CN104205808B - 摄像装置以及摄像元件 - Google Patents
摄像装置以及摄像元件 Download PDFInfo
- Publication number
- CN104205808B CN104205808B CN201380017868.6A CN201380017868A CN104205808B CN 104205808 B CN104205808 B CN 104205808B CN 201380017868 A CN201380017868 A CN 201380017868A CN 104205808 B CN104205808 B CN 104205808B
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- 238000003384 imaging method Methods 0.000 claims abstract description 41
- 230000000295 complement effect Effects 0.000 claims abstract description 15
- 238000001514 detection method Methods 0.000 abstract description 39
- 210000001747 pupil Anatomy 0.000 abstract description 17
- 230000003287 optical effect Effects 0.000 abstract description 16
- 230000003595 spectral effect Effects 0.000 abstract description 15
- 230000035945 sensitivity Effects 0.000 abstract description 13
- 230000004907 flux Effects 0.000 abstract description 9
- 238000006243 chemical reaction Methods 0.000 description 73
- 238000012545 processing Methods 0.000 description 63
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 37
- 238000000034 method Methods 0.000 description 37
- 238000010586 diagram Methods 0.000 description 24
- 108010076504 Protein Sorting Signals Proteins 0.000 description 16
- 238000012986 modification Methods 0.000 description 11
- 230000004048 modification Effects 0.000 description 11
- 239000004973 liquid crystal related substance Substances 0.000 description 10
- 238000012546 transfer Methods 0.000 description 9
- 238000009792 diffusion process Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
- H01L27/14607—Geometry of the photosensitive area
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/28—Systems for automatic generation of focusing signals
- G02B7/34—Systems for automatic generation of focusing signals using different areas in a pupil plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
- H04N23/672—Focus control based on electronic image sensor signals based on the phase difference signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/80—Camera processing pipelines; Components thereof
- H04N23/84—Camera processing pipelines; Components thereof for processing colour signals
- H04N23/843—Demosaicing, e.g. interpolating colour pixel values
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
- H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
- H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/702—SSIS architectures characterised by non-identical, non-equidistant or non-planar pixel layout
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Automatic Focus Adjustment (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Focusing (AREA)
- Color Television Image Signal Generators (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010418828.4A CN111711746A (zh) | 2012-03-30 | 2013-03-29 | 摄像装置以及摄像元件 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-081165 | 2012-03-30 | ||
JP2012081165 | 2012-03-30 | ||
PCT/JP2013/059621 WO2013147198A1 (ja) | 2012-03-30 | 2013-03-29 | 撮像装置および撮像素子 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010418828.4A Division CN111711746A (zh) | 2012-03-30 | 2013-03-29 | 摄像装置以及摄像元件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104205808A CN104205808A (zh) | 2014-12-10 |
CN104205808B true CN104205808B (zh) | 2020-06-05 |
Family
ID=49260439
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010418828.4A Pending CN111711746A (zh) | 2012-03-30 | 2013-03-29 | 摄像装置以及摄像元件 |
CN201380017868.6A Active CN104205808B (zh) | 2012-03-30 | 2013-03-29 | 摄像装置以及摄像元件 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010418828.4A Pending CN111711746A (zh) | 2012-03-30 | 2013-03-29 | 摄像装置以及摄像元件 |
Country Status (5)
Country | Link |
---|---|
US (4) | US9826183B2 (ja) |
EP (1) | EP2835965B1 (ja) |
JP (3) | JP6264284B2 (ja) |
CN (2) | CN111711746A (ja) |
WO (1) | WO2013147198A1 (ja) |
Families Citing this family (24)
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US9826183B2 (en) * | 2012-03-30 | 2017-11-21 | Nikon Corporation | Image-capturing device and image sensor |
US20150062391A1 (en) * | 2012-03-30 | 2015-03-05 | Nikon Corporation | Image sensor, photographing method, and image-capturing device |
JP5778873B2 (ja) * | 2012-12-07 | 2015-09-16 | 富士フイルム株式会社 | 画像処理装置、画像処理方法及びプログラム、並びに記録媒体 |
TWI620445B (zh) | 2013-03-25 | 2018-04-01 | Sony Corp | 攝像元件及電子機器 |
JP6368993B2 (ja) * | 2013-07-24 | 2018-08-08 | 株式会社ニコン | 撮像装置 |
JP6397281B2 (ja) * | 2013-10-23 | 2018-09-26 | キヤノン株式会社 | 撮像装置、その制御方法およびプログラム |
JP6458343B2 (ja) * | 2014-02-27 | 2019-01-30 | 株式会社ニコン | 撮像装置 |
JP6408372B2 (ja) * | 2014-03-31 | 2018-10-17 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及びその駆動制御方法、並びに、電子機器 |
JP2016058559A (ja) * | 2014-09-10 | 2016-04-21 | ソニー株式会社 | 固体撮像装置およびその駆動方法、並びに電子機器 |
US9967501B2 (en) | 2014-10-08 | 2018-05-08 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device |
WO2016147837A1 (ja) * | 2015-03-13 | 2016-09-22 | ソニー株式会社 | 固体撮像素子、駆動方法、および電子機器 |
JP6541503B2 (ja) * | 2015-08-11 | 2019-07-10 | キヤノン株式会社 | 撮像装置、画像処理装置、画像処理方法およびプログラム |
JPWO2017119477A1 (ja) * | 2016-01-08 | 2018-11-22 | 株式会社ニコン | 撮像素子および撮像装置 |
JP6782431B2 (ja) | 2016-01-22 | 2020-11-11 | パナソニックIpマネジメント株式会社 | 撮像装置 |
CN112788224B (zh) | 2016-01-29 | 2023-04-04 | 松下知识产权经营株式会社 | 摄像装置 |
CN109788891A (zh) * | 2016-10-21 | 2019-05-21 | 奥林巴斯株式会社 | 内窥镜镜体、内窥镜处理器和内窥镜用适配器 |
US10714520B1 (en) * | 2017-08-04 | 2020-07-14 | Facebook Technologies, Llc | Manufacturing an on-chip microlens array |
US11120082B2 (en) | 2018-04-18 | 2021-09-14 | Oracle International Corporation | Efficient, in-memory, relational representation for heterogeneous graphs |
JP6766095B2 (ja) * | 2018-06-08 | 2020-10-07 | キヤノン株式会社 | 撮像装置、撮像システム、移動体、および積層用の半導体基板 |
US11641519B2 (en) * | 2018-07-20 | 2023-05-02 | Nikon Corporation | Focus detection device, imaging device, and interchangeable lens |
CN109905681B (zh) * | 2019-02-01 | 2021-07-16 | 华为技术有限公司 | 图像传感器、从其获取图像数据的方法及摄像设备 |
EP4117282A4 (en) * | 2020-03-06 | 2023-04-05 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | IMAGE SENSOR, IMAGING APPARATUS, ELECTRONIC DEVICE, IMAGE PROCESSING SYSTEM AND SIGNAL PROCESSING METHOD |
CN111464733B (zh) * | 2020-05-22 | 2021-10-01 | Oppo广东移动通信有限公司 | 控制方法、摄像头组件和移动终端 |
JP7474129B2 (ja) | 2020-06-22 | 2024-04-24 | キヤノン株式会社 | 撮像素子、撮像装置、及び焦点検出方法 |
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-
2013
- 2013-03-29 US US14/389,626 patent/US9826183B2/en active Active
- 2013-03-29 JP JP2014508109A patent/JP6264284B2/ja active Active
- 2013-03-29 EP EP13767811.6A patent/EP2835965B1/en active Active
- 2013-03-29 WO PCT/JP2013/059621 patent/WO2013147198A1/ja active Application Filing
- 2013-03-29 CN CN202010418828.4A patent/CN111711746A/zh active Pending
- 2013-03-29 CN CN201380017868.6A patent/CN104205808B/zh active Active
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2017
- 2017-09-06 JP JP2017171144A patent/JP6536642B2/ja active Active
- 2017-10-26 US US15/794,710 patent/US10389959B2/en active Active
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2019
- 2019-05-02 US US16/401,436 patent/US20190260951A1/en not_active Abandoned
- 2019-06-06 JP JP2019106431A patent/JP7001080B2/ja active Active
-
2021
- 2021-07-28 US US17/387,390 patent/US20210358981A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6958862B1 (en) * | 2003-04-21 | 2005-10-25 | Foveon, Inc. | Use of a lenslet array with a vertically stacked pixel array |
CN1816915A (zh) * | 2003-05-08 | 2006-08-09 | 微米技术有限公司 | 用于图像传感器或显示单元的多微透镜系统 |
JP2007317951A (ja) * | 2006-05-26 | 2007-12-06 | Nikon Corp | 光検出素子および撮像装置 |
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US20190260951A1 (en) | 2019-08-22 |
WO2013147198A1 (ja) | 2013-10-03 |
JP6264284B2 (ja) | 2018-01-24 |
EP2835965B1 (en) | 2017-05-03 |
JP2018029342A (ja) | 2018-02-22 |
JP7001080B2 (ja) | 2022-01-19 |
CN111711746A (zh) | 2020-09-25 |
EP2835965A1 (en) | 2015-02-11 |
US20180048837A1 (en) | 2018-02-15 |
EP2835965A4 (en) | 2015-12-09 |
JP2019193280A (ja) | 2019-10-31 |
JP6536642B2 (ja) | 2019-07-03 |
JPWO2013147198A1 (ja) | 2015-12-14 |
US20150222833A1 (en) | 2015-08-06 |
US9826183B2 (en) | 2017-11-21 |
US20210358981A1 (en) | 2021-11-18 |
US10389959B2 (en) | 2019-08-20 |
CN104205808A (zh) | 2014-12-10 |
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