CN104124214B - 电气组件封装 - Google Patents
电气组件封装 Download PDFInfo
- Publication number
- CN104124214B CN104124214B CN201410104360.6A CN201410104360A CN104124214B CN 104124214 B CN104124214 B CN 104124214B CN 201410104360 A CN201410104360 A CN 201410104360A CN 104124214 B CN104124214 B CN 104124214B
- Authority
- CN
- China
- Prior art keywords
- lead wire
- encapsulation
- join domain
- cover plate
- connecting lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13165213.3 | 2013-04-24 | ||
EP20130165213 EP2797111A1 (en) | 2013-04-24 | 2013-04-24 | Electrical component packaging |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104124214A CN104124214A (zh) | 2014-10-29 |
CN104124214B true CN104124214B (zh) | 2017-10-10 |
Family
ID=48226977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410104360.6A Active CN104124214B (zh) | 2013-04-24 | 2014-03-20 | 电气组件封装 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9307665B2 (zh) |
EP (1) | EP2797111A1 (zh) |
CN (1) | CN104124214B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61242053A (ja) * | 1985-04-19 | 1986-10-28 | Sanyo Electric Co Ltd | 半導体装置 |
US5155299A (en) * | 1988-10-05 | 1992-10-13 | Olin Corporation | Aluminum alloy semiconductor packages |
TW390002B (en) * | 1996-02-01 | 2000-05-11 | Nippon Electric Co | Resin molded package |
CN101553918A (zh) * | 2005-10-24 | 2009-10-07 | 飞思卡尔半导体公司 | 半导体结构以及组装方法 |
CN102934225A (zh) * | 2011-02-15 | 2013-02-13 | 松下电器产业株式会社 | 半导体装置及其制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3482419A (en) * | 1966-01-03 | 1969-12-09 | Texas Instruments Inc | Process for fabricating hermetic glass seals |
US4706105A (en) | 1983-02-02 | 1987-11-10 | Hitachi, Ltd. | Semiconductor device and method of producing the same |
US4952531A (en) * | 1988-03-17 | 1990-08-28 | Olin Corporation | Sealing glass for matched sealing of copper and copper alloys |
KR19980020726A (ko) | 1996-09-11 | 1998-06-25 | 김광호 | 칩 스케일의 볼 그리드 어레이 패키지 및 그의 제조 방법 |
US7598119B2 (en) | 2007-03-12 | 2009-10-06 | Texas Instruments Incorporated | System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices |
KR101448850B1 (ko) * | 2008-02-04 | 2014-10-14 | 페어차일드코리아반도체 주식회사 | 반도체 패키지 및 그 제조방법들 |
JP5310660B2 (ja) | 2010-07-01 | 2013-10-09 | 富士電機株式会社 | 半導体装置 |
-
2013
- 2013-04-24 EP EP20130165213 patent/EP2797111A1/en not_active Withdrawn
-
2014
- 2014-03-20 CN CN201410104360.6A patent/CN104124214B/zh active Active
- 2014-04-21 US US14/257,768 patent/US9307665B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61242053A (ja) * | 1985-04-19 | 1986-10-28 | Sanyo Electric Co Ltd | 半導体装置 |
US5155299A (en) * | 1988-10-05 | 1992-10-13 | Olin Corporation | Aluminum alloy semiconductor packages |
TW390002B (en) * | 1996-02-01 | 2000-05-11 | Nippon Electric Co | Resin molded package |
CN101553918A (zh) * | 2005-10-24 | 2009-10-07 | 飞思卡尔半导体公司 | 半导体结构以及组装方法 |
CN102934225A (zh) * | 2011-02-15 | 2013-02-13 | 松下电器产业株式会社 | 半导体装置及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104124214A (zh) | 2014-10-29 |
EP2797111A1 (en) | 2014-10-29 |
US9307665B2 (en) | 2016-04-05 |
US20140318854A1 (en) | 2014-10-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20151111 Address after: Holland Ian Deho Finn Applicant after: NXP BV Address before: Holland Ian Deho Finn Applicant before: Koninkl Philips Electronics NV |
|
CB02 | Change of applicant information |
Address after: Holland Ian Deho Finn Applicant after: AMPLEON NETHERLANDS B.V. Address before: Holland Ian Deho Finn Applicant before: NXP BV |
|
COR | Change of bibliographic data | ||
CB02 | Change of applicant information |
Address after: Nijmegen Applicant after: AMPLEON NETHERLANDS B.V. Address before: Holland Ian Deho Finn Applicant before: AMPLEON NETHERLANDS B.V. |
|
COR | Change of bibliographic data | ||
GR01 | Patent grant | ||
GR01 | Patent grant |