CN104144964B - 用于绝缘应用的与官能硅烷相容的环氧组合物 - Google Patents

用于绝缘应用的与官能硅烷相容的环氧组合物 Download PDF

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Publication number
CN104144964B
CN104144964B CN201180076218.XA CN201180076218A CN104144964B CN 104144964 B CN104144964 B CN 104144964B CN 201180076218 A CN201180076218 A CN 201180076218A CN 104144964 B CN104144964 B CN 104144964B
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epoxy
group
anhydride
hydroxyl
groups
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Chinese (zh)
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CN104144964A (zh
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T.T.修
李永江
陈红宇
Y.W.章
吉明磊
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Dow Global Technologies LLC
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Dow Global Technologies LLC
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0803—Compounds with Si-C or Si-Si linkages
    • C07F7/081—Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201180076218.XA 2011-12-30 2011-12-30 用于绝缘应用的与官能硅烷相容的环氧组合物 Active CN104144964B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/085080 WO2013097197A1 (en) 2011-12-30 2011-12-30 Functional silane-compatibilized epoxy compositions for insulation applications

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CN104144964A CN104144964A (zh) 2014-11-12
CN104144964B true CN104144964B (zh) 2016-11-09

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US (1) US9127116B2 (enExample)
EP (1) EP2797980B1 (enExample)
CN (1) CN104144964B (enExample)
BR (1) BR112014015810A8 (enExample)
IN (1) IN2014CN04854A (enExample)
PL (1) PL2797980T3 (enExample)
WO (1) WO2013097197A1 (enExample)

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US20150344698A1 (en) * 2014-06-03 2015-12-03 Corning Incorporated Adhesion primer for glass and ceramics
CN104151681B (zh) * 2014-08-29 2017-01-11 上海至正道化高分子材料股份有限公司 一种高耐电痕adss光缆护套料
GB2545585B (en) * 2014-12-10 2021-11-17 Halliburton Energy Services Inc Curable composition and resin for treatment of a subterranean formation
JP6779476B2 (ja) * 2015-03-19 2020-11-04 ナガセケムテックス株式会社 屋外電気絶縁用エポキシ樹脂組成物及び屋外電気絶縁用部材
CN106317894B (zh) * 2015-06-30 2019-03-29 比亚迪股份有限公司 有机硅组合物、反光涂层及其制备方法与包括其的光伏组件
TWI557177B (zh) 2015-12-16 2016-11-11 財團法人工業技術研究院 低介電無溶劑型樹脂組成物及基板結構
JP7218604B2 (ja) * 2018-02-26 2023-02-07 三菱ケミカル株式会社 エポキシ基含有ポリオルガノシロキサンを含む硬化性樹脂組成物及びその硬化物
US20210040348A1 (en) 2018-04-13 2021-02-11 Board Of Trustees Of Michigan State University Methods for forming omniphobic thermoset compositions and related articles
DE102018218866A1 (de) * 2018-11-06 2020-05-07 Siemens Aktiengesellschaft Elektrisches Betriebsmittel mit Isolationssystem, sowie Verfahren zur Herstellung des Isolationssystems
CN109593432A (zh) * 2018-11-24 2019-04-09 上海凯虹特种材料科技有限公司 铁红环氧铝粉防锈漆
CN110746576B (zh) * 2019-09-20 2022-10-28 宏昌电子材料股份有限公司 一种改性的环氧树脂及其制备方法
CN111234655A (zh) * 2020-03-30 2020-06-05 南通福美新材料有限公司 一种纳米微孔绝热保温材料表面超疏水处理方法
CN117683412B (zh) * 2024-02-04 2024-04-19 湖南旗滨光能科技有限公司 一种无氟自清洁涂层及其制备方法与应用

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US20020142167A1 (en) * 2001-01-29 2002-10-03 Ube Industries, Ltd. Underfill material for COF mounting and electronic components

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US5212218A (en) 1991-10-15 1993-05-18 A. B. Chance Company Hydrophobic, erodiable synthetic resin composition for electrical insulators
US5755608A (en) 1996-07-18 1998-05-26 Connector Set Limited Partnership Top spindle for use with construction toy
DE59812650D1 (de) 1997-08-27 2005-04-21 Huntsman Adv Mat Switzerland Hydrophobes Epoxidharzsystem
US6764616B1 (en) 1999-11-29 2004-07-20 Huntsman Advanced Materials Americas Inc. Hydrophobic epoxide resin system
JP2002020587A (ja) * 2000-07-05 2002-01-23 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
CN1670109A (zh) * 2005-05-11 2005-09-21 李洁华 一种改性环氧树脂胶粘剂及其制备方法
KR20090033226A (ko) * 2006-07-20 2009-04-01 에이비비 리써치 리미티드 경화 가능한 에폭시 수지 조성물
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Publication number Publication date
PL2797980T3 (pl) 2017-07-31
WO2013097197A1 (en) 2013-07-04
EP2797980A1 (en) 2014-11-05
EP2797980A4 (en) 2015-09-30
CN104144964A (zh) 2014-11-12
BR112014015810A2 (pt) 2017-06-13
BR112014015810A8 (pt) 2017-07-04
US20140378625A1 (en) 2014-12-25
IN2014CN04854A (enExample) 2015-09-18
EP2797980B1 (en) 2017-02-01
US9127116B2 (en) 2015-09-08

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