JP6453321B2 - スズをゲルマニウムでドープすることによりスズ表面及びスズめっき表面上でのスズウィスカの成長を軽減するための方法及び装置 - Google Patents
スズをゲルマニウムでドープすることによりスズ表面及びスズめっき表面上でのスズウィスカの成長を軽減するための方法及び装置 Download PDFInfo
- Publication number
- JP6453321B2 JP6453321B2 JP2016523733A JP2016523733A JP6453321B2 JP 6453321 B2 JP6453321 B2 JP 6453321B2 JP 2016523733 A JP2016523733 A JP 2016523733A JP 2016523733 A JP2016523733 A JP 2016523733A JP 6453321 B2 JP6453321 B2 JP 6453321B2
- Authority
- JP
- Japan
- Prior art keywords
- germanium
- tin
- solution
- amount
- substrate surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims description 131
- 229910052732 germanium Inorganic materials 0.000 title claims description 129
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 title claims description 127
- 238000000034 method Methods 0.000 title claims description 49
- 239000000243 solution Substances 0.000 claims description 85
- 239000000758 substrate Substances 0.000 claims description 67
- 150000001875 compounds Chemical class 0.000 claims description 46
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 36
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 claims description 26
- 238000000576 coating method Methods 0.000 claims description 21
- 238000009713 electroplating Methods 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 239000004094 surface-active agent Substances 0.000 claims description 15
- 239000008139 complexing agent Substances 0.000 claims description 13
- 229940119177 germanium dioxide Drugs 0.000 claims description 13
- OBBXFSIWZVFYJR-UHFFFAOYSA-L tin(2+);sulfate Chemical compound [Sn+2].[O-]S([O-])(=O)=O OBBXFSIWZVFYJR-UHFFFAOYSA-L 0.000 claims description 12
- 229910000375 tin(II) sulfate Inorganic materials 0.000 claims description 12
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 11
- 239000003637 basic solution Substances 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 6
- 150000002290 germanium Chemical class 0.000 claims description 5
- 230000003213 activating effect Effects 0.000 claims description 3
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 2
- 240000009088 Fragaria x ananassa Species 0.000 claims 1
- 235000021012 strawberries Nutrition 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 description 105
- 238000007747 plating Methods 0.000 description 18
- 239000003795 chemical substances by application Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000008367 deionised water Substances 0.000 description 6
- 229910021641 deionized water Inorganic materials 0.000 description 6
- 239000008151 electrolyte solution Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 5
- 230000000116 mitigating effect Effects 0.000 description 5
- 239000013504 Triton X-100 Substances 0.000 description 4
- 229920004890 Triton X-100 Polymers 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229910005793 GeO 2 Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- -1 germanium fluoroborate Chemical compound 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- JYCQQPHGFMYQCF-UHFFFAOYSA-N 4-tert-Octylphenol monoethoxylate Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(OCCO)C=C1 JYCQQPHGFMYQCF-UHFFFAOYSA-N 0.000 description 1
- 241000270728 Alligator Species 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 description 1
- 229930195725 Mannitol Natural products 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 235000003704 aspartic acid Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 238000000975 co-precipitation Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 239000013068 control sample Substances 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- AICMYQIGFPHNCY-UHFFFAOYSA-J methanesulfonate;tin(4+) Chemical compound [Sn+4].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O AICMYQIGFPHNCY-UHFFFAOYSA-J 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- GPRLSGONYQIRFK-MNYXATJNSA-N triton Chemical compound [3H+] GPRLSGONYQIRFK-MNYXATJNSA-N 0.000 description 1
- 230000035899 viability Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/935,768 US10633754B2 (en) | 2013-07-05 | 2013-07-05 | Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium |
| US13/935,768 | 2013-07-05 | ||
| PCT/US2014/035815 WO2015002690A1 (en) | 2013-07-05 | 2014-04-29 | Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016529395A JP2016529395A (ja) | 2016-09-23 |
| JP2016529395A5 JP2016529395A5 (enExample) | 2017-06-15 |
| JP6453321B2 true JP6453321B2 (ja) | 2019-01-16 |
Family
ID=50819983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016523733A Active JP6453321B2 (ja) | 2013-07-05 | 2014-04-29 | スズをゲルマニウムでドープすることによりスズ表面及びスズめっき表面上でのスズウィスカの成長を軽減するための方法及び装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US10633754B2 (enExample) |
| EP (1) | EP3017091B1 (enExample) |
| JP (1) | JP6453321B2 (enExample) |
| CN (2) | CN105392927A (enExample) |
| WO (1) | WO2015002690A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6912845B2 (ja) * | 2018-08-28 | 2021-08-04 | 学校法人 工学院大学 | 金属膜形成用組成物の製造方法、金属膜の製造方法、金属膜、金属膜積層体及び金属膜形成用組成物の製造装置 |
| CN109158712B (zh) * | 2018-09-27 | 2024-04-23 | 格林美（武汉）城市矿产循环产业园开发有限公司 | 一种双轴调节螺纹环镀修复装置 |
| CN114561633B (zh) * | 2022-02-23 | 2023-11-14 | 吉安宏达秋科技有限公司 | 镀锡液及其制备方法和用于印制线路板的镀锡方法 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL6511264A (enExample) * | 1965-08-28 | 1967-03-01 | ||
| JPS6015716B2 (ja) * | 1977-10-21 | 1985-04-20 | デイツプソ−ル株式会社 | 錫または錫合金電気めつき用浴の安定化方法 |
| US4749626A (en) | 1985-08-05 | 1988-06-07 | Olin Corporation | Whisker resistant tin coatings and baths and methods for making such coatings |
| JPS6317890A (ja) * | 1986-07-10 | 1988-01-25 | Shiro Watanabe | ゲルマニウム有機キレ−トアルカリ塩の製法 |
| US4959278A (en) | 1988-06-16 | 1990-09-25 | Nippon Mining Co., Ltd. | Tin whisker-free tin or tin alloy plated article and coating technique thereof |
| US5334240A (en) * | 1990-06-04 | 1994-08-02 | Macdermid, Incorporated | Aqueous acidic tin-lead immersion plating bath containing weak acid and weak base |
| US5393573A (en) | 1991-07-16 | 1995-02-28 | Microelectronics And Computer Technology Corporation | Method of inhibiting tin whisker growth |
| JP2953551B2 (ja) | 1993-05-10 | 1999-09-27 | ノーリツ鋼機株式会社 | フィルム現像装置 |
| US5750017A (en) | 1996-08-21 | 1998-05-12 | Lucent Technologies Inc. | Tin electroplating process |
| AU8670798A (en) * | 1997-07-30 | 1999-02-22 | Whitaker Corporation, The | Two layer solderable tin coating |
| KR20010072364A (ko) * | 1999-06-11 | 2001-07-31 | 이즈하라 요조 | 무연 땜납 |
| US6361823B1 (en) | 1999-12-03 | 2002-03-26 | Atotech Deutschland Gmbh | Process for whisker-free aqueous electroless tin plating |
| US20020187364A1 (en) * | 2001-03-16 | 2002-12-12 | Shipley Company, L.L.C. | Tin plating |
| US20020192492A1 (en) | 2001-05-11 | 2002-12-19 | Abys Joseph Anthony | Metal article coated with near-surface doped tin or tin alloy |
| DE60226196T2 (de) | 2001-05-24 | 2009-05-14 | Shipley Co., L.L.C., Marlborough | Zinn-Plattieren |
| JP4698904B2 (ja) | 2001-09-20 | 2011-06-08 | 株式会社大和化成研究所 | 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品 |
| US6860981B2 (en) | 2002-04-30 | 2005-03-01 | Technic, Inc. | Minimizing whisker growth in tin electrodeposits |
| AU2003252677A1 (en) * | 2002-07-25 | 2004-02-16 | Shinryo Electronics Co., Ltd. | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| JP4461295B2 (ja) | 2003-06-03 | 2010-05-12 | 石原薬品株式会社 | 中性光沢スズ−亜鉛合金メッキ浴 |
| US7391116B2 (en) | 2003-10-14 | 2008-06-24 | Gbc Metals, Llc | Fretting and whisker resistant coating system and method |
| JP4367149B2 (ja) * | 2004-01-30 | 2009-11-18 | 日立電線株式会社 | フラットケーブル用導体及びその製造方法並びにフラットケーブル |
| JP2007537358A (ja) * | 2004-05-11 | 2007-12-20 | テクニック・インコーポレイテッド | 金−スズ共晶合金のための電気めっき用溶液 |
| JP2006009039A (ja) | 2004-06-21 | 2006-01-12 | Rambo Chemicals (Hong Kong) Ltd | ウィスカー成長が抑制されたスズ系めっき皮膜及びその形成方法 |
| US20060096867A1 (en) * | 2004-11-10 | 2006-05-11 | George Bokisa | Tin alloy electroplating system |
| JP2009500527A (ja) | 2005-07-11 | 2009-01-08 | テクニック・インコーポレイテッド | スズ・ウィスカ成長を最小化する特性又は特徴を有するスズの電着 |
| US20070295530A1 (en) | 2006-06-07 | 2007-12-27 | Honeywell International, Inc. | Coatings and methods for inhibiting tin whisker growth |
| US7604871B2 (en) | 2006-06-07 | 2009-10-20 | Honeywell International Inc. | Electrical components including abrasive powder coatings for inhibiting tin whisker growth |
| JP4998704B2 (ja) * | 2007-01-22 | 2012-08-15 | 上村工業株式会社 | 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法 |
| JP2009019226A (ja) * | 2007-07-10 | 2009-01-29 | Shinryo Corp | 錫−銀−銅−ニッケル含有めっき液及びこれを用いて形成された錫−銀−銅−ニッケル含有めっき被膜 |
| JP4188408B1 (ja) | 2007-07-31 | 2008-11-26 | 株式会社プライマリー | 電解技術を用いて、金属ゲルマニウムの薄膜を形成する方法 |
| EP2179815A4 (en) * | 2007-08-24 | 2010-09-08 | Toshiba Kk | BINDING COMPOSITION |
| US7918984B2 (en) * | 2007-09-17 | 2011-04-05 | International Business Machines Corporation | Method of electrodepositing germanium compound materials on a substrate |
| CA2769569C (en) * | 2009-07-31 | 2014-07-15 | M-Tech Japan Co., Ltd. | Tin-containing alloy plating bath, electroplating method using same, and substrate with the electroplating deposited thereon |
| EP2565297A3 (en) * | 2011-08-30 | 2013-04-24 | Rohm and Haas Electronic Materials LLC | Adhesion promotion of cyanide-free white bronze |
| JP2014024082A (ja) * | 2012-07-26 | 2014-02-06 | Sumitomo Metal Mining Co Ltd | はんだ合金 |
-
2013
- 2013-07-05 US US13/935,768 patent/US10633754B2/en active Active
-
2014
- 2014-04-29 CN CN201480037944.4A patent/CN105392927A/zh active Pending
- 2014-04-29 JP JP2016523733A patent/JP6453321B2/ja active Active
- 2014-04-29 EP EP14726494.9A patent/EP3017091B1/en active Active
- 2014-04-29 WO PCT/US2014/035815 patent/WO2015002690A1/en not_active Ceased
- 2014-04-29 CN CN202010757612.0A patent/CN111876805B/zh active Active
-
2020
- 2020-03-19 US US16/824,399 patent/US11505874B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN111876805A (zh) | 2020-11-03 |
| US11505874B2 (en) | 2022-11-22 |
| EP3017091A1 (en) | 2016-05-11 |
| EP3017091B1 (en) | 2021-01-27 |
| US20150010774A1 (en) | 2015-01-08 |
| JP2016529395A (ja) | 2016-09-23 |
| US10633754B2 (en) | 2020-04-28 |
| CN111876805B (zh) | 2023-12-01 |
| US20200216972A1 (en) | 2020-07-09 |
| CN105392927A (zh) | 2016-03-09 |
| WO2015002690A1 (en) | 2015-01-08 |
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