CN104124940B - 压电器件 - Google Patents
压电器件 Download PDFInfo
- Publication number
- CN104124940B CN104124940B CN201410356066.4A CN201410356066A CN104124940B CN 104124940 B CN104124940 B CN 104124940B CN 201410356066 A CN201410356066 A CN 201410356066A CN 104124940 B CN104124940 B CN 104124940B
- Authority
- CN
- China
- Prior art keywords
- thermistor element
- recess
- pair
- piezoelectric
- piezoelectric vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/32—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using change of resonant frequency of a crystal
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
- H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-074976 | 2010-03-29 | ||
JP2010074976A JP5101651B2 (ja) | 2010-03-29 | 2010-03-29 | 圧電振動子 |
JP2010-222311 | 2010-09-30 | ||
JP2010222311A JP5144732B2 (ja) | 2010-09-30 | 2010-09-30 | 圧電振動子 |
JP2010222307A JP5144731B2 (ja) | 2010-09-30 | 2010-09-30 | 圧電振動子 |
JP2010-222307 | 2010-09-30 | ||
JP2010-267448 | 2010-11-30 | ||
JP2010267448A JP5210369B2 (ja) | 2010-11-30 | 2010-11-30 | 圧電デバイス |
JP2010-292323 | 2010-12-28 | ||
JP2010292323A JP5337791B2 (ja) | 2010-12-28 | 2010-12-28 | 圧電振動子 |
CN201110084990.8A CN102270963B (zh) | 2010-03-29 | 2011-03-28 | 压电器件 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110084990.8A Division CN102270963B (zh) | 2010-03-29 | 2011-03-28 | 压电器件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104124940A CN104124940A (zh) | 2014-10-29 |
CN104124940B true CN104124940B (zh) | 2018-04-06 |
Family
ID=44655564
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410356066.4A Active CN104124940B (zh) | 2010-03-29 | 2011-03-28 | 压电器件 |
CN201110084990.8A Active CN102270963B (zh) | 2010-03-29 | 2011-03-28 | 压电器件 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110084990.8A Active CN102270963B (zh) | 2010-03-29 | 2011-03-28 | 压电器件 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8749123B2 (zh) |
CN (2) | CN104124940B (zh) |
TW (2) | TWI548204B (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9252782B2 (en) | 2011-02-14 | 2016-02-02 | Qualcomm Incorporated | Wireless chipset with a non-temperature compensated crystal reference |
JP5747574B2 (ja) | 2011-03-11 | 2015-07-15 | セイコーエプソン株式会社 | 圧電デバイス及び電子機器 |
JP2013146003A (ja) * | 2012-01-16 | 2013-07-25 | Seiko Epson Corp | 振動デバイス及び電子機器 |
KR102015565B1 (ko) | 2012-06-04 | 2019-08-28 | 삼성전자주식회사 | 전자 장치 및 그것의 온도 제어 방법 |
JP6175743B2 (ja) | 2012-06-06 | 2017-08-09 | セイコーエプソン株式会社 | 振動素子の製造方法 |
WO2014077278A1 (ja) * | 2012-11-16 | 2014-05-22 | 株式会社 大真空 | 圧電振動デバイス |
JP2014107778A (ja) | 2012-11-29 | 2014-06-09 | Seiko Epson Corp | 振動デバイス、電子機器及び移動体 |
JP6183156B2 (ja) | 2013-10-30 | 2017-08-23 | セイコーエプソン株式会社 | パッケージ、振動デバイス、発振器、電子機器及び移動体 |
US10103709B2 (en) * | 2013-11-05 | 2018-10-16 | Kyocera Corporation | Crystal unit |
JP2015128276A (ja) * | 2013-11-29 | 2015-07-09 | 日本電波工業株式会社 | 表面実装水晶振動子及びその製造方法 |
US9392695B2 (en) * | 2014-01-03 | 2016-07-12 | Samsung Electro-Mechanics Co., Ltd. | Electric component module |
JP6644457B2 (ja) * | 2014-03-26 | 2020-02-12 | Tdk株式会社 | 圧電デバイス |
US20160027989A1 (en) * | 2014-07-24 | 2016-01-28 | Mide Technology Corporation | Robust piezoelectric fluid moving devices and methods |
JP6618675B2 (ja) * | 2014-07-30 | 2019-12-11 | セイコーエプソン株式会社 | 振動デバイス、電子機器及び移動体 |
USD760230S1 (en) | 2014-09-16 | 2016-06-28 | Daishinku Corporation | Piezoelectric vibration device |
CN104283524B (zh) * | 2014-10-22 | 2017-07-14 | 应达利电子股份有限公司 | 一种压电石英晶体谐振器及其制作方法 |
JP2016127467A (ja) * | 2015-01-06 | 2016-07-11 | セイコーエプソン株式会社 | 振動デバイス、電子機器及び移動体 |
CN105989703A (zh) * | 2015-02-10 | 2016-10-05 | 启碁科技股份有限公司 | 无线感测装置 |
CN107533082A (zh) * | 2015-03-12 | 2018-01-02 | 株式会社村田制作所 | 加速度检测装置及其制造方法 |
TWI620920B (zh) * | 2015-09-23 | 2018-04-11 | 中原大學 | 多軸向壓電應力感測元件、多軸向壓電應力感測元件極化之方法及其壓電感應偵測系統 |
US10600953B2 (en) * | 2015-11-06 | 2020-03-24 | Daishinku Corporation | Piezoelectric resonator device |
JP6617891B2 (ja) * | 2015-12-21 | 2019-12-11 | 株式会社村田製作所 | 共振子及び共振装置 |
CN106908165A (zh) * | 2015-12-23 | 2017-06-30 | 康铂创想(北京)科技有限公司 | 利用热敏电阻测量温度的方法和装置 |
JP2017183808A (ja) * | 2016-03-28 | 2017-10-05 | 京セラ株式会社 | 水晶素子および水晶デバイス |
JP6372631B1 (ja) * | 2016-10-20 | 2018-08-15 | 株式会社村田製作所 | 圧電振動子 |
CN111342797A (zh) * | 2018-12-18 | 2020-06-26 | 天津大学 | 压电滤波器及具有其的电子设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0998024A (ja) * | 1995-09-28 | 1997-04-08 | Daishinku Co | 水晶振動子モジュール |
CN1533031A (zh) * | 2003-03-20 | 2004-09-29 | 精工爱普生株式会社 | 压电振子 |
CN1705224A (zh) * | 2004-06-03 | 2005-12-07 | 精工爱普生株式会社 | 压电振荡器和电子设备 |
JP2006339943A (ja) * | 2005-06-01 | 2006-12-14 | Seiko Epson Corp | 圧電デバイス |
JP2007036808A (ja) * | 2005-07-28 | 2007-02-08 | Kyocera Kinseki Corp | 圧電発振器 |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2562349B1 (fr) * | 1984-03-27 | 1986-06-27 | Cepe | Oscillateur piezo-electrique fonctionnant en mode aperiodique |
JPH07106903A (ja) | 1993-09-30 | 1995-04-21 | Kinseki Ltd | 圧電振動子 |
JP3501516B2 (ja) | 1994-09-08 | 2004-03-02 | 株式会社大真空 | 表面実装型圧電発振器およびその製造方法 |
US5500628A (en) | 1995-01-24 | 1996-03-19 | Motorola, Inc. | Double-sided oscillator package and method of coupling components thereto |
US5747982A (en) * | 1996-12-05 | 1998-05-05 | Lucent Technologies Inc. | Multi-chip modules with isolated coupling between modules |
JP3130830B2 (ja) | 1997-05-16 | 2001-01-31 | 日本電気株式会社 | チップ部品複合圧電デバイス |
JP3926001B2 (ja) | 1997-09-26 | 2007-06-06 | シチズン電子株式会社 | 圧電振動子とその製造方法 |
WO1999037018A1 (fr) * | 1998-01-20 | 1999-07-22 | Toyo Communication Equipment Co., Ltd. | Oscillateur piezo-electrique |
JP3285847B2 (ja) | 1998-08-31 | 2002-05-27 | 京セラ株式会社 | 表面実装型水晶発振器 |
US6229249B1 (en) * | 1998-08-31 | 2001-05-08 | Kyocera Corporation | Surface-mount type crystal oscillator |
JP2001077627A (ja) | 1999-09-02 | 2001-03-23 | Toyo Commun Equip Co Ltd | 温度補償圧電発振器 |
JP2001127579A (ja) | 1999-10-25 | 2001-05-11 | Toyo Commun Equip Co Ltd | 圧電振動子及び、これを用いた圧電発振器 |
JP2001177345A (ja) * | 1999-12-15 | 2001-06-29 | Murata Mfg Co Ltd | 圧電発振器 |
US6326858B1 (en) * | 2000-07-17 | 2001-12-04 | National Semiconductor Corporation | Oscillator circuit with thermal feedback |
JP2002076775A (ja) | 2000-08-25 | 2002-03-15 | Nippon Dempa Kogyo Co Ltd | 表面実装用水晶発振器 |
US6824307B2 (en) * | 2000-12-12 | 2004-11-30 | Harris Corporation | Temperature sensor and related methods |
JP2002217645A (ja) | 2001-01-22 | 2002-08-02 | Daishinku Corp | 表面実装型圧電発振器 |
JP2004343338A (ja) | 2003-05-14 | 2004-12-02 | Tokyo Denpa Co Ltd | 水晶振動子 |
JP2005020546A (ja) | 2003-06-27 | 2005-01-20 | Kyocera Corp | 表面実装型水晶発振器 |
JP2005286892A (ja) | 2004-03-30 | 2005-10-13 | Kyocera Kinseki Corp | 温度センサーを内蔵した圧電振動子、及びそれを用いた圧電発振器 |
JP2006042278A (ja) | 2004-07-30 | 2006-02-09 | Kyocera Kinseki Corp | 圧電発振器及びその製造方法 |
JP4344942B2 (ja) * | 2004-12-28 | 2009-10-14 | セイコーエプソン株式会社 | インクジェット式記録ヘッドおよび圧電アクチュエーター |
US20070024161A1 (en) * | 2005-07-26 | 2007-02-01 | Seiko Epson Corporation | Piezoelectric device and method of manufacturing piezoelectric device |
JP2007043338A (ja) * | 2005-08-01 | 2007-02-15 | Epson Toyocom Corp | 温度補償水晶振動子、水晶発振器、及び温度補償水晶振動子の製造方法 |
JP2007189378A (ja) | 2006-01-12 | 2007-07-26 | Epson Toyocom Corp | 圧電デバイスおよび圧電デバイスの製造方法 |
JP5339681B2 (ja) * | 2007-02-21 | 2013-11-13 | 日本電波工業株式会社 | 表面実装用の水晶振動子 |
JP2008263564A (ja) | 2007-04-16 | 2008-10-30 | Kyocera Kinseki Corp | 温度補償型圧電発振器 |
JP2008278110A (ja) | 2007-04-27 | 2008-11-13 | Kyocera Kinseki Corp | 圧電発振器 |
JP2009060335A (ja) | 2007-08-31 | 2009-03-19 | Epson Toyocom Corp | 圧電デバイス |
JP2008187751A (ja) | 2008-05-07 | 2008-08-14 | Kyocera Corp | 表面実装型圧電発振器 |
JP2010035077A (ja) | 2008-07-31 | 2010-02-12 | Kyocera Kinseki Corp | 圧電発振器 |
CN102197588A (zh) * | 2008-08-27 | 2011-09-21 | 精工电子有限公司 | 压电振动器、振荡器、电子设备和电波钟以及压电振动器的制造方法 |
JP2010118979A (ja) | 2008-11-14 | 2010-05-27 | Nippon Dempa Kogyo Co Ltd | 温度検出型の表面実装用水晶振動子及びセット基板に対する実装方法 |
-
2011
- 2011-03-22 TW TW103129807A patent/TWI548204B/zh active
- 2011-03-22 TW TW100109669A patent/TWI466437B/zh active
- 2011-03-28 CN CN201410356066.4A patent/CN104124940B/zh active Active
- 2011-03-28 CN CN201110084990.8A patent/CN102270963B/zh active Active
- 2011-03-29 US US13/074,672 patent/US8749123B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0998024A (ja) * | 1995-09-28 | 1997-04-08 | Daishinku Co | 水晶振動子モジュール |
CN1533031A (zh) * | 2003-03-20 | 2004-09-29 | 精工爱普生株式会社 | 压电振子 |
CN1705224A (zh) * | 2004-06-03 | 2005-12-07 | 精工爱普生株式会社 | 压电振荡器和电子设备 |
JP2006339943A (ja) * | 2005-06-01 | 2006-12-14 | Seiko Epson Corp | 圧電デバイス |
JP2007036808A (ja) * | 2005-07-28 | 2007-02-08 | Kyocera Kinseki Corp | 圧電発振器 |
Also Published As
Publication number | Publication date |
---|---|
CN102270963A (zh) | 2011-12-07 |
CN104124940A (zh) | 2014-10-29 |
TWI466437B (zh) | 2014-12-21 |
US8749123B2 (en) | 2014-06-10 |
TW201448452A (zh) | 2014-12-16 |
CN102270963B (zh) | 2015-04-22 |
US20110234047A1 (en) | 2011-09-29 |
TW201201505A (en) | 2012-01-01 |
TWI548204B (zh) | 2016-09-01 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Chiba County, Japan Applicant after: KYOCERA Corp. Address before: Kyoto City Applicant before: KYOCERA Corp. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170815 Address after: Kyoto City Applicant after: KYOCERA Corp. Address before: Tokyo, Japan Applicant before: KINSEKI LTD. |
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CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Kyoto City Applicant after: KYOCERA Corp. Address before: Chiba County, Japan Applicant before: KYOCERA Corp. |
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