IN2014CN04854A - - Google Patents

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Publication number
IN2014CN04854A
IN2014CN04854A IN4854CHN2014A IN2014CN04854A IN 2014CN04854 A IN2014CN04854 A IN 2014CN04854A IN 4854CHN2014 A IN4854CHN2014 A IN 4854CHN2014A IN 2014CN04854 A IN2014CN04854 A IN 2014CN04854A
Authority
IN
India
Prior art keywords
epoxy
group
anhydride
reactive group
functional
Prior art date
Application number
Other languages
English (en)
Inventor
Tongping Tony Xiu
Young Jiang Li
Hongyu Chen
Yi Wayne Zhang
Lei Ming Ji
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of IN2014CN04854A publication Critical patent/IN2014CN04854A/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0803—Compounds with Si-C or Si-Si linkages
    • C07F7/081—Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
IN4854CHN2014 2011-12-30 2011-12-30 IN2014CN04854A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/085080 WO2013097197A1 (en) 2011-12-30 2011-12-30 Functional silane-compatibilized epoxy compositions for insulation applications

Publications (1)

Publication Number Publication Date
IN2014CN04854A true IN2014CN04854A (enExample) 2015-09-18

Family

ID=48696260

Family Applications (1)

Application Number Title Priority Date Filing Date
IN4854CHN2014 IN2014CN04854A (enExample) 2011-12-30 2011-12-30

Country Status (7)

Country Link
US (1) US9127116B2 (enExample)
EP (1) EP2797980B1 (enExample)
CN (1) CN104144964B (enExample)
BR (1) BR112014015810A8 (enExample)
IN (1) IN2014CN04854A (enExample)
PL (1) PL2797980T3 (enExample)
WO (1) WO2013097197A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150344698A1 (en) * 2014-06-03 2015-12-03 Corning Incorporated Adhesion primer for glass and ceramics
CN104151681B (zh) * 2014-08-29 2017-01-11 上海至正道化高分子材料股份有限公司 一种高耐电痕adss光缆护套料
AU2014413660B2 (en) 2014-12-10 2019-03-14 Halliburton Energy Services, Inc. Curable composition and resin for treatment of a subterranean formation
JP6779476B2 (ja) * 2015-03-19 2020-11-04 ナガセケムテックス株式会社 屋外電気絶縁用エポキシ樹脂組成物及び屋外電気絶縁用部材
CN106317894B (zh) * 2015-06-30 2019-03-29 比亚迪股份有限公司 有机硅组合物、反光涂层及其制备方法与包括其的光伏组件
TWI557177B (zh) 2015-12-16 2016-11-11 財團法人工業技術研究院 低介電無溶劑型樹脂組成物及基板結構
JP7218604B2 (ja) * 2018-02-26 2023-02-07 三菱ケミカル株式会社 エポキシ基含有ポリオルガノシロキサンを含む硬化性樹脂組成物及びその硬化物
WO2019199713A1 (en) 2018-04-13 2019-10-17 Board Of Trustees Of Michigan State University Methods for forming omniphobic thermoset compositions and related articles
DE102018218866A1 (de) * 2018-11-06 2020-05-07 Siemens Aktiengesellschaft Elektrisches Betriebsmittel mit Isolationssystem, sowie Verfahren zur Herstellung des Isolationssystems
CN109593432A (zh) * 2018-11-24 2019-04-09 上海凯虹特种材料科技有限公司 铁红环氧铝粉防锈漆
CN110746576B (zh) * 2019-09-20 2022-10-28 宏昌电子材料股份有限公司 一种改性的环氧树脂及其制备方法
CN111234655A (zh) * 2020-03-30 2020-06-05 南通福美新材料有限公司 一种纳米微孔绝热保温材料表面超疏水处理方法
CN117683412B (zh) * 2024-02-04 2024-04-19 湖南旗滨光能科技有限公司 一种无氟自清洁涂层及其制备方法与应用

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5212218A (en) 1991-10-15 1993-05-18 A. B. Chance Company Hydrophobic, erodiable synthetic resin composition for electrical insulators
US5755608A (en) 1996-07-18 1998-05-26 Connector Set Limited Partnership Top spindle for use with construction toy
EP0899304B1 (de) 1997-08-27 2005-03-16 Huntsman Advanced Materials (Switzerland) GmbH Hydrophobes Epoxidharzsystem
US6764616B1 (en) * 1999-11-29 2004-07-20 Huntsman Advanced Materials Americas Inc. Hydrophobic epoxide resin system
JP2002020587A (ja) 2000-07-05 2002-01-23 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
KR100928124B1 (ko) 2001-01-29 2009-11-24 우베 고산 가부시키가이샤 Ｃｏｆ 실장용 언더필재 및 전자부품
CN1670109A (zh) * 2005-05-11 2005-09-21 李洁华 一种改性环氧树脂胶粘剂及其制备方法
CN101490124A (zh) * 2006-07-20 2009-07-22 Abb研究有限公司 抗病毒面罩和过滤材料
CN100577766C (zh) 2007-08-22 2010-01-06 中山大学 自催化交联型有机硅-环氧复合密封胶及其制备方法
DE602007012943D1 (de) 2007-10-08 2011-04-14 Abb Research Ltd Stem mit verbessertem tracking und erosionswiderstand
RU2010127317A (ru) 2007-12-05 2012-01-10 Коринн Джин ГРЕЙЛИНГ (ZA) Полимерный высоковольтный изолятор с твердой гидрофобной поверхностью
CN101999151A (zh) 2008-02-12 2011-03-30 Abb研究有限公司 表面改性的电绝缘系统
BRPI0924590A2 (pt) 2009-05-05 2016-08-23 Abb Research Ltd composição sol-gel curável.
CN102532809A (zh) 2011-11-17 2012-07-04 杭州师范大学 有机硅-环氧树脂组合物及其制备方法

Also Published As

Publication number Publication date
CN104144964A (zh) 2014-11-12
EP2797980A4 (en) 2015-09-30
US20140378625A1 (en) 2014-12-25
US9127116B2 (en) 2015-09-08
BR112014015810A2 (pt) 2017-06-13
BR112014015810A8 (pt) 2017-07-04
CN104144964B (zh) 2016-11-09
EP2797980A1 (en) 2014-11-05
WO2013097197A1 (en) 2013-07-04
EP2797980B1 (en) 2017-02-01
PL2797980T3 (pl) 2017-07-31

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