CN105074050B - 电镀或涂覆超声换能器的方法 - Google Patents
电镀或涂覆超声换能器的方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 70
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 97
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 84
- 229910052802 copper Inorganic materials 0.000 claims abstract description 84
- 239000010949 copper Substances 0.000 claims abstract description 84
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 48
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052737 gold Inorganic materials 0.000 claims abstract description 30
- 239000010931 gold Substances 0.000 claims abstract description 30
- 238000007747 plating Methods 0.000 claims abstract description 29
- 239000003054 catalyst Substances 0.000 claims abstract description 27
- 239000003518 caustics Substances 0.000 claims abstract description 15
- 230000008021 deposition Effects 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 46
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 28
- 239000002253 acid Substances 0.000 claims description 19
- 238000000576 coating method Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 14
- 229910052763 palladium Inorganic materials 0.000 claims description 14
- 239000006260 foam Substances 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 8
- 239000003599 detergent Substances 0.000 claims description 8
- 238000012790 confirmation Methods 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 5
- 238000005237 degreasing agent Methods 0.000 claims description 5
- 239000013527 degreasing agent Substances 0.000 claims description 5
- 238000007598 dipping method Methods 0.000 claims description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 238000007689 inspection Methods 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 2
- 239000004327 boric acid Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 238000005260 corrosion Methods 0.000 description 11
- 230000007797 corrosion Effects 0.000 description 11
- 239000008367 deionised water Substances 0.000 description 10
- 229910021641 deionized water Inorganic materials 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 7
- 229910000570 Cupronickel Inorganic materials 0.000 description 6
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 229910004039 HBF4 Inorganic materials 0.000 description 4
- 230000006399 behavior Effects 0.000 description 4
- 230000004087 circulation Effects 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 4
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 4
- 230000001788 irregular Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
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- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000012459 cleaning agent Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
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- 239000007788 liquid Substances 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- KPQDSKZQRXHKHY-UHFFFAOYSA-N gold potassium Chemical compound [K].[Au] KPQDSKZQRXHKHY-UHFFFAOYSA-N 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
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- H10N30/067—Forming single-layered electrodes of multilayered piezoelectric or electrostrictive parts
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- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
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- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
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- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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Abstract
根据一些实施例,将至少一个电极沉积于超声换能器的基础构件上的方法包括,使用第一腐蚀剂至少部分地腐蚀所述基础构件的表面,使用第一催化剂催化所述基础构件的表面,使用化学电镀法在所述基础构件的表面上电镀铜,检查电镀于所述基础构件表面上的铜,使用第二腐蚀剂至少部分地腐蚀所述镀有铜的表面,使用第二催化剂催化所述镀有铜的表面,使用化学电镀法在所述镀有铜的表面上电镀镍,以及在所述镀有镍的表面上沉积至少一个金层。
Description
背景
技术领域
本申请一般地涉及超声换能器,并且更具体地,涉及电镀或以其方式涂覆陶瓷管或其他管以生产换能器的电极的方法。
背景技术
超声换能器可包含具有内电极和/或外电极的陶瓷基材料,对所述电极通电以产生声能。因此,本文公开了将电极布置于超声换能器表面上的方法。
发明内容
根据一些实施例,将至少一个电极放置于超声换能器的基础构件上的方法(例如,制造换能器)包括,使用第一腐蚀剂至少部分地腐蚀所述基础构件的表面,使用第一催化剂催化所述基础构件的所述表面,在所述基础构件的所述表面上镀铜,使用第二腐蚀剂至少部分地腐蚀所述镀有铜的表面,使用第二催化剂催化所述镀有铜的表面,以及使用化学电镀方法在所述镀有铜的表面上镀镍。在一些实施例中,所述基础构件包含不导电的材料。在一个实施例中,所述基础构件包含陶瓷材料或其他不导电的材料。在一些实施例中,所述方法还包括在所镀有镍的表面上沉积至少一层金。
根据一些实施例,所述方法还包括在使用第一腐蚀剂至少部分地腐蚀所述基础构件的表面之前使用清洁剂清洁基础构件。在一个实施例中,所述清洁剂包括脱脂剂和醇中的至少一种。在一些实施例中,所述第一腐蚀剂和所述第二腐蚀剂中的至少一种包含酸。在一些实施例中,所述第一催化剂和所述第二催化剂中的至少一种包含钯。在一个实施例中,在所述基础构件的所述表面上镀铜包括将所述基础构件放置于铜浴中。
根据一些实施例,所述方法还包括检查在所述基础构件的所述表面上所镀的铜。在一个实施例中,检查在所述基础构件的所述表面上所镀的铜包括确认在所述基础构件上所镀的铜的厚度以及确认沿所述基础构件的镀层的均匀性中的至少一种。在一些实施例中,如果所述基础构件不满足所述检查的至少一个阈值要求,则所述方法还包括使用化学电镀法来在所述基础构件的所述表面上重新镀铜。
根据一些实施例,在所述基础构件的所述表面上镀铜包括使用化学电镀法和/或另一电镀法。在一个实施例中,在所述基础构件的所述表面上镀镍包括使用化学电镀法和/或另一电镀法。
根据一些实施例,所述第二催化剂包括硫酸根阴离子基溶液。在一个实施例中,在所述镀有铜的表面上镀锌包括将超声换能器放置于包含高-磷镍的浴液中。在一些实施例中,在所述镀有镍的表面上沉积至少一层金包括沿所述镀有镍的表面浸渍单层的金。在一些实施例中,沿涂有镍的表面的金的厚度介于0.1至10微英寸之间(例如,0.1至0.2微英寸、0.2至0.3微英寸、0.3至0.4微英寸、0.4至0.5微英寸、0.5至0.6微英寸、0.6至0.7微英寸、0.7至0.8微英寸、0.8至0.9微英寸、0.9至1微英寸、1至2微英寸、2至3微英寸、3至4微英寸、4至5微英寸、5至6微英寸、6至7微英寸、7至8微英寸、8至9微英寸、9至10微英寸,前述范围之间的厚度,等)。在一些实施例中,沿涂有镍的表面的金的厚度小于0.1微英寸或大于10微英寸(例如,10至15微英寸、15至20微英寸、20至30微英寸,大于30微英寸,等)。在一个实施例中,沿涂有镍的表面的金的厚度为约5微英寸。在一些实施例中,沿所述基础构件的所述表面的铜的厚度介于10至25微英寸之间(例如,10至12、12至14微英寸、14至16微英寸、16至18微英寸、18至20微英寸,前述范围之间的厚度,等)。在一个实施例中,沿所述基础构件的所述表面的铜的厚度为约15微英寸。在另一些实施例中,沿所述基础构件的所述表面的铜的厚度小于10微英寸(例如,0至1微英寸、1至2微英寸、2至3微英寸、3至4微英寸、5至6微英寸、6至7微英寸、7至8微英寸、8至9微英寸、9至10微英寸,前述范围之间的厚度,等)或大于25微英寸(例如,25至30微英寸、30至35微英寸、35至40微英寸、40至50微英寸、50至60微英寸、60至70微英寸、70至80微英寸、80至90微英寸、909至100微英寸,大于100微英寸,等)。在一些实施例中,沿所述涂有铜的表面的镍的厚度介于100至200微英寸之间(例如,100至110微英寸、110至120微英寸、120至130微英寸、130至140微英寸、140至150微英寸、150至160微英寸、160至170微英寸、170至180微英寸、180至190微英寸、190至200微英寸,前述范围之间的厚度,等)。
在一个实施例中,沿所述涂有铜的表面的镍的厚度为约150微英寸。在另一些实施例中,沿所述涂有铜的表面的镍的厚度小于100微英寸(例如,0至10微英寸、10至20微英寸、20至30微英寸、30至40微英寸、40至50微英寸、50至60微英寸、60至70微英寸、70至80微英寸、80至90微英寸、90至100微英寸,前述范围之间的厚度,等)或大于200微英寸(例如,200至210微英寸、210至220微英寸、220至230微英寸、230至240微英寸、240至250微英寸、250至300微英寸、300至400微英寸、400至500微英寸,前述范围之间的厚度,大于500微英寸,等)。
根据一些实施例,沿所述基础构件的外表面和内表面都沉积铜、镍和金。在一些实施例中,所述基础构件包含压电陶瓷材料。在一个实施例中,使用批方法在多个基础构件上沉积至少一个电极。在一些实施例中,将所述基础构件布置于线支架上。在一些实施例中,将所述基础构件布置于桶系统中。根据一些实施例,从较大的块构件切取所述基础构件。
根据一些实施例,使用本文描述的方法制造的超声换能器包括圆柱形换能器。在另一些实施例中,所述超声换能器具有非圆柱形状(例如,所述换能器具有平的、凹的、凸的、弯曲的、波浪的、不规则的、正弦曲线的和/或任何其他形状)。
根据一些实施例,超声换能器包括基础构件、沿所述基础构件的表面布置的至少一个铜层、沿所述至少一个铜层布置的至少一个镍层,其中将所述至少一个铜层布置于所述基础构件与所述至少一个镍层之间,以及沿所述至少一个镍层布置的至少一个金层。
根据一些实施例,将所述至少一个铜层镀于所述基础构件的所述表面上。在一些实施例中,使用化学电镀法将所述至少一个铜层镀于所述基础构件的所述表面上。在一些实施例中,沿所述至少一个铜层电镀所述至少一个镍层。在一个实施例中,使用化学电镀法沿所述至少一个铜层电镀所述至少一个镍层。在一些实施例中,所述基础构件包含不导电的材料。在一些实施例中,所述基础构件包含陶瓷。
在一些实施例中,沿所述涂有镍的表面的金的厚度介于0.1至10微英寸之间(例如,0.1至0.2微英寸、0.2至0.3微英寸、0.3至0.4微英寸、0.4至0.5微英寸、0.5至0.6微英寸、0.6至0.7微英寸、0.7至0.8微英寸、0.8至0.9微英寸、0.9至1微英寸、1至2微英寸、2至3微英寸、3至4微英寸、4至5微英寸、5至6微英寸、6至7微英寸、7至8微英寸、8至9微英寸、9至10微英寸,前述范围之间的厚度,等)。在一些实施例中,沿所述涂有镍的表面的金的厚度小于0.1微英寸或大于10微英寸(例如,10至15微英寸、15至20微英寸、20至30微英寸,大于30微英寸,等)。在一个实施例中,沿涂有镍的表面的金的厚度为约5微英寸。在一些实施例中,沿所述基础构件的所述表面的铜的厚度介于10至25微英寸之间(例如,10至12微英寸、12至14微英寸、14至16微英寸、16至18微英寸、18至20微英寸,前述范围之间的厚度,等)。在一个实施例中,沿所述基础构件的所述表面的铜的厚度为约15微英寸。在另一些实施例中,沿所述基础构件的所述表面的铜的厚度小于10微英寸(例如,0至1微英寸、1至2微英寸、2至3微英寸、3至4微英寸、5至6微英寸、6至7微英寸、7至8微英寸、8至9微英寸、9至10微英寸,前述范围之间的厚度,等)或大于25微英寸(例如,25至30微英寸、30至35微英寸、35至40微英寸、40至50微英寸、50至60微英寸、60至70微英寸、70至80微英寸、80至90微英寸、909至100微英寸,大于100微英寸,等)。在一些实施例中,沿所述涂有铜的表面的镍的厚度介于100至200微英寸之间(例如,100至110微英寸、110至120微英寸、120至130微英寸、130至140微英寸、140至150微英寸、150至160微英寸、160至170微英寸、170至180微英寸、180至190微英寸、190至200微英寸,前述范围之间的厚度,等)。在一个实施例中,沿所述涂有铜的表面的镍的厚度为约150微英寸。在另一些实施例中,沿所述涂有铜的表面的镍的厚度小于100微英寸(例如,0至10、10至20微英寸、20至30微英寸、30至40微英寸、40至50微英寸、50至60微英寸、60至70微英寸、70至80微英寸、80至90微英寸、90至100微英寸,前述范围之间的厚度,等)或大于200微英寸(例如,200至210微英寸、210至220微英寸、220至230微英寸、230至240微英寸、240至250微英寸、250至300微英寸、300至400微英寸、400至500微英寸,前述范围之间的厚度,大于500微英寸,等)。
根据一些实施例,所述至少一个铜层的厚度介于10至25微英寸之间,所述至少一个镍层的厚度介于100至200微英寸之间,并且所述至少一个金层的厚度介于0.1至10微英寸之间。
根据一些实施例,所述基础构件包含压电陶瓷材料。在一个实施例中,所述换能器包括圆柱形换能器。在一些实施例中,所述超声换能器具有非圆柱形状(例如,所述换能器具有平的、凹的、凸的、弯曲的、波浪的、不规则的、正弦曲线的和/或任何其他形状)。根据一个实施例,所述换能器的内表面和外表面均包括铜层、镍层和金层。
根据一些实施例,在超声换能器的基础构件上放置至少一个电极的方法包括,用清洁剂清洁基础构件,其中所述基础构件包含陶瓷材料。所述方法还包含,使用第一腐蚀剂(例如,酸)至少部分地腐蚀所述基础构件的表面,使用第一催化剂(例如,包含钯的溶液)催化所述基础构件的所述表面,使用化学电镀法在所述基础构件的所述表面上镀铜,检查所述基础构件的所述表面上所镀的铜,使用第二腐蚀剂(例如,酸)至少部分地腐蚀所述镀有铜的表面,使用第二催化剂(例如,包含钯的溶液)催化所述镀有铜的表面,使用化学电镀法在所述镀有铜的表面上镀镍,以及在所述镀有镍的表面上沉积至少一个金层。
根据一些实施例,所述清洁剂包括脱脂剂、醇和/或诸如此类。在一些实施例中,所述第一腐蚀剂和所述第二腐蚀剂包含酸(例如,Citranox、H2SO4等)。在一些实施例中,在所述基础构件的所述表面上镀铜包括将所述基础构件放置于铜浴中。在一些实施例中,检查在所述基础构件的所述表面上所镀的铜包括确认在所述基础构件上所镀的铜的厚度,确认沿所述基础构件的镀层的均匀性和/或铜镀层的品质和范围的任何其他方面。根据一些实施例,如果所述基础构件不满足所述检查的至少一个阈值要求,则所述方法还包括使用化学电镀法来在所述基础构件的所述表面上重新镀铜。
根据一些实施例,所述第二催化剂包括硫酸根阴离子基溶液。在一些实施例中,在所述镀有铜的表面上镀锌包括将所述超声换能器放置于包含高-磷镍的浴液中。在一些实施例中,在所述镀有镍的表面上沉积至少一个金层包括沿所述镀有镍的表面浸渍单层的金。
根据一些实施例,沿所述基础构件的所述表面的铜的厚度为约10至20微英寸(例如,15微英寸、10至12微英寸、12至14微英寸、14至16微英寸、16至18微英寸、18至20微英寸,等)。在一些实施例中,沿所述涂有铜的表面的镍的厚度为约100至200微英寸(例如,150微英寸,100至120微英寸、120至140微英寸、140至160微英寸、160至180微英寸、180至200微英寸,等)。在一些实施例中,沿所述涂有镍的表面的金的厚度为约0.1至10微英寸(例如,5微英寸,0至1微英寸、1至2微英寸、2至3微英寸、4至5微英寸,等)。
根据一些实施例,所述基础构件具有圆柱形状。在一些实施例中,沿所述基础构件的外表面和内表面沉积有铜、镍和金。在一个实施例中,所述基础构件包含压电陶瓷材料(例如,PZT)。在一些实施例中,使用批方法(例如,使用线支架、桶系统等)在多个基础构件上沉积至少一个电极。在一些实施例中,从较大的块构件(例如,长的陶瓷筒)切取所述基础构件。
上文概述的以及下文更详细记载的方法描述了某些由实施者(例如,制造者)采取的行为;但是,应理解,它们还可包括由另一方对这些行为的指导。因此,例如“沉积至少一个层”等动作包括“指导沉积至少一个层”。
附图说明
图1以图示的方式描述了根据一个实施例在超声换能器的基础构件上沉积电极的流程图。
具体实施方式
在一些实施例中,超声换能器具有包含基础材料的圆柱形状。这样的基础材料可包括陶瓷,例如,锆钛酸铅(PZT)、其他压电陶瓷材料和/或诸如此类。在一些实施例中,将长圆柱形的陶瓷基础材料切割和/或以其他方式加工成较小的部段,以制造具有期望长度的单个换能器。在产生基础管部分后,可使用一种或多种金属电镀方法来选择性地在其上沉积一个或多个电极。如本文所述,所述电极可包含一种或多种金属、合金和/或其他导电材料。图1的流程图中以图示的方式示出了电镀换能器的方法10的一个实施例。在本文公开的任何实施例中,可制备多个圆柱管,并同时对其进行涂覆,例如,在批系统中涂覆。例如,在一些实施例中,将多个换能器管放置于支架系统(例如,线支架)、桶系统和/或诸如此类中。因此,在制备、电镀和/或其他制造步骤期间,可同时将多个管浸没或至少部分地浸没于一种或多种浴液或溶液中。
在一些实施例中,本文公开的多种涂覆方法和技术可用于不是圆柱形的表面,例如,平表面、波浪表面、凸面、凹面或其他圆表面、不规则形状的表面、其他非圆柱形表面和/或诸如此类。因此,本文公开的多种涂覆方法可用于制造不是圆柱形的超声换能器和/或不具有圆柱形状的换能器的电极,所述换能器例如,平换能器、凹或凸换能器、不规则形状的换能器等。
清洁与初始准备
在一些实施例中,使用机械加工油、其他油、润滑脂、天然涂层或层和/或其他材料来生产单个的管长度。因此,在开始涂覆方法之前,可期望或要求清洁和以其他方式准备20所述管。例如,在一些实施例中,所述方法包括使用超声脱脂器、醇基清洁剂和/或任何其他清洁产品或试剂来对管进行脱脂。如上文所述,可将管浸没或以其他方式放置于浴液(例如,脱脂溶液)内。在暴露于脱脂剂或其他清洁剂特定时间(例如,~1分钟)后,可移出该管并将其放置于去离子水溶液或浴液中(例如,保持~1分钟),以去除余量的脱脂剂和/或其他清洁溶液。在另一些实施例中,对将超声电极布置于其上的表面的初始清洁或脱脂可通过使用任何其他方法或设备来完成,包括但不限于,化学清洁、机械清洁(例如,沙化、再表面化等)和/或诸如此类。此外,初始脱脂或其他初始清洁阶段的时间可为小于1分钟(例如,0至20秒、20至30秒、30至40秒、40至50秒、50至60秒,前述范围之间的时间,等)或大于1分钟(例如,1至1.5分钟、1.5至2分钟、2至3分钟、3至4分钟、4至5分钟、5至10分钟,大于10分钟,等)。
然后,在一个实施例中,可使用酸清洁剂和/或其他腐蚀材料进一步清洁该管的表面。例如,可将该管放置于溶液或其他相对弱的酸溶液中,保持约1分钟。在另一些实施例中,所述酸清洁或腐蚀步骤或类似的准备步骤的时间可为小于1分钟(例如,0至20秒、20至30秒、30至40秒、40至50秒、50至60秒,前述范围之间的时间,等)或大于1分钟(例如,1至1.5分钟、1.5至2分钟、2至3分钟、3至4分钟、4至5分钟、5至10分钟,大于10分钟,等)。这可帮助将额外的不想要的层、涂层或材料从该管的暴露在外的表面(例如,内表面和外表面)去除。在一些实施例中,酸清洁步骤(例如,使用相对弱的酸)至少部分地腐蚀或再表面化该管的外表面。在一些实施例中,可使用水冲洗(例如,使用去离子水)或另一种流体冲洗以将余量的酸清洁剂从该管去除。
铜电镀的准备
在一些实施例中,首先对管或其他换能器基础构件进行镀铜。在一些实施例中,可在电镀铜方法前采取一个或多个准备性步骤24。例如,可将该管放置于强酸溶液中,例如,10%的HBF4(例如,四氟硼酸、其他氟硼酸等)和乙酸盐溶液中。可使用一种或多种其他酸,例如,盐酸、硫酸、硝酸、任何其他酸等,其可在HBF4和乙酸盐之外或替代HBF4和乙酸盐来使用。在一个实施例中,将该管暴露于这种溶液中,保持约90秒(例如,60至120秒、60至70秒、70至80秒、80至90秒、90至100秒、100至110秒、110至120秒,前述范围之间的时间等)。但是,在另一些实施例中,如特定方法(例如,基于所要求的腐蚀的量、所使用的酸的类型和强度等)所期望或要求的,在该步骤的暴露时间可少于或多于90秒(例如,60至90秒、90至120秒、30至60秒、小于30秒、多于120秒等)。无论确切方案是什么,这样的暴露的结果是,可至少部分地腐蚀该管的外表面。这可帮助去除铅和/或其他不期望的物质,这些物质可能干扰后续电镀铜的步骤。在一些实施例中,在腐蚀步骤期间必须要注意防止损坏该管的几何结构。换言之,如果进行了过量腐蚀,则改变管的圆柱形状,从而不利地影响该换能器的声能特性。例如,如果该管不是在特定的容许程度中的圆柱形,则由该换能器发射的声能在径向上会不均匀的传递(例如,产生热点、较低能量强度点等)。
一旦对该该管已经充分地腐蚀了,即可对其进行冲洗以去除任何余量的腐蚀溶液或材料。例如,在一个实施例中,该管可经历一次、两次或更多次去离子水冲洗和/或其他液体基冲洗。例如,在一些实施例中,该管经历了两个分离的去离子水冲洗循环,每个循环可持续约30秒。但是,在另一些实施例中,冲洗时间可少于或多于30秒(例如,0至10秒、10至20秒、20至30秒、30至40秒、40至50秒、50至60秒、1至2分钟、2至3分钟、3至4分钟、4至5分钟,前述范围之间的时间,多于5分钟,等)。
在一些实施例中,使该换能器随后经历清洁的铜试镀(copper dummy)负载溶液,例如,10%的HBF4溶液(和/或具有不同酸、不同强度和/或其他性质的另一溶液),保持约1分钟。但是,在另一些实施例中,该步骤可少于或多于1分钟(例如,0至10秒、10至20秒、20至30秒、30至40秒、40至50秒、50至60秒、1至2分钟、2至3分钟、3至4分钟、4至5分钟,前述范围之间的时间,多于5分钟,等)。这样的步骤可帮助该管的外表面和内表面对后续的铜电镀步骤更具反应性。在一些实施例中,将包含铜的一种或多种片或其他构件布置于该管所放置的浴液或溶液中。例如,在一些实施例中,在开始实际的镀铜方法之前,将包含铜的一个或多个组件(例如,板、其他构件等)的约1/2平方英尺的表面积放置于浴液中,保持约1至5分钟。
在将其暴露于铜试镀负载溶液中后,可在水冲洗阶段对该换能器管进行冲洗。在一些实施例中,例如可使用去离子水冲洗该管约30秒。但是,在另一些实施例中,冲洗时间可少于或多于30秒(例如,0至10秒、10至20秒、20至30秒、30至40秒、40至50秒、50至60秒、1至2分钟、2至3分钟、3至4分钟、4至5分钟,前述范围之间的时间,多于5分钟,等)。
电镀铜
继续参照图1,在一些实施例中,在电镀铜准备步骤后,该换能器管或其他换能器基构件(例如,板)可进行电镀铜工艺28。在一个实施例中,可为一种或多种电镀用催化剂的后续应用来处理该管的表面。例如,可将该管或其他构件暴露于敏化剂(例如,Enthone432),保持约1分钟。在一些布置中,使Enthone或其他准备性溶液进行一个或多个冲洗步骤。例如,该管可经历两次使用去离子水冲洗的步骤,每个步骤可持续约20秒。但是,在另一些实施例中,暴露于敏化剂或任何后续冲洗步骤的时间可比上文所述的时间更短或更长。例如,可将该管或其他基础构件暴露于敏化剂,保持少于或多于1分钟(例如,0至10秒、10至20秒、20至30秒、30至40秒、40至50秒、50至60秒、1至2分钟、2至3分钟、3至4分钟、4至5分钟,前述范围之间的时间,多于5分钟,等)。同样地,随后的冲洗可采用单一步骤或多步骤(例如,2、3、4、多于4个步骤等),并且可持续少于或多于20秒(例如,0至5秒、5至10秒、10至15秒、15至20秒、20至25秒、25至30秒、30至40秒、40至50秒、50至60秒、1至2分钟、2至3分钟、3至4分钟、4至5分钟,前述范围之间的时间,多于5分钟,等)。
然后,在一些实施例中,可用钯至少部分地催化换能器管或其他换能器基础构件的表面。例如,可将该管或其他构件放置于催化剂溶液(例如,Enthone 440)浴中,保持约3分钟。在一些实施例中,可将该管或其他基础构件与催化剂溶液接触放置少于或多于3分钟(例如,0至10秒、10至20秒、20至30秒、30至40秒、40至50秒、50至60秒、1至2分钟、2至3分钟、3至4分钟、4至5分钟、5至6分钟、6至7分钟、7至8分钟、8至9分钟、9至10分钟,前述范围之间的时间,多于10分钟,等)。在一些实施例中,所述钯是辅助在管表面上进行后续电镀铜的催化剂。可使用一种或多种其他催化剂替代钯,或除钯以外还使用一种或多种其他催化剂。然后,可使用速蘸法和/或任何其他方法或步骤来去除过量的包含钯的溶液和/或其他催化剂。
一旦准备好了换能器管或其他换能器基础构件的表面,即可将该管或其他基础构件放置于浴液中(例如,Enthone 406、其他包含铜的溶液等中),以能够将铜电镀至该管或其他基础构件上。例如,在一些实施例中,将该管在这样的浴液中保持约10分钟。在一些实施例中,这样的电镀方法可在该管上形成约10至20微英寸(例如,10微英寸、11微英寸、12微英寸、13微英寸、14微英寸、15微英寸、16微英寸、17微英寸、18微英寸、19微英寸、20微英寸,前述范围之间的厚度,等)的铜涂层。但是,在一些实施例中,可将该管或其他基础构件放置于浴液中来进行该步骤,保持少于或多于10分钟(例如,0至10秒、10至20秒、20至30秒、30至40秒、40至50秒、50至60秒、1至2分钟、2至3分钟、3至4分钟、4至5分钟、5至6分钟、6至7分钟、7至8分钟、8至9分钟、9至10分钟、11至12分钟、12至13分钟、13至14分钟、14至15分钟、15至20分钟,前述范围之间的时间,多于20分钟,等)。此外,按期望或要求,所得的铜涂层可小于10微英寸(例如,0至1微英寸、1至2微英寸、2至3微英寸、3至4微英寸、5至6微英寸、6至7微英寸、7至8微英寸、8至9微英寸、9至10微英寸,等)或大于20微英寸(例如,20至25微英寸、25至30微英寸、30至40微英寸、40至50微英寸,前述范围之间的尺寸,大于50微英寸,等)。
铜镀层检查
在一些实施例中,在检测阶段32后,如果确定铜的镀层不足(例如,镀层厚度不足、镀层不均匀等),可将该管经历一个或多个电镀铜循环28。因此,如由图1中的步骤36所示,不需要由头(例如,图1中的步骤20或24)开始电镀方法。步骤10中的这种短循环步骤36可缩短制造时间,简化制造方案并提供一种或多种益处和优点。在一些实施例中,在弃掉换能管前,可重复短循环步骤36不超过约4次。
镍电镀的准备
在一些实施例中,如果电镀铜令人满意,则随后可使该管或其他基础构件经历一个或多个电镀镍步骤。在一些实施例中,在电镀铜步骤28和检查步骤32后,该管可进行电镀镍准备工艺40。例如,可在进行腐蚀步骤之前,用去离子水和/或其他溶液冲洗该管约20秒。在一些实施例中,可在10%H2SO4溶液和/或任何其他酸溶液中至少部分地腐蚀镀有铜的管,保持约30秒。在一些实施例中,所述冲洗步骤和/或腐蚀步骤可与上文所述不同。例如,可冲洗该管或其他基础构件少于或多于20秒(例如,0至5秒、5至10秒、10至15秒、15至20秒、20至25秒、30至40秒、40至50秒、50至60秒、1至2分钟、2至3分钟、3至4分钟、4至5分钟,前述范围之间的时间,多于5分钟,等)。此外,所述腐蚀步骤可按期望或要求持续少于或多于30秒(例如,0至5秒、5至10秒、10至15秒、15至20秒、20至25秒、30至40秒、40至50秒、50至60秒、1至2分钟、2至3分钟、3至4分钟、4至5分钟,前述范围之间的时间,多于5分钟,等)。在一些实施例中,H2SO4和/或其他酸性溶液的使用可提供先前电镀铜步骤中使用的硫酸根阴离子的更佳匹配,从而促进电镀镍工艺。
在一些实施例中,一旦已经腐蚀了镀有铜的管,即可使其经历钯催化剂溶液(例如,TechniCatalyst AT 4000)和/或另一催化剂溶液或混合物。例如,可将该管放置于钯催化剂溶液中,保持约2分钟。在一些实施例中,可按期望或要求将该管于催化剂中保持少于或多于2分钟(例如,0至5秒、5至10秒、10至15秒、15至20秒、20至25秒、30至40秒、40至50秒、50至60秒、1至2分钟、2至3分钟、3至4分钟、4至5分钟,前述范围之间的时间,多于5分钟,等)。在一些实施例中,所述钯催化剂溶液包含硫酸根离子活化剂。在一些实施例中,所述钯催化剂溶液不包含氯离子活化剂。在暴露于所述钯催化剂后,可终止铜试镀负载,并冲洗该管以去除任何过量的钯催化剂溶液(例如,通过使用去离子水速蘸法)。
电镀镍
在一些实施例中,该换能器管随后可进行镀镍方法44。例如,可将该管或其他基础构件放置于镍溶液中,保持约15分钟。在一些实施例中,可按要求将该管或其他基础构件放置于镍溶液中,保持少于或多于15分钟(例如,0至5分钟、5至10分钟、10至15分钟、15至20分钟、20至25分钟、30至40分钟、40至50分钟、50至60分钟、1至2小时、2至3小时、3至4分钟、4至5小时,前述范围之间的时间,多于5小时,等)。在一些实施例中,所述镍溶液包括高-磷镍溶液(例如,NICHEM 5100)。在一些实施例中,由于暴露于这样的镍溶液,可将约100至200微英寸(例如,150微英寸)的镍电镀于该换能器管或其他基础构件的外表面上(例如,处于电镀的铜层上面)。在已经充分地将镍电镀于该换能器管的外表面上后,可用去离子水冲洗该管或其他构件(例如,保持约20秒)来去除过量的镍溶液。在另一些实施例中,如所期望或要求的,该冲洗步骤可或其他基础构件可持续少于或多于20秒(例如,0至5秒、5至10秒、10至15秒、15至20秒、20至25秒、30至40秒、40至50秒、50至60秒、1至2分钟、2至3分钟、3至4分钟、4至5分钟,前述范围之间的时间,多于5分钟,等)。
金浸渍
在一些实施例中,可沿着换能器管上已经镀有的铜层和镍层的外侧来布置48金层(和/或另一金属或合金涂层)。例如,可在该管外侧上将金浸渍为单层。在另一些实施例中,按期望或要求使用多于一个(例如,2个、3个、多于3个,等)金层。在一些实施例中,使该管经历金(例如,OMG Fidelity 9027+钾金)的浸渍,保持约2分钟。这种浸渍层的使用可消除或降低因在圆筒的表面上,尤其是在相对较小的圆筒的内表面内进行电镀金而导致的复杂化(complications)的可能性。因此,在一些实施例中,在不使用电解法的情况下,将所述金放置于换能器管上。在一些实施例中,沉积于该管上(例如,沿铜和镍层外侧)的金单层的厚度为约2至10微英寸(例如,5微英寸)。在金浸渍工艺后,可使用去离子水冲洗(例如,保持约20秒)从管外去除任何过量的金。
干燥和结束
根据一些实施例,在沿着换能器管外侧已经布置期望的铜层、镍层、金层和/或任何其他材料层后,该管可经历一个或多个饰面(finishing)步骤52。例如,可使用醇冲洗(包含例如,异丙醇)来去除任何过量的水,以及促进该管外表面的干燥。最后,在一些实施例中,可将该管放置于烘箱或其他热环境中,以去除醇并干燥该管。
根据本文公开的多个实施例的电镀和/或以其他方式涂覆的换能器管可包含三种金属,例如,铜基层、镍中间层和金外层。在一些实施例中,布置于该管上的多种金属的厚度可为约150至200微英寸。例如,在一个实施例中,换能器可包括分别具有约15微英寸的铜基层、150微英寸的镍中间层和5微英寸的金外层。在另一些实施例中,一个或多个层的厚度可按期望或要求而变化。
在以下文献中提供了与可能的超声换能器设计和实施例有关的额外细节(例如,在结构上的和操作上的):2001年7月13日提交的美国专利申请11/267,123,并于2002年6月6日公开,公开号为2002/0068885;2001年7月13日提交的美国专利申请09/905,227,并于2003年10月21日授权为美国专利6,635,054;2001年7月13日提交的美国专利申请09/904,620,并且于2004年7月20日授权为美国专利6,763,722;2004年2月20日提交的美国专利申请10/783,310,并于2010年11月23日授权为美国专利7,837,676;2010年2月3日提交的美国专利申请12/227,508,并于2010年5月27日公开,公开号为2010/0130892;2003年6月30日提交的美国专利申请10/611,838,并于2004年4月29日公开,公开号为2004/0082859;以及2011年2月18日提交的PCT申请PCT/US2011/025543,并于2012年8月23日公开,公开号为WO2012/112165。所有前述申请的整体都通过引用并入本文,并形成本申请的一部分。
为了辅助描述所公开的实施例,上文使用以下词语来描述不同的实施例和/或附图:向上、上、底、向下、下、后、正、垂直、水平、上游、下游。但是,应领会,无论是否进行了描述,不同的实施例可位于和朝向多种期望的位置。
虽然本文公开了一些实施例和实施例,但是本申请可超过具体公开的实施例延伸至其他的替代实施例,和/或本发明的用途以及它们的变型和等同物。还理解的是,可对这些实施例的具体特征和方面进行组合或亚组合,并仍然落在本发明的范围内。因此,应理解,可将所公开的实施例的多个特征和方面进行彼此组合或替代,以形成本发明的多样的模式。因此,本文公开的本发明的范围不应被上文具体公开的实施例所限制,而应当仅由通过直接阅读后面的权利要求书来确定。
虽然本发明允许有各种变型和替代形式,但其具体实施例已经在附图中示出并在本文中进行了详细描述。但是,应理解,本发明不限制于所公开的特定形式,恰好相反,本发明意在覆盖落入所描述的多种实施例和所附的权利要求书的精神与范围内的所有变型、等同物以及替代方案。本文公开的任何方法不必以所列举的顺序来进行。本文公开的方法包括由实施者采取的某些行为;但是它们还可包括任何第三方对这些行为的指导,无论是以明示的方式还是以暗示的方式。例如,例如“沉积至少一个层”等动作包括“指导沉积至少一个层”。本文公开的范围还涵盖任何和所有重叠区、子范围及其组合。例如“不超过”、“至少”、“大于”、“小于”、“之间”等用语包括所列举的数字。前面加有术语“约”的数字包括所列举的数字。例如,“约10mm”包括“10mm”。前面加有术语例如“基本”的术语或短语包括所列举的术语或短语。例如,“基本平行”包括“平行”。
Claims (25)
1.一种将至少一个电极沉积于超声换能器的基础构件上的方法,所述方法包括:
使用清洁剂清洁基础构件,其中所述基础构件包含陶瓷;
使用第一腐蚀剂至少部分地腐蚀所述基础构件的表面,所述第一腐蚀剂包含四氟硼酸和乙酸盐的强酸溶液;
使用第一催化剂催化所述基础构件的表面;
使用化学电镀法在所述基础构件的表面上电镀铜,使得铜相邻地沉积在所述基础构件上;
检查在所述基础构件的表面上电镀的铜;
使用第二腐蚀剂至少部分地腐蚀镀有铜的表面,所述第二腐蚀剂包含硫酸溶液;
使用第二催化剂催化所述镀有铜的表面;
使用化学电镀法在所述镀有铜的表面上电镀镍;以及
在所述镀有镍的表面上沉积至少一个金层。
2.如权利要求1所述的方法,其中所述清洁剂包括脱脂剂和醇中的至少一种。
3.如权利要求1所述的方法,其中所述第一催化剂和所述第二催化剂中的至少一种包含钯。
4.如前述权利要求中任一项所述的方法,其中在所述基础构件的表面上电镀铜包括将所述基础构件放置于铜浴中。
5.如权利要求1所述的方法,其中检查在所述基础构件的表面上电镀的铜包括确认在所述基础构件上电镀的铜的厚度以及确认沿所述基础构件的镀层的均匀性中的至少一种。
6.如权利要求5所述的方法,其中,如果所述基础构件不满足所述检查的至少一个阈值要求,则所述方法还包括使用化学电镀法在所述基础构件的表面上重新镀铜。
7.如权利要求1-3、5和6中任一项所述的方法,其中所述第二催化剂包括硫酸根阴离子基溶液。
8.如权利要求1-3、5和6中任一项所述的方法,其中在镀有铜的表面上电镀锌包括将所述超声换能器放置于包含高-磷镍的浴液中。
9.如权利要求1所述的方法,其中在镀有镍的表面上沉积至少一个金层包括沿所述镀有镍的表面浸渍金的单层。
10.如权利要求1所述的方法,其中沿涂覆有镍的表面的金的厚度介于0.1至10微英寸之间。
11.如权利要求1所述的方法,其中沿涂覆有镍的表面的厚度为5微英寸。
12.如权利要求1-3、5、6和9-11中任一项所述的方法,其中沿所述基础构件的表面的铜的厚度介于10至25微英寸之间。
13.如权利要求1-3、5、6和9-11中任一项所述的方法,其中沿所述基础构件的表面的铜的厚度为15微英寸。
14.如权利要求1-3、5、6和9-11中任一项所述的方法,其中沿镀有铜的表面的镍的厚度介于100至200微英寸之间。
15.如权利要求1-3、5、6和9-11中任一项所述的方法,其中沿镀有铜的表面的镍的厚度为150微英寸。
16.如权利要求1-3、5、6和9-11中任一项所述的方法,其中沿所述基础构件的外表面和内表面沉积所述铜、镍和金。
17.如权利要求1-3、5、6和9-11中任一项所述的方法,其中所述基础构件包含压电陶瓷材料。
18.如权利要求1-3、5、6和9-11中任一项所述的方法,其中使用批方法在多个基础构件上沉积至少一个电极。
19.如权利要求18所述的方法,其中将所述基础构件布置于线支架上。
20.如权利要求19所述的方法,其中将所述基础构件布置于桶系统中。
21.如权利要求1-3、5、6、9-11、19和20中任一项所述的方法,其中从较大的块构件切取所述基础构件。
22.一种超声换能器,其包括使用权利要求1-3、5、6、9-11、19和20中任一项所述的方法沉积于所述换能器的基础构件上的电极。
23.如权利要求22所述的超声换能器,其中所述换能器包括圆柱形换能器。
24.如权利要求22所述的超声换能器,其中所述超声换能器具有非圆柱形状。
25.如权利要求24所述的超声换能器,其中所述超声换能器具有平的、凹的或凸的形状。
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US10230041B2 (en) | 2019-03-12 |
CN105074050A (zh) | 2015-11-18 |
EP2971232A1 (en) | 2016-01-20 |
JP2016514438A (ja) | 2016-05-19 |
JP6337080B2 (ja) | 2018-06-06 |
WO2014159273A1 (en) | 2014-10-02 |
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