IN2014CN04854A - - Google Patents

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Publication number
IN2014CN04854A
IN2014CN04854A IN4854CHN2014A IN2014CN04854A IN 2014CN04854 A IN2014CN04854 A IN 2014CN04854A IN 4854CHN2014 A IN4854CHN2014 A IN 4854CHN2014A IN 2014CN04854 A IN2014CN04854 A IN 2014CN04854A
Authority
IN
India
Prior art keywords
epoxy
group
anhydride
reactive group
functional
Prior art date
Application number
Inventor
Tongping Tony Xiu
Young Jiang Li
Hongyu Chen
Yi Wayne Zhang
Lei Ming Ji
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of IN2014CN04854A publication Critical patent/IN2014CN04854A/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0803—Compounds with Si-C or Si-Si linkages
    • C07F7/081—Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Described is an epoxy composition containing: (a) an epoxy resin containing at least one epoxy group (b) an anhydride hardener (c) a hydroxyl terminated polysiloxane and (d) a functional silane having at least one functional group selected from the group consisting of an epoxy reactive group an anhydride reactive group and an epoxy and anhydride reactive group. Also describing a crosslinked epoxy composition and a method for preparing thereof.
IN4854CHN2014 2011-12-30 2011-12-30 IN2014CN04854A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/085080 WO2013097197A1 (en) 2011-12-30 2011-12-30 Functional silane-compatibilized epoxy compositions for insulation applications

Publications (1)

Publication Number Publication Date
IN2014CN04854A true IN2014CN04854A (en) 2015-09-18

Family

ID=48696260

Family Applications (1)

Application Number Title Priority Date Filing Date
IN4854CHN2014 IN2014CN04854A (en) 2011-12-30 2011-12-30

Country Status (7)

Country Link
US (1) US9127116B2 (en)
EP (1) EP2797980B1 (en)
CN (1) CN104144964B (en)
BR (1) BR112014015810A8 (en)
IN (1) IN2014CN04854A (en)
PL (1) PL2797980T3 (en)
WO (1) WO2013097197A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150344698A1 (en) * 2014-06-03 2015-12-03 Corning Incorporated Adhesion primer for glass and ceramics
CN104151681B (en) * 2014-08-29 2017-01-11 上海至正道化高分子材料股份有限公司 High-tracking-resistant ADSS (all dielectric self-supporting) optical cable jacket material
CA3017221A1 (en) * 2014-12-10 2016-06-16 Halliburton Energy Services, Inc. Curable composition and resin for treatment of a subterranean formation
JP6779476B2 (en) * 2015-03-19 2020-11-04 ナガセケムテックス株式会社 Epoxy resin composition for outdoor electrical insulation and member for outdoor electrical insulation
CN106317894B (en) * 2015-06-30 2019-03-29 比亚迪股份有限公司 Silicon composition, reflecting coating and preparation method thereof and the photovoltaic module including it
TWI557177B (en) 2015-12-16 2016-11-11 財團法人工業技術研究院 Low dielectric constant and solventless resin composition and substrate structure
JP7218604B2 (en) * 2018-02-26 2023-02-07 三菱ケミカル株式会社 Curable resin composition containing epoxy group-containing polyorganosiloxane and cured product thereof
DE102018218866A1 (en) * 2018-11-06 2020-05-07 Siemens Aktiengesellschaft Electrical equipment with insulation system, as well as method for manufacturing the insulation system
CN109593432A (en) * 2018-11-24 2019-04-09 上海凯虹特种材料科技有限公司 Iron oxide red epoxy aluminium antirust paint
CN110746576B (en) * 2019-09-20 2022-10-28 宏昌电子材料股份有限公司 Modified epoxy resin and preparation method thereof
CN111234655A (en) * 2020-03-30 2020-06-05 南通福美新材料有限公司 Super-hydrophobic treatment method for surface of nano microporous heat insulation material
CN117683412B (en) * 2024-02-04 2024-04-19 湖南旗滨光能科技有限公司 Fluorine-free self-cleaning coating and preparation method and application thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5212218A (en) 1991-10-15 1993-05-18 A. B. Chance Company Hydrophobic, erodiable synthetic resin composition for electrical insulators
US5755608A (en) 1996-07-18 1998-05-26 Connector Set Limited Partnership Top spindle for use with construction toy
EP0899304B1 (en) 1997-08-27 2005-03-16 Huntsman Advanced Materials (Switzerland) GmbH Hydrophobic epoxy resin composition
US6764616B1 (en) 1999-11-29 2004-07-20 Huntsman Advanced Materials Americas Inc. Hydrophobic epoxide resin system
JP2002020587A (en) * 2000-07-05 2002-01-23 Shin Etsu Chem Co Ltd Epoxy resin composition
TWI229929B (en) * 2001-01-29 2005-03-21 Ube Industries Underfill material for COF mounting and electronic components
CN1670109A (en) * 2005-05-11 2005-09-21 李洁华 Modified epoxy resin adhesive and its preparation process
KR20090033226A (en) * 2006-07-20 2009-04-01 에이비비 리써치 리미티드 Hardenable epoxy resin composition
CN100577766C (en) * 2007-08-22 2010-01-06 中山大学 Autocatalysis cross-linking organosilicon-epoxide compound seal glue and method for making same
ATE500597T1 (en) 2007-10-08 2011-03-15 Abb Research Ltd SURFACE MODIFIED ELECTRICAL INSULATION SYSTEM WITH IMPROVED TRACKING AND EROSION RESISTANCE
WO2009073901A2 (en) 2007-12-05 2009-06-11 Corrine Jean Greyling A polymeric high voltage insulator with a hard, hydrophobic surface
EP2243142A1 (en) 2008-02-12 2010-10-27 ABB Research Ltd. Surface modified electrical insulation system
CN102421835A (en) 2009-05-05 2012-04-18 Abb研究有限公司 Curable sol-gel composition
CN102532809A (en) * 2011-11-17 2012-07-04 杭州师范大学 Organosilicon-epoxy resin composition and preparation method thereof

Also Published As

Publication number Publication date
BR112014015810A8 (en) 2017-07-04
US9127116B2 (en) 2015-09-08
EP2797980A1 (en) 2014-11-05
EP2797980A4 (en) 2015-09-30
US20140378625A1 (en) 2014-12-25
EP2797980B1 (en) 2017-02-01
PL2797980T3 (en) 2017-07-31
BR112014015810A2 (en) 2017-06-13
CN104144964B (en) 2016-11-09
CN104144964A (en) 2014-11-12
WO2013097197A1 (en) 2013-07-04

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