CN104124319B - 发光装置 - Google Patents

发光装置 Download PDF

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Publication number
CN104124319B
CN104124319B CN201410171732.7A CN201410171732A CN104124319B CN 104124319 B CN104124319 B CN 104124319B CN 201410171732 A CN201410171732 A CN 201410171732A CN 104124319 B CN104124319 B CN 104124319B
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type semiconductor
semiconductor layer
connection electrode
wire
electrode
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CN201410171732.7A
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Chinese (zh)
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CN104124319A (zh
Inventor
米田章法
木内章喜
笠井久嗣
粟饭原善之
佐佐博凡
中村伸治
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Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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    • H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
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    • H10P72/7434—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
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    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
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CN201410171732.7A 2013-04-26 2014-04-25 发光装置 Active CN104124319B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013-094235 2013-04-26
JP2013094235 2013-04-26
JP2014057970A JP6273945B2 (ja) 2013-04-26 2014-03-20 発光装置
JP2014-057970 2014-03-20

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CN104124319A CN104124319A (zh) 2014-10-29
CN104124319B true CN104124319B (zh) 2018-01-02

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US (3) US9093612B2 (https=)
EP (1) EP2797131B1 (https=)
JP (1) JP6273945B2 (https=)
KR (1) KR102120268B1 (https=)
CN (1) CN104124319B (https=)
BR (1) BR102014009947B1 (https=)
IN (1) IN2014CH02110A (https=)
TW (1) TWI599080B (https=)

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JP6273945B2 (ja) * 2013-04-26 2018-02-07 日亜化学工業株式会社 発光装置
JP6354273B2 (ja) 2014-04-10 2018-07-11 日亜化学工業株式会社 発光装置及び発光装置の製造方法
US9978724B2 (en) 2014-06-27 2018-05-22 Bridgelux, Inc. Red flip chip light emitting diode, package, and method of making the same
JP6384202B2 (ja) * 2014-08-28 2018-09-05 日亜化学工業株式会社 発光装置の製造方法
US9842831B2 (en) 2015-05-14 2017-12-12 Mediatek Inc. Semiconductor package and fabrication method thereof
US10685943B2 (en) 2015-05-14 2020-06-16 Mediatek Inc. Semiconductor chip package with resilient conductive paste post and fabrication method thereof
JP6471641B2 (ja) 2015-08-04 2019-02-20 日亜化学工業株式会社 発光装置の製造方法
JP6717324B2 (ja) 2018-02-27 2020-07-01 日亜化学工業株式会社 発光素子
JP6978697B2 (ja) 2018-11-15 2021-12-08 日亜化学工業株式会社 発光装置の製造方法
JP7004948B2 (ja) 2019-04-27 2022-01-21 日亜化学工業株式会社 発光モジュールの製造方法
MX2021013719A (es) * 2019-05-14 2021-12-10 Seoul Viosys Co Ltd Paquete de chip led y metodo de manufactura del mismo.
US11672256B2 (en) * 2020-08-11 2023-06-13 EAST HAMPTON SHUCKER COMPANY, Inc. Oyster shucking clamp apparatus and method
CN116344487B (zh) * 2021-12-21 2025-07-04 长鑫存储技术有限公司 一种半导体结构及其制造方法

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CN101467267A (zh) * 2006-04-12 2009-06-24 昭和电工株式会社 发光装置及其制造方法
EP2528120A2 (en) * 2011-05-27 2012-11-28 LG Innotek Co., Ltd. Light emitting device and light emitting apparatus having the same

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