GB2603920B - Power Semiconductor package - Google Patents

Power Semiconductor package Download PDF

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Publication number
GB2603920B
GB2603920B GB2102295.9A GB202102295A GB2603920B GB 2603920 B GB2603920 B GB 2603920B GB 202102295 A GB202102295 A GB 202102295A GB 2603920 B GB2603920 B GB 2603920B
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United Kingdom
Prior art keywords
semiconductor package
power semiconductor
package
power
semiconductor
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Application number
GB2102295.9A
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GB202102295D0 (en
GB2603920A (en
Inventor
Li Yun
Arcillas Joseph
Du Yuekang
Ma Alina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhuzhou CRRC Times Electric UK Innovation Center
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Zhuzhou CRRC Times Electric UK Innovation Center
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Priority to GB2102295.9A priority Critical patent/GB2603920B/en
Publication of GB202102295D0 publication Critical patent/GB202102295D0/en
Publication of GB2603920A publication Critical patent/GB2603920A/en
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    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB2102295.9A 2021-02-18 2021-02-18 Power Semiconductor package Active GB2603920B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6737750B1 (en) * 2001-12-07 2004-05-18 Amkor Technology, Inc. Structures for improving heat dissipation in stacked semiconductor packages
US20040183180A1 (en) * 2003-03-21 2004-09-23 Advanced Semiconductor Engineering, Inc. Multi-chips stacked package
US20130249051A1 (en) * 2012-03-23 2013-09-26 Texas Instruments Incorporated Packaged Semiconductor Device Having Multilevel Leadframes Configured as Modules
US20180350714A1 (en) * 2015-12-09 2018-12-06 Hyundai Motor Company Power module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6737750B1 (en) * 2001-12-07 2004-05-18 Amkor Technology, Inc. Structures for improving heat dissipation in stacked semiconductor packages
US20040183180A1 (en) * 2003-03-21 2004-09-23 Advanced Semiconductor Engineering, Inc. Multi-chips stacked package
US20130249051A1 (en) * 2012-03-23 2013-09-26 Texas Instruments Incorporated Packaged Semiconductor Device Having Multilevel Leadframes Configured as Modules
US20180350714A1 (en) * 2015-12-09 2018-12-06 Hyundai Motor Company Power module

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