CN104995277B - 研磨用组合物、研磨用组合物制造方法及研磨物制造方法 - Google Patents

研磨用组合物、研磨用组合物制造方法及研磨物制造方法 Download PDF

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Publication number
CN104995277B
CN104995277B CN201480008802.5A CN201480008802A CN104995277B CN 104995277 B CN104995277 B CN 104995277B CN 201480008802 A CN201480008802 A CN 201480008802A CN 104995277 B CN104995277 B CN 104995277B
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China
Prior art keywords
polishing
water
polymer
soluble polymer
composition
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CN201480008802.5A
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English (en)
Chinese (zh)
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CN104995277A (zh
Inventor
土屋公亮
丹所久典
浅田真希
须贺裕介
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Fujimi Inc
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Fujimi Inc
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201480008802.5A 2013-02-13 2014-02-10 研磨用组合物、研磨用组合物制造方法及研磨物制造方法 Active CN104995277B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-026020 2013-02-13
JP2013026020 2013-02-13
PCT/JP2014/053065 WO2014126051A1 (ja) 2013-02-13 2014-02-10 研磨用組成物、研磨用組成物製造方法および研磨物製造方法

Publications (2)

Publication Number Publication Date
CN104995277A CN104995277A (zh) 2015-10-21
CN104995277B true CN104995277B (zh) 2018-05-08

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CN201480008802.5A Active CN104995277B (zh) 2013-02-13 2014-02-10 研磨用组合物、研磨用组合物制造方法及研磨物制造方法

Country Status (8)

Country Link
US (1) US20150376464A1 (OSRAM)
EP (1) EP2957613B1 (OSRAM)
JP (2) JP5897200B2 (OSRAM)
KR (1) KR102226441B1 (OSRAM)
CN (1) CN104995277B (OSRAM)
SG (1) SG11201506001VA (OSRAM)
TW (1) TWI624536B (OSRAM)
WO (1) WO2014126051A1 (OSRAM)

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EP3967736B1 (en) 2013-03-19 2023-10-11 Fujimi Incorporated Polishing composition, method for producing polishing composition, and kit for preparing polishing composition
US10717899B2 (en) 2013-03-19 2020-07-21 Fujimi Incorporated Polishing composition, method for producing polishing composition and polishing composition preparation kit
JP6314019B2 (ja) * 2014-03-31 2018-04-18 ニッタ・ハース株式会社 半導体基板の研磨方法
JP6185432B2 (ja) 2014-06-24 2017-08-23 株式会社フジミインコーポレーテッド シリコンウェーハ研磨用組成物
US10179870B2 (en) * 2014-12-05 2019-01-15 3M Innovative Properties Company Abrasive composition
WO2016181888A1 (ja) * 2015-05-08 2016-11-17 株式会社フジミインコーポレーテッド 研磨用組成物
JP6582601B2 (ja) * 2015-06-22 2019-10-02 日立化成株式会社 研磨液、貯蔵液及び研磨方法
JP6797796B2 (ja) * 2015-07-01 2020-12-09 東亞合成株式会社 研磨用濡れ剤及び研磨液組成物
CN109476116B (zh) 2016-04-28 2021-07-16 自然工作有限责任公司 具有包含耐热聚合物层和聚丙交酯树脂层的多层片材的饰面的聚合物泡沫隔热结构
KR102394104B1 (ko) * 2016-09-28 2022-05-04 가부시키가이샤 후지미인코퍼레이티드 표면 처리 조성물
US20190270914A1 (en) * 2016-10-28 2019-09-05 Tokuyama Corporation Fumed silica and method for producing the same
JP6792413B2 (ja) * 2016-10-31 2020-11-25 花王株式会社 シリコンウェーハ用研磨液組成物
WO2018096991A1 (ja) * 2016-11-22 2018-05-31 株式会社フジミインコーポレーテッド 研磨用組成物
CN110177853A (zh) * 2017-02-20 2019-08-27 福吉米株式会社 硅基板中间研磨用组合物及硅基板研磨用组合物套组
JP6879798B2 (ja) * 2017-03-30 2021-06-02 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
JP7074525B2 (ja) * 2017-03-30 2022-05-24 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
WO2018180479A1 (ja) * 2017-03-31 2018-10-04 株式会社フジミインコーポレーテッド 研磨用組成物
JP7148506B2 (ja) * 2017-05-26 2022-10-05 株式会社フジミインコーポレーテッド 研磨用組成物およびこれを用いた研磨方法
EP3410236B1 (fr) * 2017-05-29 2021-02-17 The Swatch Group Research and Development Ltd Dispositif et procede d'ajustement de marche et correction d'etat d'une montre
CN117020927A (zh) * 2017-07-21 2023-11-10 福吉米株式会社 基板的研磨方法及研磨用组合物套组
KR102399744B1 (ko) * 2017-08-14 2022-05-18 쇼와덴코머티리얼즈가부시끼가이샤 연마액, 연마액 세트 및 연마 방법
JP6929239B2 (ja) * 2018-03-30 2021-09-01 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
EP3819353A4 (en) * 2018-07-04 2022-03-30 Sumitomo Seika Chemicals Co., Ltd. POLISHING COMPOSITION
JP7424768B2 (ja) * 2019-08-08 2024-01-30 株式会社フジミインコーポレーテッド 研磨用添加剤含有液の濾過方法、研磨用添加剤含有液、研磨用組成物、研磨用組成物の製造方法およびフィルタ
EP3792327B1 (en) * 2019-09-11 2025-05-28 Fujimi Incorporated Polishing composition, polishing method and method for manufacturing semiconductor substrate
US20230143074A1 (en) * 2020-03-13 2023-05-11 Fujimi Incorporated Polishing composition and polishing method
CN112175524B (zh) * 2020-09-21 2022-02-15 万华化学集团电子材料有限公司 一种蓝宝石抛光组合物及其应用
KR102492236B1 (ko) * 2020-12-17 2023-01-26 에스케이실트론 주식회사 연마장치 및 웨이퍼의 연마방법
CN118985038A (zh) 2022-03-23 2024-11-19 福吉米株式会社 研磨用组合物

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Also Published As

Publication number Publication date
US20150376464A1 (en) 2015-12-31
KR102226441B1 (ko) 2021-03-12
EP2957613A1 (en) 2015-12-23
WO2014126051A1 (ja) 2014-08-21
CN104995277A (zh) 2015-10-21
TW201443212A (zh) 2014-11-16
JP2016138278A (ja) 2016-08-04
EP2957613A4 (en) 2016-11-09
EP2957613B1 (en) 2020-11-18
KR20150119062A (ko) 2015-10-23
SG11201506001VA (en) 2015-09-29
JP5897200B2 (ja) 2016-03-30
JPWO2014126051A1 (ja) 2017-02-02
JP6387032B2 (ja) 2018-09-05
TWI624536B (zh) 2018-05-21

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