CN104169463B - 铜膜形成用组合物及使用该组合物的铜膜的制造方法 - Google Patents

铜膜形成用组合物及使用该组合物的铜膜的制造方法 Download PDF

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Publication number
CN104169463B
CN104169463B CN201380014674.0A CN201380014674A CN104169463B CN 104169463 B CN104169463 B CN 104169463B CN 201380014674 A CN201380014674 A CN 201380014674A CN 104169463 B CN104169463 B CN 104169463B
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China
Prior art keywords
copper
copper film
composition
compound
mole
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Chinese (zh)
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CN104169463A (zh
Inventor
阿部彻司
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Adeka Corp
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Adeka Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Chemically Coating (AREA)
  • Paints Or Removers (AREA)
CN201380014674.0A 2012-03-16 2013-02-21 铜膜形成用组合物及使用该组合物的铜膜的制造方法 Active CN104169463B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-060536 2012-03-16
JP2012060536A JP5923351B2 (ja) 2012-03-16 2012-03-16 銅膜形成用組成物及び該組成物を用いた銅膜の製造方法
PCT/JP2013/054299 WO2013136937A1 (ja) 2012-03-16 2013-02-21 銅膜形成用組成物及び該組成物を用いた銅膜の製造方法

Publications (2)

Publication Number Publication Date
CN104169463A CN104169463A (zh) 2014-11-26
CN104169463B true CN104169463B (zh) 2016-08-31

Family

ID=49160855

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380014674.0A Active CN104169463B (zh) 2012-03-16 2013-02-21 铜膜形成用组合物及使用该组合物的铜膜的制造方法

Country Status (7)

Country Link
US (1) US9028599B2 (enExample)
EP (1) EP2826885A4 (enExample)
JP (1) JP5923351B2 (enExample)
KR (1) KR101605650B1 (enExample)
CN (1) CN104169463B (enExample)
TW (1) TWI570097B (enExample)
WO (1) WO2013136937A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015045932A1 (ja) * 2013-09-30 2017-03-09 新日鉄住金化学株式会社 銅薄膜形成組成物
JP6100178B2 (ja) * 2014-01-06 2017-03-22 四国化成工業株式会社 銅被膜形成剤および銅被膜の形成方法
JP6254025B2 (ja) * 2014-03-12 2017-12-27 株式会社Adeka 銅膜形成用組成物及びそれを用いた銅膜の製造方法
JP6387280B2 (ja) * 2014-10-03 2018-09-05 株式会社Adeka 銅膜形成用組成物及びそれを用いた銅膜の製造方法
JP6387282B2 (ja) * 2014-10-10 2018-09-05 株式会社Adeka 銅膜形成用組成物及びそれを用いた銅膜の製造方法
CN107614481B (zh) * 2015-06-11 2021-05-07 加拿大国家研究委员会 高导电性铜膜的制备
TWI842668B (zh) 2017-02-08 2024-05-21 加拿大國家研究委員會 具低黏度與低加工溫度之銀分子油墨
TWI874294B (zh) 2017-02-08 2025-03-01 加拿大國家研究委員會 可印刷分子油墨
TW201842087A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 具改良之熱穩定性的分子油墨
TWI856947B (zh) * 2017-08-01 2024-10-01 加拿大國家研究委員會 銅墨水
US11891532B2 (en) 2017-12-22 2024-02-06 National Research Council Of Canada Copper ink for high conductivity fine printing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1908240A (zh) * 2005-07-08 2007-02-07 罗门哈斯电子材料有限公司 镀敷方法
US20080178761A1 (en) * 2007-01-26 2008-07-31 Konica Minolta Holdings, Inc. Method of forming metal pattern, and metal salt mixture
JP2009256218A (ja) * 2008-04-14 2009-11-05 Toray Ind Inc 銅前駆体組成物およびそれを用いた銅膜の製造方法。
JP2010242118A (ja) * 2009-04-01 2010-10-28 Adeka Corp 銅薄膜形成用組成物および該組成物を用いた銅薄膜の製造方法
CN102605355A (zh) * 2012-02-21 2012-07-25 北京化工大学 基材表面的铜膜、其制备方法及应用

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960010822B1 (ko) 1987-12-24 1996-08-09 미쓰비시 가스 가가꾸 가부시끼가이샤 구리 필름 발포체의 제조방법
JPH01168865A (ja) 1987-12-24 1989-07-04 Mitsubishi Gas Chem Co Inc 銅膜形成物品の製造法
JPH01168868A (ja) 1987-12-24 1989-07-04 Mitsubishi Gas Chem Co Inc 銅膜形成物品の製造法
JPH01168867A (ja) 1987-12-24 1989-07-04 Mitsubishi Gas Chem Co Inc 銅膜形成物品の製造法
JPH01168866A (ja) 1987-12-24 1989-07-04 Mitsubishi Gas Chem Co Inc 銅膜形成物品の製造法
DE4210400C1 (en) * 1992-03-30 1993-01-07 Siemens Ag, 8000 Muenchen, De Local copper@ deposition from organo:metallic film on substrate - by forming film from mixt. of copper acetate and copper formate in specified ratio and depositing film by laser irradiation
JP4063475B2 (ja) * 1999-11-10 2008-03-19 メック株式会社 銅または銅合金のエッチング剤
JP2004162110A (ja) * 2002-11-12 2004-06-10 Mitsubishi Paper Mills Ltd 銅／アミン組成物
WO2005092519A1 (ja) * 2004-03-29 2005-10-06 Nippon Paint Co., Ltd. 光輝性塗膜形成方法および光輝性塗装物
JP4631338B2 (ja) * 2004-07-23 2011-02-16 トヨタ自動車株式会社 クランプ
JP4852272B2 (ja) 2005-07-25 2012-01-11 ナミックス株式会社 金属ペースト
JP5121196B2 (ja) * 2006-09-15 2013-01-16 株式会社Ａｄｅｋａ 金属アルコキシド化合物、薄膜形成用原料及び薄膜の製造方法
JP5521207B2 (ja) * 2009-01-28 2014-06-11 東ソー株式会社 導電膜形成用組成物及びその製造方法、並びに導電膜の形成方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1908240A (zh) * 2005-07-08 2007-02-07 罗门哈斯电子材料有限公司 镀敷方法
US20080178761A1 (en) * 2007-01-26 2008-07-31 Konica Minolta Holdings, Inc. Method of forming metal pattern, and metal salt mixture
JP2009256218A (ja) * 2008-04-14 2009-11-05 Toray Ind Inc 銅前駆体組成物およびそれを用いた銅膜の製造方法。
JP2010242118A (ja) * 2009-04-01 2010-10-28 Adeka Corp 銅薄膜形成用組成物および該組成物を用いた銅薄膜の製造方法
CN102605355A (zh) * 2012-02-21 2012-07-25 北京化工大学 基材表面的铜膜、其制备方法及应用

Also Published As

Publication number Publication date
US20140349017A1 (en) 2014-11-27
TW201348184A (zh) 2013-12-01
JP2013194257A (ja) 2013-09-30
JP5923351B2 (ja) 2016-05-24
EP2826885A4 (en) 2015-10-21
EP2826885A1 (en) 2015-01-21
CN104169463A (zh) 2014-11-26
US9028599B2 (en) 2015-05-12
KR20140134320A (ko) 2014-11-21
TWI570097B (zh) 2017-02-11
WO2013136937A1 (ja) 2013-09-19
KR101605650B1 (ko) 2016-03-22

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