CN104221145A - 具有配置为模块的多级引线框的封装半导体器件 - Google Patents
具有配置为模块的多级引线框的封装半导体器件 Download PDFInfo
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Abstract
一种半导体系统(100)具有第一平面引线框(101),所述第一平面引线框(101)具有第一引线(102)和焊盘(103),所述焊盘(103)附接有电子部件(120),该第一引线框包括以远离第一引线框的平面的角度弯曲的一组细长引线(104);具有第二引线(112)和焊盘(113)的第二平面引线框(110),所述焊盘(113)附接有电子部件(114);第一引线框的弯曲引线导电连接到第二引线框,在两个平面中的部件和引线之间形成导电链接的三维网络;以及密封三维网络的封装材料(140)。
Description
技术领域
本发明一般涉及半导体器件和工艺领域,更具体地涉及具有互连模块化多级引线框的电子系统的结构和制造方法。
背景技术
在半导体技术的长期趋势中,持续不减退的是微型化、集成和速度的趋势。除这些趋势外,近年已出现满足产品定制的更大灵活性和减少将这些产品投放市场所需时间的新兴产品需求。具体产品例子可说明这些需求。
商业应用(例如电信、家用音频和调节器产品)中的电子产品经常需要能够切换电源、调节并稳定电压以及充当从一个DC电压转换到另一个DC电压的变换器的系统。这些系统不仅需要具有高效率以适当操作,而且优选也应该具有微小的横向和厚度尺寸,并需要非常低的成本。
受欢迎的电力开关系统包括具有约10mm到20mm尺寸的金属引线框,多个分立电子部件作为单元装配并二次成型到该金属引线框上。二次成型的电力系统的高度目前在2mm和3mm之间。电源的部件可包括半桥(或电力块);各种电阻器和电容器;以及用于能量存储的封装负载电感器。在操作中,部件必须通过有效地分散热至散热器来保持冷却以使它们能够快速切换(快速瞬态响应)。
半桥(或电力块)的部件可包括具有低电阻和大电流处理能力的两个MOS场效应晶体管(FET),其串联连接并由共用开关节点耦合在一起;进一步包括各种电阻器和电容器;以及用于能量存储的封装负载电感器。在添加调节驱动器时,该组件被称为电力级或同步降压变换器。在同步降压变换器中,也称为高压侧开关的控制FET芯片连接在电源电压VIN和LC输出滤波器之间,并且也被称为低压侧开关的同步(sync)FET芯片连接在LC输出滤波器和地电位之间。控制FET芯片和同步FET芯片的栅极连接到半导体芯片,其包括用于变换器的驱动器和控制器的电路;该芯片也连接到地电位。
电源组件的开关节点连接到用作电源电路的能量存储的输出负载电感器;该电感器必须足够大以可靠运作,从而维持恒定输出电压。常规封装电感器包括包覆铜线的螺旋配置的线圈,其焊接到镀铜引线框并成型为磁性铁氧体材料。电感器由长方体形封装复合物密封。由于其大小,因此相对于引线框和后续的印刷电路板(PCB)的体积和基板面消耗,封装负载电感器是电源组件的主要部件。即使电感器和FET之间紧密靠近并且存在连接到电路电容器的迹线,这必然引入寄生电阻和电感。
具有更大的灵活性以满足不同电力输入和不同电力输出的客户需求并在快速周转时间中完成修改是有利的。
具有消耗板空间的较少基板面并因此节省成品的珍贵大小的电力变换器的组件是有利的。
减少制造成本同时满足上述目标是有利的。
发明内容
垂直堆叠器件内的低成本垂直电气互连的问题在采用两个平面引线框的器件结构中解决,其中第一引线框包括第一组细长引线,其远离引线框的平面弯曲以使它们能够导电连接到第二引线框。另外,第一引线框能够经构造以使其能够被预装配为模块,其中附接部件能够很容易地根据客户规格改变;模块可具有与器件相同的占位面积(footprint)但提供不同内容。
远离引线框的平面弯曲引线的概念能够扩展以包括第一引线框的第二组细长引线,其在与第一组引线的方向相反的方向上在远离引线框的平面的方向上弯曲。第二组引线允许到具有焊盘的第三平面引线框的导电连接,该焊盘附接有电子部件。
一个示例描述实施例是具有两个垂直堆叠平面QFN型(四方扁平无引线)引线框的封装器件。第一引线框具有用于附接电阻器、电容器和大体积密封电感器的焊盘。除了引线框的平面中的标准QFN型引线之外,第一引线框具有在远离引线框的平面的方向上弯曲的一组细长引线。弯曲引线适于导电连接(例如通过焊接)到第二引线框。第二平面引线框具有附接半导体芯片、电阻器和电容器的焊盘。引线框具有QFN引线;在一些器件中,其也可具有悬臂型引线。在将第一引线框的弯曲引线导电附接到第二引线框的工艺之后,装配的器件在封装材料中密封。
另一描述实施例是制造基于垂直堆叠引线框的半导体器件的方法。作为临时步骤,该方法产生能够根据将来的客户规定容易修改的模块的组装。在第一平面引线框的焊盘上,组装电子部件,尤其是大体积且主要的零件,例如电感器。第一引线框包括第一组细长引线,其在远离第一引线框的平面的第一方向上弯曲。在第二平面引线框的焊盘上,组装电子部件,尤其是具有或没有封装的半导体芯片。组装的第一引线框与组装的第二引线框对齐,以使第一引线框的弯曲细长的第一组引线与第二引线框接触。细长的第一组引线优选通过焊接导电连接到第二引线框,由此产生部件和引线的三维导电链接网络。
附图说明
图1示出具有配置为模块的多级平面引线框的封装半导体器件的透视图,其中一个平面引线框的弯曲引线提供连接到另一个平面引线框。
图2到图6示出用于制造具有两个平面引线框的示例封装半导体器件的工艺流程的步骤,该两个平面引线框被配置为模块并三维互连。
图2示出第一平面引线框的条带的一部分的透视图,其中单元具有在远离第一引线框的平面的第一方向上弯曲的第一组细长引线。
图3A示出附接有电气部件的图2的引线框条带的透视图,每个单元代表模块。
图3B示出附接有电气部件的第一平面引线框的另一部分的透视图,强调的是在远离第一引线框的平面的第一方向上弯曲的第一组细长引线。
图4示出具有焊盘的第二平面引线框的条带的一部分的透视图,该焊盘适于附接封装电子部件。
图5示出附接有电气部件的图4的引线框条带的透视图,每个单元代表模块。
图6示出将组装的第一引线框与组装的第二引线框对齐,以使第一引线框的弯曲细长引线与第二引线框接触的工艺步骤。
图7示出另一个第一平面引线框的条带的一部分的透视图,其中单元具有在远离第一引线框的平面的第一方向上弯曲的第一组细长引线,以及在远离第一引线框的平面的第二方向上弯曲的第二组细长引线。
图8示出具有配置为模块的多级平面引线框的封装半导体器件的透视图,其中由两个平面引线框提供的弯曲引线建立从一个平面引线框到另一个平面引线框的连接。
图9示出模块的透视图,其中一个引线框的弯曲引线被用作散热器。
图10示出具有配置为模块的三个平面引线框的封装半导体器件的透视图,其中由每个平面引线框提供的弯曲引线建立从一个平面引线框到另一个平面引线框的连接。
具体实施方式
图1示出一种示例封装电子系统(一般指定为100)。该系统基于两个QFN/SON型平面金属引线框;第一平面引线框指定为101,第二平面引线框指定为110。两个引线框都包括用于附接部件的焊盘和用于互连的引线。两个引线框都由金属板(优选厚度范围约100μm到250μm)蚀刻或冲压而成。优选金属包括,但不限于,铜、铜合金、铁-镍合金、铝和KovarTM材料。第一引线框的金属称为第一金属,并且第二引线框的金属称为第二金属。对于封装系统的一些应用,第二引线框的金属可选择与第一金属不同的金属是技术优点。进一步地,第二引线框的金属厚度可与第一引线框的金属厚度相同,或其可被选择为不同。
在图1所示的示例器件中,第一平面引线框101具有第一引线102和第一焊盘103。焊盘经设计以使它们适于附接电子部件;图1示出由夹片(clip)121将大体积的电感器120附接到焊盘103。其他器件可具有焊盘,其被设计用于附接一个或更多个部件、微小大小或大体积的,包括封装和未封装无源和有源部件(例如电阻器、电容器和半导体芯片)的焊盘。由于最终接近外部散热器(所述外部散热器可附接到封装材料或甚至是部件表面),因此第一引线框尤其适于承载生热部件是技术优点。第一引线框的焊盘可由引线互连。结果,第一引线框101可配置为能够被制作为自包含(self-contained)单元的子组件或模块。
另外,平面第一引线框101包括在远离第一引线框101的平面的方向上弯曲的一组细长引线104。如图7所示,由于引线框101可包括在不同方向上弯曲的额外的引线组,因此该组细长引线104在此称为第一组,并且弯曲引线的方向在此称为第一方向。如下讨论,第一组引线的取向通过弯曲或形成工艺获得,该工艺通过在制造引线框的阶段中作用在细长引线上的外力完成。
在图1所示的实施例中,如一般对于四方扁平无引线(QFN)和小外型无引线(SON)器件,第二引线框110没有成形为从器件封装件突起的悬臂的金属第二引线;相反,用于电气连接并用于板附接(通过压力或焊接)的金属触点由扁平金属端子111提供。如图1所述,成形为扁平端子的引线末端111沿引线框110外围排列。第二引线框110进一步具有用于在引线框内互连的第二引线112,以及适于支持附接电子部件的多个焊盘113(在图4中更详细示出)。图1示作封装半导体芯片114的部件与一些封装或未封装无源部件115(例如电阻器和电容器)的示例。结果,第二引线框110配置为能够被制作为自包含单元的模块。
图1示出第一引线框101的弯曲细长引线104由连接材料130导电连接到第二引线框110。优选连接材料是焊料;其他材料包括银填充环氧树脂和z轴线导电粘合剂。由于平面引线框101和110之间的导电连接,因此弯曲引线104使得能够在由设计为模块的两个平面引线框限定的两个平面中的部件和引线之间形成导电链接的三维网络。
如图1进一步所示,电子系统100包括聚合物材料制成的封装件140,其密封三维网络并留下第一和第二引线的部分,例如扁平端子111的一个表面,未密封因此可操作为系统100的电子器件端子和触点。结果,系统100的封装件140成形为长方体,其具有提供系统端子的第二引线111的表面。
图1表明第一引线框101的一些引线末端105在从条带切割单元之后从密封材料暴露。引线末端105因此可作为定位在与第二引线框引线111的平面不同的平面中的器件端子操作。器件端子在器件密封的不同平面中的可能性对于某些产品应用表现技术优点。
如所提及的,第一和第二引线框优选用扁平金属板制造。图2到6示出用于制造具有两个平面引线框的示例封装半导体器件的工艺流程的步骤,该两个平面引线框配置为模块并三维互连。一个示例性第一平面引线框101的条带在图2中示出。图解示出第一引线102、第一焊盘103和细长引线104的例子。作为一组(称为第一组)细长引线104在远离扁平第一引线框的原平面的第一方向上弯曲。弯曲或形成工艺通过作用在扁平细长引线上的外力完成。当条带在水平面上被夹紧时,力施加到第一组的引线以便将它们挤压到期望方向。细长引线必须通过拉伸来吸收该力。所施加的力在长度方向上拉伸引线,而宽度尺寸仅稍微减小,以使新的形状出现一些额外细长。与原长度相比,额外细长较小并且达到一定极限,其被称为材料特性给予的弹性极限,额外细长量与力线性成比例。强制拉伸能够覆盖浅角度(约30°或更小)。必要时,能够采用约40°或更小的角度处的多步配置以覆盖更宽距离。对于边侧的益处,这些配置在转移已成型的塑料封装件中增强塑料对引线框的锁模。
图3A和3B示出第一平面引线框101的条带,示出将示例部件附接到包括多个模块位点的第一引线框条带的焊盘上的工艺步骤。第一引线框101的平面在图3B中由引线框的扁平框301强调。在图3A中,密封在其自己的外壳中的电感器120借助夹紧装置121附接到第一焊盘103;在图3B中,额外部件(例如电容器115)被添加到电感器。附接的优选方法是焊接;一种可替换方法使用导电粘合剂。附接部件的工艺步骤能够在分离组装点执行,并产生能够运送到另一组装点以便进一步加工的自包含模块。图3A和3B示出在远离第一引线框条带的平面的第一方向上弯曲的第一组细长引线104。
示例第二平面引线框110的条带在图4中示出。该图解示出端子111、第二引线112和第二焊盘113的例子。在图4的示例中,没有引线在远离第二引线框110的平面的方向上弯曲;然而,对于其他应用(同样见于图8),第二引线框110可包括以远离第二引线框110的平面的角度弯曲的一个或更多个细长引线或一组细长引线。频繁使用的应用包括细长引线,其能够弯曲作为悬臂,用于表面安装附接到电路板。
图5示出第二平面引线框110的条带,示出将示例部件附接到包括多个模块位点的图4的第二引线框条带的焊盘上的工艺步骤。在图5中,密封在其自己的外壳中的半导体芯片114和多个额外部件(例如电容器和电阻器)附接到第二引线框条带110。附接的优选方法是焊接;一种可替换方法使用导电粘合剂。附接部件的工艺步骤能够在分离的组装点执行,并产生能够运送到另一组装点以便进一步加工的自包含模块。
由箭头600示出,图6示出将第一引线框101的组装条带与第二引线框110的组装条带对齐,以便使第一引线框101的该组弯曲细长的第一引线104与第二引线框110接触的工艺步骤。
在下一个工艺步骤中,第一引线框101的该组弯曲细长的第一引线104导电连接到第二引线框110。优选连接材料是焊料;其他材料包括银填充环氧树脂和导电粘合剂(例如z轴线导电粘合剂)。由于平面引线框101和110之间的导电连接,因此弯曲引线104使得能够在设计为模块的两个平面引线框限定的两个平面中的部件和引线之间形成导电链接的三维网络。
在下一个工艺步骤中,三维网络密封在封装复合物中。一种优选方法是使用填充有无机填料微粒的基于环氧树脂的成型复合物的传递成型技术。如上陈述,作为器件端子的金属零件保持不密封。对于一些产品应用,完全密封附接到第一引线框的部件是必要的;对于其他产品,至少让主要部件(例如在图1中所示的电感器)的顶部表面不密封以使散热器能够被附接是技术优点。
各种不同环境中迅速增加产品应用,例如与手持产品的无线通信和具有温度陡峭摆动的自动控制中,需要修改具有多级引线框的模块概念。图7到10示出引线框变体的一些示例,其被发现对这些应用中的一些是有用的。图7示出平面引线框701的示例(由扁平组件焊盘指示的平面),其不仅具有在远离引线框701的平面的第一方向上弯曲的第一组细长引线704,而且具有在远离引线框701的平面的第二方向上弯曲的第二组细长引线750。第二方向与第一方向大致相反,这取决于弯曲角度。在与图1的系统相似的系统中使用引线框701作为替代引线框101的第一引线框允许新形成的替换性封装器件获得对另一平面的接入,该另一平面可用于额外器件功能,例如另一个集成电路芯片或无源散热器。
设计用于在电子部件之间建立三维网络800的平面引线框的另一示例在图8中示出。第一引线框801具有在远离第一引线框的平面的第一方向上弯曲的第一组细长引线804。如图所示,这些引线804用来将在第一引线框801和第二引线框810上组装的部件(图8中未示出)导电互连。另外,第二平面引线框810具有在远离第二引线框的平面的第二方向上弯曲的第二组细长引线814。在图8的示例中,第二方向在与第一方向相同的方向上。因此,引线814支持在第一引线框801和第二引线框810上组装的部件的导电互连。
图9示出一种示例第一引线框901,其不仅具有弯曲引线904以连接到第二引线框910,而且也经设计具有焊盘和细长引线,该细长引线具有适合于分散热能以便散热的几何形状。在图9中,用于附接电感器920的焊盘中的一个拓宽至区域950,该区域950延伸穿过长方体形封装的侧表面的主要部分,并旨在保持不被器件封装件密封(图9中未示出)。因此,区域950可用于辐射出热能或用于附接散热器。另外,图9示出到延伸穿过长方体形封装的另一表面的另一冷却区域951的电位连接951a;区域951也可用于辐射出热能或用于附接散热器。
图10示出具有配置为模块的多级引线框的另一示例器件1000。除第一平面引线框1001和第二平面引线框1010之外,器件1000包括具有用于附接电子部件1020的焊盘的第三平面引线框1060。如图10示出,第三引线框1060由弯曲细长引线1064导电连接到第二引线框1010,并由弯曲细长引线1065导电连接到第一引线框1001。第一引线框1001具有引线1002,并且第三引线框1060具有引线1062,这些引线不仅可用于在它们各自的引线框内互连,而且可用于最终由密封封装件暴露。引线1002和1062因此适于联结到外部电气端子。
本发明应用于引线框上组装的任何数目的部件,其中的部件为较大和微小大小、封装和未封装部件的任何组合。该方法能够扩展到具有弯曲引线的任何数目的引线框,以使引线框能够垂直堆叠以接触定位堆叠下面或顶部上的平行引线框和部件。当器件密封在封装材料中时,多个引线框的一些引线能够保持暴露。暴露的引线可提供从封装堆叠的各种侧面到堆叠系统的电气接入。同样,由于许多引线和焊盘能够经设计用于散热,因此热能能够从各级组装堆叠耗散,优化系统的热特性。
本领域技术人员应认识到许多其他实施例和变化在所要求保护的发明的范围内是可能的。
Claims (18)
1.一种半导体器件,包括:
第一平面引线框,其具有第一引线和焊盘,所述焊盘附接有电子部件,所述第一引线框包括在远离所述第一引线框的平面的第一方向上弯曲的第一组细长引线;
第二平面引线框,其具有第二引线和焊盘,所述焊盘附接有电子部件;
所述第一引线框的弯曲引线导电连接到所述第二引线框,在两个平面中的部件和引线之间形成导电链接的三维网络;以及
封装材料,其密封所述三维网络。
2.根据权利要求1所述的器件,其中所述第一和第二引线的至少部分未由所述封装材料密封,所述未封装引线部分可操作为电气器件端子。
3.根据权利要求2所述的器件,其中所述端子定位在所述器件密封的多于一个平面中。
4.根据权利要求1所述的器件,进一步包括所述第一引线框的第二组细长引线,所述第二组引线在远离所述第一引线框的平面的第二方向上弯曲,所述第二方向与所述第一方向相反。
5.根据权利要求2所述的器件,进一步包括具有焊盘的第三平面引线框,所述焊盘附接有电子部件,所述第三引线框由第三组弯曲的细长引线导电连接到所述第二引线框。
6.根据权利要求1所述的器件,其中所述第一引线框由第一金属制成,并且所述第二引线框由不同于所述第一金属的第二金属制成。
7.根据权利要求1所述的器件,其中所述细长引线具有适于扩散并消散热的几何形状。
8.根据权利要求1所述的器件,其中所述第一引线框的引线适于联结到外部电气端子。
9.根据权利要求4所述的器件,其中所述第三引线框的引线适于联结到外部电气端子。
10.根据权利要求1所述的器件,其中所述电子部件包括封装和未封装的有源和无源半导体部件,包括产热部件。
11.根据权利要求10所述的器件,其中所述无源部件包括电感器、电容器和电阻器。
12.根据权利要求1所述的器件,其中所述第一引线框配置为模块组件。
13.根据权利要求1所述的器件,其中所述封装材料经配置以允许附接散热器。
14.一种制造封装半导体器件的方法,包括以下步骤:
提供具有装配在引线框焊盘上的电子部件的第一平面引线框,所述第一引线框包括在远离所述第一引线框的平面的第一方向上弯曲的第一组细长引线;
提供具有装配在所述引线框焊盘上的电子部件的第二平面引线框;
将所述装配的第一引线框与所述装配的第二引线框对齐,以使所述第一引线框的弯曲细长的第一组引线与所述第二引线框接触;以及
将所述细长的第一组引线导电连接到所述第二引线框,由此建立部件和引线的三维导电链接的网络。
15.根据权利要求14所述的方法,进一步包括以封装材料密封所述三维网络的步骤。
16.根据权利要求15所述的方法,其中所述第一平面引线框进一步包括第二组细长引线,所述第二组引线在远离所述第一引线框的平面的第二方向上弯曲,所述第二方向与所述第一方向相反。
17.根据权利要求16所述的方法,进一步包括以下步骤:
在第三平面引线框的焊盘上提供电子部件的装配;
将所述装配的第三引线框与所述装配的第一引线框对齐,以使所述第二组弯曲细长引线与所述第三引线框接触;以及
将所述细长的第二组引线焊接到所述第三引线框。
18.根据权利要求14所述的方法,其中所述电子部件包括封装和未封装的有源和无源半导体部件。
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PCT/US2013/033728 WO2013142867A1 (en) | 2012-03-23 | 2013-03-25 | Packaged semiconductor device having multilevel leadframes configured as modules |
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US20150099329A1 (en) | 2015-04-09 |
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