07-31 2009-03-12 Primary:Kk 電解技術を用いて、金属ゲルマニウムの薄膜を形成する方法

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6511264A (enExample) * 1965-08-28 1967-03-01
JPS6015716B2 (ja) * 1977-10-21 1985-04-20 デイツプソ−ル株式会社 錫または錫合金電気めつき用浴の安定化方法
JPS6317890A (ja) * 1986-07-10 1988-01-25 Shiro Watanabe ゲルマニウム有機キレ−トアルカリ塩の製法
US4959278A (en) 1988-06-16 1990-09-25 Nippon Mining Co., Ltd. Tin whisker-free tin or tin alloy plated article and coating technique thereof
US5334240A (en) * 1990-06-04 1994-08-02 Macdermid, Incorporated Aqueous acidic tin-lead immersion plating bath containing weak acid and weak base
US5393573A (en) 1991-07-16 1995-02-28 Microelectronics And Computer Technology Corporation Method of inhibiting tin whisker growth
JP2953551B2 (ja) 1993-05-10 1999-09-27 ノーリツ鋼機株式会社 フィルム現像装置
US5750017A (en) 1996-08-21 1998-05-12 Lucent Technologies Inc. Tin electroplating process
AU8670798A (en) * 1997-07-30 1999-02-22 Whitaker Corporation, The Two layer solderable tin coating
KR20010072364A (ko) * 1999-06-11 2001-07-31 이즈하라 요조 무연 땜납
US6361823B1 (en) 1999-12-03 2002-03-26 Atotech Deutschland Gmbh Process for whisker-free aqueous electroless tin plating
US20020187364A1 (en) * 2001-03-16 2002-12-12 Shipley Company, L.L.C. Tin plating
US20020192492A1 (en) 2001-05-11 2002-12-19 Abys Joseph Anthony Metal article coated with near-surface doped tin or tin alloy
DE60226196T2 (de) 2001-05-24 2009-05-14 Shipley Co., L.L.C., Marlborough Zinn-Plattieren
JP4698904B2 (ja) 2001-09-20 2011-06-08 株式会社大和化成研究所 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品
AU2003252677A1 (en) * 2002-07-25 2004-02-16 Shinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
JP4461295B2 (ja) 2003-06-03 2010-05-12 石原薬品株式会社 中性光沢スズ−亜鉛合金メッキ浴
US7391116B2 (en) 2003-10-14 2008-06-24 Gbc Metals, Llc Fretting and whisker resistant coating system and method
JP4367149B2 (ja) * 2004-01-30 2009-11-18 日立電線株式会社 フラットケーブル用導体及びその製造方法並びにフラットケーブル
JP2007537358A (ja) * 2004-05-11 2007-12-20 テクニック・インコーポレイテッド 金−スズ共晶合金のための電気めっき用溶液
JP2006009039A (ja) 2004-06-21 2006-01-12 Rambo Chemicals (Hong Kong) Ltd ウィスカー成長が抑制されたスズ系めっき皮膜及びその形成方法
US20060096867A1 (en) * 2004-11-10 2006-05-11 George Bokisa Tin alloy electroplating system
JP2009500527A (ja) 2005-07-11 2009-01-08 テクニック・インコーポレイテッド スズ・ウィスカ成長を最小化する特性又は特徴を有するスズの電着
US20070295530A1 (en) 2006-06-07 2007-12-27 Honeywell International, Inc. Coatings and methods for inhibiting tin whisker growth
US7604871B2 (en) 2006-06-07 2009-10-20 Honeywell International Inc. Electrical components including abrasive powder coatings for inhibiting tin whisker growth
JP4998704B2 (ja) * 2007-01-22 2012-08-15 上村工業株式会社 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法
JP2009019226A (ja) * 2007-07-10 2009-01-29 Shinryo Corp 錫−銀−銅−ニッケル含有めっき液及びこれを用いて形成された錫−銀−銅−ニッケル含有めっき被膜
EP2179815A4 (en) * 2007-08-24 2010-09-08 Toshiba Kk BINDING COMPOSITION
US7918984B2 (en) * 2007-09-17 2011-04-05 International Business Machines Corporation Method of electrodepositing germanium compound materials on a substrate
CA2769569C (en) * 2009-07-31 2014-07-15 M-Tech Japan Co., Ltd. Tin-containing alloy plating bath, electroplating method using same, and substrate with the electroplating deposited thereon
EP2565297A3 (en) * 2011-08-30 2013-04-24 Rohm and Haas Electronic Materials LLC Adhesion promotion of cyanide-free white bronze
JP2014024082A (ja) * 2012-07-26 2014-02-06 Sumitomo Metal Mining Co Ltd はんだ合金

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749626A (en) * 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
US20030201188A1 (en) * 2002-04-30 2003-10-30 Schetty Robert A. Minimizing whisker growth in tin electrodeposits
JP2009052130A (ja) * 2007-07-31 2009-03-12 Primary:Kk 電解技術を用いて、金属ゲルマニウムの薄膜を形成する方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112601840A (zh) * 2018-08-28 2021-04-02 学校法人工学院大学 金属膜形成用组合物的制造方法、金属膜的制造方法、金属膜、金属膜层叠体和金属膜形成用组合物的制造装置
CN112601840B (zh) * 2018-08-28 2023-10-31 学校法人工学院大学 金属膜形成用组合物的制造方法、金属膜的制造方法、金属膜、金属膜层叠体和金属膜形成用组合物的制造装置
CN109158712A (zh) * 2018-09-27 2019-01-08 格林美（武汉）城市矿产循环产业园开发有限公司 一种双轴调节螺纹环镀修复装置
CN109158712B (zh) * 2018-09-27 2024-04-23 格林美（武汉）城市矿产循环产业园开发有限公司 一种双轴调节螺纹环镀修复装置
CN114561633A (zh) * 2022-02-23 2022-05-31 吉安宏达秋科技有限公司 镀锡液及其制备方法和用于印制线路板的镀锡方法
CN114561633B (zh) * 2022-02-23 2023-11-14 吉安宏达秋科技有限公司 镀锡液及其制备方法和用于印制线路板的镀锡方法

Also Published As

Publication number Publication date
CN111876805A (zh) 2020-11-03
US11505874B2 (en) 2022-11-22
EP3017091A1 (en) 2016-05-11
EP3017091B1 (en) 2021-01-27
US20150010774A1 (en) 2015-01-08
JP6453321B2 (ja) 2019-01-16
JP2016529395A (ja) 2016-09-23
US10633754B2 (en) 2020-04-28
CN111876805B (zh) 2023-12-01
US20200216972A1 (en) 2020-07-09
WO2015002690A1 (en) 2015-01-08

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SE01 Entry into force of request for substantive examination
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Application publication date: 20160309