CN104646385B - 折皱机构和具备该折皱机构的基板切断装置及装置 - Google Patents

折皱机构和具备该折皱机构的基板切断装置及装置 Download PDF

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Publication number
CN104646385B
CN104646385B CN201410538238.XA CN201410538238A CN104646385B CN 104646385 B CN104646385 B CN 104646385B CN 201410538238 A CN201410538238 A CN 201410538238A CN 104646385 B CN104646385 B CN 104646385B
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Chinese (zh)
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CN104646385A (zh
Inventor
东秀和
山本雅之
新田法
新田一法
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Towa Corp
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Towa Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/08—Protective coverings for parts of machine tools; Splash guards
    • B23Q11/0816—Foldable coverings, e.g. bellows
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/08—Protective coverings for parts of machine tools; Splash guards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Dicing (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Diaphragms And Bellows (AREA)
CN201410538238.XA 2013-11-25 2014-10-13 折皱机构和具备该折皱机构的基板切断装置及装置 Active CN104646385B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013242692A JP5918197B2 (ja) 2013-11-25 2013-11-25 蛇腹機構並びにそれを備えた基板切断装置及び装置
JP2013-242692 2013-11-25

Publications (2)

Publication Number Publication Date
CN104646385A CN104646385A (zh) 2015-05-27
CN104646385B true CN104646385B (zh) 2016-10-19

Family

ID=53238312

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410538238.XA Active CN104646385B (zh) 2013-11-25 2014-10-13 折皱机构和具备该折皱机构的基板切断装置及装置

Country Status (4)

Country Link
JP (1) JP5918197B2 (ko)
KR (1) KR101692113B1 (ko)
CN (1) CN104646385B (ko)
TW (1) TW201524663A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110480411B (zh) * 2019-09-18 2024-03-29 河北速博机械制造有限公司 伸缩位移限制装置、鳞片伸缩护罩及机床
CN110449975B (zh) * 2019-09-18 2024-03-08 河北速博机械制造有限公司 鳞片固定结构、伸缩护罩及机床

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4212186B2 (ja) * 1999-06-03 2009-01-21 株式会社ナベル 工業用蛇腹
CN201988996U (zh) * 2011-01-31 2011-09-28 李寿鹏 “回”字型防护罩
CN202934401U (zh) * 2012-10-19 2013-05-15 恽建军 散热机床防护罩
CN103381562A (zh) * 2012-05-05 2013-11-06 文静 一种数控机床液压缸柔性保护罩

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1121967B (de) * 1956-08-24 1962-01-11 Arno Arnold Harmonikaartig faltbare Abdeckung fuer Werkzeugmaschinen, insbesondere fuer Schleifmaschinen
DE1213676B (de) * 1962-05-16 1966-03-31 Arnold Hennig Faltenbalg, bei welchem an den Innenflaechen der Balgfalten quer zur Balglaengsrichtung sich erstreckende Verstaerkungsstreifen angebracht sind
DE8331544U1 (de) * 1983-11-03 1985-07-11 Hema Maschinen- Und Apparateschutz Gmbh, 6453 Seligenstadt Schutzabdeckung für Teile an Maschinen
CH666732A5 (de) * 1984-07-11 1988-08-15 Gebr Hennig Gmbh Faltenbalg.
DE3532702C2 (de) * 1985-09-13 1993-10-07 Arno Arnold Gmbh Faltenbalgen für die Abdeckung von Maschinenteilen
JP3103961B2 (ja) * 1993-10-20 2000-10-30 株式会社ナベル 蛇腹製造法
JPH07156039A (ja) 1993-11-30 1995-06-20 Disco Abrasive Syst Ltd 切削装置のジャバラ機構
DE4431452C2 (de) * 1994-09-03 1998-04-09 Moeller Werke Gmbh Faltenbalg zur Abdeckung von Führungsbahnen
JP3049959U (ja) * 1996-12-20 1998-06-30 日本ジャバラ工業株式会社 扇形布製ジャバラ
JP3848715B2 (ja) * 1997-01-14 2006-11-22 株式会社ディスコ ジャバラ機構
JP4205249B2 (ja) * 1999-04-26 2009-01-07 株式会社ナベル 蛇腹
JP2002066866A (ja) * 2000-09-04 2002-03-05 Disco Abrasive Syst Ltd ジャバラ装置
JP4988413B2 (ja) * 2007-04-16 2012-08-01 株式会社ナベル 廃液飛散防止用蛇腹装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4212186B2 (ja) * 1999-06-03 2009-01-21 株式会社ナベル 工業用蛇腹
CN201988996U (zh) * 2011-01-31 2011-09-28 李寿鹏 “回”字型防护罩
CN103381562A (zh) * 2012-05-05 2013-11-06 文静 一种数控机床液压缸柔性保护罩
CN202934401U (zh) * 2012-10-19 2013-05-15 恽建军 散热机床防护罩

Also Published As

Publication number Publication date
KR101692113B1 (ko) 2017-01-02
JP2015100875A (ja) 2015-06-04
KR20150060523A (ko) 2015-06-03
JP5918197B2 (ja) 2016-05-18
TWI562853B (ko) 2016-12-21
TW201524663A (zh) 2015-07-01
CN104646385A (zh) 2015-05-27

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