CN104465580B - 半导体封装 - Google Patents

半导体封装 Download PDF

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Publication number
CN104465580B
CN104465580B CN201410471924.XA CN201410471924A CN104465580B CN 104465580 B CN104465580 B CN 104465580B CN 201410471924 A CN201410471924 A CN 201410471924A CN 104465580 B CN104465580 B CN 104465580B
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China
Prior art keywords
metal
semiconductor packages
package
packages according
solder
Prior art date
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CN201410471924.XA
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English (en)
Chinese (zh)
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CN104465580A (zh
Inventor
金东先
柳盛旭
李知行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
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LG Innotek Co Ltd
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Filing date
Publication date
Priority claimed from KR1020130110974A external-priority patent/KR102109042B1/ko
Priority claimed from KR1020130115332A external-priority patent/KR102093927B1/ko
Priority claimed from KR1020130115333A external-priority patent/KR102091619B1/ko
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of CN104465580A publication Critical patent/CN104465580A/zh
Application granted granted Critical
Publication of CN104465580B publication Critical patent/CN104465580B/zh
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    • H—ELECTRICITY
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
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    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • H01L25/105—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
CN201410471924.XA 2013-09-16 2014-09-16 半导体封装 Active CN104465580B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2013-0110974 2013-09-16
KR1020130110974A KR102109042B1 (ko) 2013-09-16 2013-09-16 반도체 패키지
KR10-2013-0115332 2013-09-27
KR1020130115332A KR102093927B1 (ko) 2013-09-27 2013-09-27 반도체 패키지
KR1020130115333A KR102091619B1 (ko) 2013-09-27 2013-09-27 반도체 패키지
KR10-2013-0115333 2013-09-27

Publications (2)

Publication Number Publication Date
CN104465580A CN104465580A (zh) 2015-03-25
CN104465580B true CN104465580B (zh) 2017-08-04

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Country Link
US (1) US9252112B2 (enExample)
EP (1) EP2849226B1 (enExample)
JP (1) JP6419500B2 (enExample)
CN (1) CN104465580B (enExample)
TW (1) TWI646639B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI517269B (zh) * 2013-09-27 2016-01-11 矽品精密工業股份有限公司 層疊式封裝結構及其製法
KR102152865B1 (ko) * 2014-02-06 2020-09-07 엘지이노텍 주식회사 인쇄회로기판, 이를 포함하는 패키지 기판 및 이의 제조 방법
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