CN105308753A - 稳定高迁移率的motft和低温下的制备 - Google Patents

稳定高迁移率的motft和低温下的制备 Download PDF

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Publication number
CN105308753A
CN105308753A CN201480030005.7A CN201480030005A CN105308753A CN 105308753 A CN105308753 A CN 105308753A CN 201480030005 A CN201480030005 A CN 201480030005A CN 105308753 A CN105308753 A CN 105308753A
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China
Prior art keywords
layer
metal oxide
amorphous
high mobility
protective layer
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CN201480030005.7A
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Chinese (zh)
Inventor
谢泉隆
俞钢
法特·弗恩格
于尔根·穆佐尔夫
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CBRITE Inc
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CBRITE Inc
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
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    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
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    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76805—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics the opening being a via or contact hole penetrating the underlying conductor
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76814—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors
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    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
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    • H10D30/00—Field-effect transistors [FET]
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    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
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    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
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    • H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
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    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
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    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
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    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
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    • H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/691—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates 
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    • H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/693—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator the insulator comprising nitrogen, e.g. nitrides, oxynitrides or nitrogen-doped materials
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    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
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    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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    • H10D86/021—Manufacture or treatment of multiple TFTs

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thin Film Transistor (AREA)
  • Formation Of Insulating Films (AREA)
  • Physical Vapour Deposition (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
CN201480030005.7A 2013-05-24 2014-05-07 稳定高迁移率的motft和低温下的制备 Pending CN105308753A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/902,514 2013-05-24
US13/902,514 US9356156B2 (en) 2013-05-24 2013-05-24 Stable high mobility MOTFT and fabrication at low temperature
PCT/US2014/037191 WO2014189681A2 (en) 2013-05-24 2014-05-07 Stable high mobility motft and fabrication at low temperature

Publications (1)

Publication Number Publication Date
CN105308753A true CN105308753A (zh) 2016-02-03

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US (2) US9356156B2 (enExample)
EP (1) EP3005420A4 (enExample)
JP (1) JP2016519443A (enExample)
KR (1) KR20160012165A (enExample)
CN (1) CN105308753A (enExample)
WO (1) WO2014189681A2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017143135A (ja) * 2016-02-09 2017-08-17 株式会社ジャパンディスプレイ 薄膜トランジスタ
CN107749422A (zh) * 2017-09-21 2018-03-02 信利（惠州）智能显示有限公司 氧化物半导体薄膜晶体管
CN108780757A (zh) * 2016-03-22 2018-11-09 株式会社半导体能源研究所 半导体装置以及包括该半导体装置的显示装置
WO2020119126A1 (zh) * 2018-12-12 2020-06-18 广州新视界光电科技有限公司 氧化物半导体材料、薄膜晶体管及制备方法和显示面板

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9412623B2 (en) * 2011-06-08 2016-08-09 Cbrite Inc. Metal oxide TFT with improved source/drain contacts and reliability
US9362413B2 (en) * 2013-11-15 2016-06-07 Cbrite Inc. MOTFT with un-patterned etch-stop
US9136355B2 (en) * 2013-12-03 2015-09-15 Intermolecular, Inc. Methods for forming amorphous silicon thin film transistors
FR3024589B1 (fr) * 2014-07-29 2017-12-08 Commissariat Energie Atomique Dispositif electronique et son procede de fabrication
US20160313282A1 (en) * 2015-04-27 2016-10-27 Chan-Long Shieh Motft and array circuit for chemical/biochemical applications
US9515158B1 (en) 2015-10-20 2016-12-06 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor structure with insertion layer and method for manufacturing the same
US9496415B1 (en) 2015-12-02 2016-11-15 International Business Machines Corporation Structure and process for overturned thin film device with self-aligned gate and S/D contacts
WO2017208109A1 (en) 2016-06-03 2017-12-07 Semiconductor Energy Laboratory Co., Ltd. Sputtering target, oxide semiconductor, oxynitride semiconductor, and transistor
KR20250053970A (ko) 2018-03-12 2025-04-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 금속 산화물 및 금속 산화물을 포함한 트랜지스터
KR102163565B1 (ko) * 2018-12-07 2020-10-12 연세대학교 산학협력단 산화물 반도체 박막 트랜지스터
KR102813570B1 (ko) * 2021-05-26 2025-05-27 가부시키가이샤 니콘 반도체 장치, 전자 디바이스, pH 센서, 바이오 센서, 반도체 장치의 제조 방법, 및 전자 디바이스의 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090140243A1 (en) * 2007-11-30 2009-06-04 Samsung Electronics Co., Ltd. Oxide semiconductor thin film transistors and fabrication methods thereof
CN101630692A (zh) * 2008-07-14 2010-01-20 三星电子株式会社 沟道层和包括该沟道层的晶体管
US20110140100A1 (en) * 2009-12-10 2011-06-16 Masahiro Takata Thin-film transistor, method of producing the same, and devices provided with the same
US20120112182A1 (en) * 2010-11-05 2012-05-10 Sony Corporation Thin film transistor and a method of manufacturing the same
US20130063675A1 (en) * 2010-07-14 2013-03-14 Katsunori Misaki Thin film transistor substrate

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7211825B2 (en) * 2004-06-14 2007-05-01 Yi-Chi Shih Indium oxide-based thin film transistors and circuits
JP4609797B2 (ja) * 2006-08-09 2011-01-12 Ｎｅｃ液晶テクノロジー株式会社 薄膜デバイス及びその製造方法
JP4404881B2 (ja) * 2006-08-09 2010-01-27 日本電気株式会社 薄膜トランジスタアレイ、その製造方法及び液晶表示装置
KR101345376B1 (ko) * 2007-05-29 2013-12-24 삼성전자주식회사 ＺｎＯ 계 박막 트랜지스터 및 그 제조방법
US8058096B2 (en) * 2007-07-31 2011-11-15 Hewlett Packard Development Company, L.P. Microelectronic device
KR101270172B1 (ko) * 2007-08-29 2013-05-31 삼성전자주식회사 산화물 박막 트랜지스터 및 그 제조 방법
KR101270174B1 (ko) * 2007-12-03 2013-05-31 삼성전자주식회사 산화물 반도체 박막 트랜지스터의 제조방법
JP5325446B2 (ja) * 2008-04-16 2013-10-23 株式会社日立製作所 半導体装置及びその製造方法
EP2146379B1 (en) * 2008-07-14 2015-01-28 Samsung Electronics Co., Ltd. Transistor comprising ZnO based channel layer
US7812346B2 (en) * 2008-07-16 2010-10-12 Cbrite, Inc. Metal oxide TFT with improved carrier mobility
US8129718B2 (en) * 2008-08-28 2012-03-06 Canon Kabushiki Kaisha Amorphous oxide semiconductor and thin film transistor using the same
US9082857B2 (en) * 2008-09-01 2015-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising an oxide semiconductor layer
JP5339825B2 (ja) * 2008-09-09 2013-11-13 富士フイルム株式会社 薄膜電界効果型トランジスタおよびそれを用いた表示装置
KR20100054453A (ko) * 2008-11-14 2010-05-25 삼성전자주식회사 반도체 소자 및 그 형성 방법
KR101659105B1 (ko) * 2008-12-24 2016-09-22 쓰리엠 이노베이티브 프로퍼티즈 컴파니 금속 산화물 반도체 박막 트랜지스터의 안정성 향상
KR101034686B1 (ko) * 2009-01-12 2011-05-16 삼성모바일디스플레이주식회사 유기전계발광 표시 장치 및 그의 제조 방법
JP2010165922A (ja) * 2009-01-16 2010-07-29 Idemitsu Kosan Co Ltd 電界効果型トランジスタ、電界効果型トランジスタの製造方法及び半導体素子の製造方法
US8822988B2 (en) * 2009-03-31 2014-09-02 Hewlett-Packard Development Company, L.P. Thin-film transistor (TFT) with a bi-layer channel
US8530273B2 (en) * 2010-09-29 2013-09-10 Guardian Industries Corp. Method of making oxide thin film transistor array
EP2657974B1 (en) * 2010-12-20 2017-02-08 Sharp Kabushiki Kaisha Semiconductor device and display device
JP5679933B2 (ja) * 2011-08-12 2015-03-04 富士フイルム株式会社 薄膜トランジスタ及びその製造方法、表示装置、イメージセンサー、ｘ線センサー並びにｘ線デジタル撮影装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090140243A1 (en) * 2007-11-30 2009-06-04 Samsung Electronics Co., Ltd. Oxide semiconductor thin film transistors and fabrication methods thereof
CN101630692A (zh) * 2008-07-14 2010-01-20 三星电子株式会社 沟道层和包括该沟道层的晶体管
US20110140100A1 (en) * 2009-12-10 2011-06-16 Masahiro Takata Thin-film transistor, method of producing the same, and devices provided with the same
US20130063675A1 (en) * 2010-07-14 2013-03-14 Katsunori Misaki Thin film transistor substrate
US20120112182A1 (en) * 2010-11-05 2012-05-10 Sony Corporation Thin film transistor and a method of manufacturing the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017143135A (ja) * 2016-02-09 2017-08-17 株式会社ジャパンディスプレイ 薄膜トランジスタ
CN108780757A (zh) * 2016-03-22 2018-11-09 株式会社半导体能源研究所 半导体装置以及包括该半导体装置的显示装置
US11489076B2 (en) 2016-03-22 2022-11-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including the same
US11721769B2 (en) 2016-03-22 2023-08-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including the same
US12046679B2 (en) 2016-03-22 2024-07-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including the same
CN107749422A (zh) * 2017-09-21 2018-03-02 信利（惠州）智能显示有限公司 氧化物半导体薄膜晶体管
WO2020119126A1 (zh) * 2018-12-12 2020-06-18 广州新视界光电科技有限公司 氧化物半导体材料、薄膜晶体管及制备方法和显示面板

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EP3005420A2 (en) 2016-04-13
US20170033202A1 (en) 2017-02-02
US20140346495A1 (en) 2014-11-27
WO2014189681A3 (en) 2015-05-07
JP2016519443A (ja) 2016-06-30
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US9356156B2 (en) 2016-05-31
WO2014189681A2 (en) 2014-11-27

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